Patents Examined by Robert T Butcher
  • Patent number: 11124625
    Abstract: A composition comprising: a) electrically conductive fibers comprising carbon, a conductive oxide, or a metal; and having an average diameter from 1 to 20,000 nm and an average length at least five times the average diameter; and b) electrically nonconductive particles with an average diameter from 1 to 20,000 nm.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: September 21, 2021
    Assignee: Dow Silicones Corporation
    Inventor: Bizhong Zhu
  • Patent number: 11124673
    Abstract: An insulating film of the present invention includes a resin formed of polyimide, polyamide-imide, or a mixture thereof, and ceramic particles having a specific surface area of 10 m2/g or more, in which the ceramic particles form aggregated particles and a content of the ceramic particles is in a range of 5 vol % or more and 60 vol % or less.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: September 21, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Fumiaki Ishikawa, Kazuhiko Yamasaki
  • Patent number: 11118072
    Abstract: A composition is provided comprising (a) a polysilazane having a monovalent hydrocarbon group, (b) untreated metal oxide nanoparticles, metal oxide nanoparticles having a monovalent hydrocarbon group, or metal oxide nanoparticles having an alkylsilyl or alkoxysilyl group, and (c) an aprotic solvent. The composition has storage stability and is suitable for forming a film having water repellent, especially superhydrophobic properties.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: September 14, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Ayumu Kiyomori, Shotaro Aoki, Masato Kawakami, Tohru Kubota
  • Patent number: 11118053
    Abstract: A polymer composition comprising at least one polyaryletherketone, at least one polyarylene sulfide, and a plurality of reinforcing fibers is provided. The composition has a melt viscosity of about 250 Pa-s or less as determined in accordance with ISO Test No. 11443:2005 at a shear rate of 1,000 seconds?1 and temperature of about 380° C.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: September 14, 2021
    Assignee: Ticona LLC
    Inventors: Xiaowei Zhang, Suresh Subramonian, Xinyu Zhao, Christopher McGrady
  • Patent number: 11104796
    Abstract: A polycarbonate composition contains, based on the total weight of the polycarbonate composition: one or more polycarbonate homopolymers; a poly(carbonate-siloxane) copolymer comprising siloxane units with an average block length of 5 to 120, preferably 10 to 100, the poly(carbonate-siloxane) copolymer being present in an amount effective to provide 2.5 to 10 wt % of siloxane units based on the total weight of the polycarbonate composition; 1 to 8 wt % of an elastomer-modified graft copolymer; 0.01 to 5 wt % of a silicone oil; and 0.1 to 8 wt % of an additive; and wherein the composition has a melt mass flow rate higher than 16 g/10 min, determined in accordance with ASTM D1238 under a load of 1.2 kg at 300° C. with a dwelling time of 300 seconds; and an Izod notched impact energy of at least 700 J/m measured at 23° C. on a sample of 3.2 mm thickness according to ASTM D256-10.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: August 31, 2021
    Assignee: SHPP GLOBAL TECHNOLOGIES B.V.
    Inventors: Yagang Chen, Wei Shan, Shijie Song, Yaming Niu
  • Patent number: 11104809
    Abstract: The invention relates to a powder coating composition for low temperature curing that can be used on temperature sensitive substrates and, despite of the low curing temperature, has excellent flow properties and forms a coating with excellent appearance and nevertheless also good mechanical and weathering properties. The invention also relates to an advantageous process for the manufacture of the powder coating composition. Said powder coating composition comprises a poly-acid functional polyester component A, a poly-epoxy functional component B, a poly-anhydride functional component C and a thermosetting curing catalyst D. The invention also relates to a polyester for use in the powder coating compositions according to the invention, in particular for durable powder coatings.
    Type: Grant
    Filed: July 4, 2017
    Date of Patent: August 31, 2021
    Assignee: ALLNEX NETHERLANDS B.V.
    Inventors: William Weaver, Robert Watson, Richard Hendrikus Gerrit Brinkhuis, Martin Bosma, Paul Jones, Steve White, Dimitrios Baxevanis, Roberto Cavalieri
  • Patent number: 11098176
    Abstract: The present invention is directed to formulations including a polymer and a plasticizer composition. The plasticizer composition is a blend of an alkyl ketal ester plasticizer and a second plasticizer selected from a cycloaliphatic compound, an ortho phthalate compound, a terephthalate compound, a benzoate ester compound, and a bio-based compound. The plasticizer composition is at least 10% by weight of the total of the polymer and the plasticizer composition.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: August 24, 2021
    Assignee: GFBIOCHEMICALS IP ASSETS B.V.
    Inventors: Dorie J. Yontz, Friederike Stollmaier, Kevin J. Bechtold
  • Patent number: 11091666
    Abstract: The present invention addresses the problem of providing: a peelable coating composition for which peeling due to light impact or scratch after drying is effectively prevented while peeling easily in operations in which peeling is intended; and a coating film obtained by drying said composition. The problem is solved by an easy peel coating composition comprising a polycarbonate resin with structural units represented by general formula (1): (1) and a non-halogen-based organic solvent, wherein the content of the polycarbonate resin in the composition is 0.1-50 mass % and the proportion of structural units represented by general formula (2): (2) in the structural units represented by general formula (1) is 0-80% as a mole ratio.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: August 17, 2021
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventor: Noriyoshi Ogawa
  • Patent number: 11084945
    Abstract: The present invention provides a powder coating composition comprising a diisocyanate-modified bisphenol A epoxy resin, a curing agent, an auxiliary curing agent, an enhancer, and an extender pigment, wherein the auxiliary curing agent comprises an alkanolamine-modified epoxy polyol resin.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: August 10, 2021
    Assignee: KCC Corporation
    Inventors: Hyeon Ung Wang, Jin Seok Lee, Sung Hwan Yun
  • Patent number: 11078362
    Abstract: The present invention relates to a polyamide composition (PC) which comprises at least one polyamide (P) and at least one additive (A). The present invention further relates to the use of the polyamide composition (PC) in a selective laser sintering process, in an injection molding process, for producing molded articles and in an extrusion process.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: August 3, 2021
    Assignee: BASF SE
    Inventors: Claus Gabriel, Simon Gramlich, Rainer Ostermann, Florian Richter, Raphael Dabbous, Thomas Meier, Wolfgang Schrof
  • Patent number: 11078419
    Abstract: A class of antioxidant compositions include benzotriazole phenolate salts with substituents either ortho to the phenol hydroxide group and/or para to the phenol hydroxide group can be prepared from substituted benzotriazole phenols. The ortho substituent group can be a simple hydrocarbon, alkoxy or amino group, or the ortho substituent group can be a linking group, linking the benzotriazole phenolate to another benzotriazole phenolate group.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: August 3, 2021
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Nathan E. Schultz, Fuming B. Li, Kelly A. Volp, Mark McCormick
  • Patent number: 11081280
    Abstract: A block copolymer forms a dielectric film with isolated polarizable domains. The block copolymer is a molecule selected to have an ionically functionalized end. The ionically functionalized end is selected to be less soluble in a solvent than another portion of the polymer such that, when a plurality of the block copolymer molecules are dissolved in the solvent, the first ends of the plurality of block copolymers interact with each other and aggregate to form isolated polarizable domains. The block copolymer forms an electrically isolating shell about a core comprised of the ionically functionalized ends. One or more additives may be disposed selectively within the core to increase the dielectric constant of the dielectric film.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: August 3, 2021
    Assignee: Ehrenberg Industries Corporation
    Inventor: Scott Ehrenberg
  • Patent number: 11077647
    Abstract: Provided is an inexpensive thermally conductive silicone rubber composite sheet. The thermally conductive silicone rubber composite sheet of the invention includes a laminated structure body comprised of an intermediate layer and an outer layer laminated on both surfaces of the intermediate layer, in which (A) the intermediate layer is an electrical insulating synthetic resin film layer having a thermal conductivity of not lower than 0.20 W/m·K and a tensile elastic modulus of not lower than 5 GPa, and (B) the outer layer is a silicone rubber layer of a cured product of a composition containing: (a) an organopolysiloxane; (b) a curing agent; (c) a thermally conductive filler; and (d) a silicon compound-based adhesion imparting agent having at least one kind of group selected from the group consisting of an epoxy group, an alkoxy group, a methyl group, a vinyl group and a Si—H group.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: August 3, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akihiro Endo, Yuki Tanaka
  • Patent number: 11061328
    Abstract: Embodiments in accordance with the present invention encompass photosensitive compositions containing a base soluble polymer, a latent base catalyst, a photoactive compound and an epoxy crosslinking agent. The compositions are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. More specifically, the compositions exhibit increased photo speed, higher elongation to break, higher tensile strength and higher glass transitions temperatures than the conventional compositions, among other enhanced properties. Accordingly, the positive images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: July 13, 2021
    Assignee: PROMERUS, LLC
    Inventor: Pramod Kandanarachchi
  • Patent number: 11059953
    Abstract: The present invention relates to a compound of the formula (I) for improving the tensile shear strength of hardened compositions based on silane-modified prepolymers, a composition containing a silane-functionalized prepolymer and a compound of the formula (I), a method for the production of this composition and the use of the compound of the formula (I) in adhesives, sealants, coatings and/or primers, based on silane-functionalized prepolymers and the use of this compound for the production of adhesives, sealants, coatings and/or primers based on silane-functionalized prepolymers.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: July 13, 2021
    Assignee: Bona GmbH Deutschland
    Inventor: Holger Wickel
  • Patent number: 11053384
    Abstract: Provided are a curable composition capable of both exhibiting a low shrinkage percentage during curing and forming a cured product having a low elastic modulus under high temperature conditions, a cured product of the curable composition, and a semiconductor encapsulating material and a printed wiring board which are produced using the curable composition. The curable composition includes an active ester compound (A) that is an esterification product of a phenolic compound (a1) and an aromatic polycarboxylic acid or an acid halide thereof (a2); and a curing agent. Also provided are a cured product of the curable composition, and a semiconductor encapsulating material and a printed wiring board which are produced using the curable composition.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: July 6, 2021
    Assignee: DIC Corporation
    Inventors: Yutaka Satou, Akito Kawasaki, Tatsuya Okamoto
  • Patent number: 11053375
    Abstract: The invention provides anticorrosive flame retardant formulations for thermoplastic polymers, comprising from 20 to 97.9% by weight of a (di)phosphinic acid salt of formula (I) and/or (II) wherein R1, R2 are the same or different and denote H or C1-C6-alkyl, linear or branched, and/oFr aryl; R3 denotes C1-C10-alkylene, linear or branched, C6-C10-arylene, C6-C10-alkylarylene or C7-C20-arylalkylene; M denotes Mg, Ca, Al, Sb, Sn, Ge, Ti, Fe, Zr, Ce, Bi, Sr, Mn, Li, Na, K and/or a protonated nitrogen base; m denotes from 1 to 4; n denotes from 1 to 4; x denotes from 1 to 4, and as component B from 2 to 50% by weight of a phosphazene of the general formula (III) or (IV) wherein R4 and R4? are the same or different and represent C1-C20-alkyl, C6-C30-aryl, C6-C30-arylalkyl or C6-C30-alkyl substituted aryl, and X represents a group —N?P(OPh)3 or —N?P(O)OPh and Y represents the group —P(OPh)4 or —P(O)(OPh)2; as component C from 0.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: July 6, 2021
    Assignee: Clariant Plastics & Coatings Ltd
    Inventors: Muriel Rakotomalala, Elke Schlosser, Sebastian Hoerold, Wolfgang Wanzke
  • Patent number: 11046804
    Abstract: Embodiments of the present disclosure are directed towards polyol compositions including a dispersion of polyisocyanate polyaddition particles in a carrier polyol, wherein the polyisocyanate polyaddition particles have an average particle diameter from 0.1 to 10.0 microns and the dispersion has a solids content from 5 wt % to 50 wt % based upon a total weight of the dispersion, and a polyester polyol that is from 1 wt % to 98 wt % of the polyol composition based upon a total weight of the polyol composition.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: June 29, 2021
    Assignee: Dow Global Technologies LLC
    Inventors: Rossella Riccio, Irena Amici-Kroutilova, Giuseppe Vairo, Paul Cookson, Francois M. Casati, Elena Ferrari
  • Patent number: 11041045
    Abstract: Provided are a resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a styrenic thermoplastic elastomer: wherein R1 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: June 22, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Yuki Nagai, Yasuyuki Mizuno, Tomio Fukuda, Takao Tanigawa, Hikari Murai
  • Patent number: 11042090
    Abstract: The present invention provides a composition for forming an organic film, containing a polymer compound having one or more of repeating units shown by the general formulae (1) to (4) and an organic solvent containing one or more compounds selected from propylene glycol esters, ketones, and lactones, with a total concentration of more than 30 wt % with respect to the whole organic solvent. There can be provided a composition capable of forming an organic film that can be easily removed, together with a silicon residue modified by dry etching, in a wet manner with a removing liquid harmless to a semiconductor apparatus substrate and an organic resist underlayer film required in the patterning process, for example, an ammonia aqueous solution containing hydrogen peroxide called SC1, which is commonly used in the semiconductor manufacturing process.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: June 22, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Seiichiro Tachibana, Hiroko Nagai, Daisuke Kori, Tsutomu Ogihara