Abstract: The present invention relates to a method for hard-fine machining of tooth flanks with corrections and/or modifications on a gear-cutting machine, wherein respective toothed wheel pairings which mesh with one another within a transmission or a test device are machined while taking account of the respective mating flanks, and wherein the tooth flanks of the relevant workpieces are provided with periodic waviness corrections or waviness modifications. In accordance with the invention, the rotational error extent is determined by means of rotational distance error measurement of the toothed wheel pairs in a gear measuring device and/or transmission. This measurement result serves as an input value for defining the amplitude, frequency and phase position for the periodic flank waviness corrections on the tooth flanks of the toothed wheel pairings for production in the gear-cutting machine.

Abstract: An abrasive article including a substrate as an elongated member, a first layer overlying the substrate, abrasive particles overlying the first layer, fillets connecting the first layer and the abrasive particles, a bonding layer overlying the abrasive particles, the first layer and the fillets, and the fillets have a fillet characteristic relative to an abrasive application, the fillet characteristic selected from the group consisting of tacking factor (tfl/tf), a fillet-to-particle factor (tf/dab), a fillet-to-bonding layer factor (tf/tbl), a contact factor (Ab/Af), a fillet size variance (Vf), and a combination thereof.

Abstract: A unibit re-sharpening device for reconditioning the surface of worn unibits by filing them in a tapered recess. The unibit re-sharpening device comprises a device housing having a tapered recess with a diamond infused file therein, with the file connected to an integrated electric motor and high frequency mechanical vibrator, with an attachable collet for securing a conventional unibit in the tapered recess. In use, a unibit is secured in the collet and the collet is placed in the tapered recess. The power switch is then turned on, causing the motor and vibrator to vibrate the file and resulting in material being cut from the cutting edge or face of the unibit by the vibrating file. While the file is vibrating, a user can rotate the unibit to expose its whole conical surface to the file, thereby sharpening the entire unibit.

Abstract: An apparatus, method, and system are disclosed for cutting materials such as concrete. The apparatus includes a mounting assembly, and a pair of blades that are mounted at an end of the mounting assembly. Various types of driving assemblies can be provided to supply the force necessary to rotate the two blades. The distance between the blades can also be varied in order to adjust the width of the cut.

Abstract: A blade cover covers a cutting blade mounted on a spindle. The blade cover has a bottom portion formed with an opening from which the lower end of the cutting blade projects. A cutting fluid is supplied to the upper surface of a workpiece in the periphery of the opening of the blade cover. A discharge opening is formed in the blade cover. Air is sucked from the discharge opening by a vacuum source. The cutting fluid supplied to the upper surface of the workpiece is taken from the opening into the blade cover in association with the rotation of the cutting blade and thereafter discharged from the discharge opening to the outside of the blade cover. Accordingly, scattering of the cutting fluid can be suppressed.

Abstract: A grinding tool includes a shank having an axis, and at least two abrasive portions mounted directly to and in contact with the shank without a hub therebetween. Each of the abrasive portions has a substantially identical profile formed therein.

Abstract: A system for use in substrate polishing includes a conditioner system for conditioning a surface of a polishing pad and a vacuum system having a vacuum port. The conditioner system includes a conditioner head constructed to receive an abrasive conditioner component. The vacuum system is configured to apply suction through the vacuum port to the surface of the polishing pad in a direction away from the surface to remove material on the surface.

Abstract: A measured characterizing value dependent on a thickness of a region of a substrate is input into a first predictive filter. The first predictive filter generates a filtered characterizing value. A measured characterizing rate at which the measured characterizing value changes is input into a second predictive filter. The second predictive filter generates a filtered characterizing rate of the region of the substrate. The measured characterizing value and the measured characterizing rate are determined based on in-situ measurements made at or before a first time during a polishing process of the substrate. A desired characterizing rate is determined to be used for polishing the region of the substrate after the first time and before a second, later time based on the filtered characterizing value and the filtered characterizing rate.

Abstract: A method of finishing glass sheets includes forming a stack comprising alternating layers of unfinished glass sheets and spacer pads. The stack is such that there is no physical contact between any two adjacent unfinished glass sheets and outer edges of the spacer pads are recessed relative to outer edges of the unfinished glass sheets. The stack is secured by clamping the unfinished glass sheets and spacer pads together and then supported on a working surface. The unfinished glass sheets of the stack are finished simultaneously while the stack is supported on the working surface. After the finishing, the stack comprises alternating layers of finished glass sheets and spacer pads.

Abstract: CMP pads having novel groove configurations are described. For example, described herein are CMP pads comprising primary grooves, secondary grooves, a groove pattern center, and an optional terminal groove. The CMP pads may be made from polyurethane or poly (urethane-urea), and the grooves produced therein may be made by a method from the group consisting of molding, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.

Abstract: A system for use in removing a multi-layer coating from a substrate is provided. The multi-layer coating includes a first coating applied to the substrate and a second coating applied over the first coating. The first coating is formed from a first material and the second coating is formed from a second material different from the first material. The system includes a grinding mechanism configured to remove the multi-layer coating from the substrate, and a controller coupled in communication with the grinding mechanism. The controller is configured to position the grinding mechanism against the multi-layer coating, initiate a first removal mode that directs the grinding mechanism to traverse across the substrate, monitor a variable operating parameter of the grinding mechanism during the first removal mode, and evaluate a value of the variable operating parameter against a predetermined threshold to determine whether the second coating has been removed from the substrate.

Abstract: A surface fine machining tool has a working medium carrier with a bottom side and a top side. Grooves extend from the top side to the bottom side completely through the working medium carrier and have a narrowed portion at the bottom side but do not narrow upwardly toward the top side. The working medium carrier is an injection-molded plastic part. Lamellas with a holding rim and a lamella body are inserted with the holding rim in the grooves. The lamella body extends downward away from the holding rim, passes through the narrowed portion, and extends away from the bottom side. The lamellas are uniformly distributed about the bottom side. The grooves have an open end at a carrier rim of the working medium carrier. The open end has a cross-section matching the groove cross-section. A cover is connected to the top side and covers grooves and holding rims.

Abstract: A platen assembly includes a platen body, a polishing pad, and a fountain slurry supplier. The platen body has an upper surface. The polishing pad is disposed on the upper surface of the platen body. The fountain slurry supplier is at least partially disposed on the upper surface of the platen body for supplying slurry up onto the polishing pad.

Abstract: A method of controlling polishing includes polishing a substrate having a second layer overlying a first layer, detecting exposure of the first layer with an in-situ monitoring system, receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a sequence of spectra of light from the substrate while the substrate is being polished, determining a first value for the characteristic of the feature at the time that the first in-situ monitoring technique detects exposure of the first layer, adding an offset to the first value to generate a second value, and monitoring the characteristic of the feature and halting polishing when the characteristic of the feature is determined to reach the second value.

Abstract: A method and apparatus are used to simultaneously slice a multiplicity of slices from a workpiece. The workpiece is held with a feed device so as to position an axis of the workpiece parallel to axes of wire guide rolls of a wire saw and is moved from above through a web of the wire saw. A slurry is supplied as abrasive to wire sections of the web while the wire sections are moved relative to the workpiece. The relative movement guides the wire sections from an entry side to an exit side through the workpiece. A coolant is sprayed from the side and below through nozzles into slicing gaps in the workpiece. The nozzles are arranged below the web parallel to the axes of the wire guide rolls. The coolant is sprayed into the slicing gaps through a nozzle situated opposite the entry side of the respective wire section.

Abstract: An orifice assembly for a liquid jet cutting system includes a generally cylindrical base, an orifice member, and an orifice cap. The base includes a conduit that extends through a central axis from a top surface to a bottom surface of the base. The base also includes a pedestal that defines a protrusion from the top surface, the pedestal having a planar top region substantially parallel to the planar bottom region of the base. The orifice member sits on the planar top region of the pedestal. The orifice member defines an intermediate conduit therethrough, the intermediate conduit in fluid communication with the base conduit. The orifice cap defines an upper conduit therethrough, the upper conduit in fluid communication with the intermediate conduit of the orifice member. The orifice cap is configured to secure the orifice member to the pedestal.

Abstract: An embodiment wafer polishing tool includes an abrasive tape, a polish head holding the abrasive tape, and a rotation module. The rotation module is configured to rotate a wafer during a wafer polishing process, and the polish head is configured to apply pressure to the abrasive tape toward a first surface of the wafer during the wafer polishing process.

Abstract: The method is for sharpening a blade. An automatic sharpening apparatus is provided that has a housing with an elongate opening defined therein. A blade is placed inside the elongate opening. The blade is tightened between self-centered clamp holders. The rotation of the grinding wheel is turned on. The rotating grinding-wheel engages an underside of the blade and automatically moves along the blade by following a contour of the blade. While the grinding wheel moves along the blade, a counter-weight provides a counter-weight to the grinding wheel. The blade is sharpened while the blade is stationary inside the elongate opening of the housing.

Abstract: In one embodiment the present invention is a system comprising a feeder to feed projectiles. There is a conveyor for metering the projectiles, and that conveyor is in communication with the feeder. A pipe is in communication with the conveyor, for impelling projectiles through the pipe. In another it is use of a barrel internally lined with a helical blade for unconfined metering of projectiles to clean a gas pressurized pipe.

Abstract: A chemical mechanical polishing fixture having lateral perforation structures includes: a holder and a retaining ring. The holder includes: an annular substrate, a plurality of third holes and a plurality of lateral perforation structures. The annular substrate has a first joint surface, an outer periphery and an inner periphery. The third holes are annularly arranged on the first joint surface, and each third hole includes a first inner thread structure for individually providing a screw to be locked to a semiconductor machine. The lateral perforation structures penetrate from the outer periphery to the inner periphery of the annular substrate, where the lateral perforations are selected from: a converse U-shaped cube structure, an converse U-shaped cube structure, a cuboid structure, a cylinder structure, an elliptic cylinder structure, a flat cuboid structure or a hybrid structure of at least one cuboid structure and the above.