Patents Examined by Robert Tavlykaev
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Patent number: 12681340Abstract: An electro-optic modulator is disposed on a surface of a substrate including: an optical waveguide layer disposed on the substrate, a modulation electrode disposed on the optical waveguide layer, and a metal electrode disposed on the modulation electrode and electrically connected to the modulation electrode. A first end of the metal electrode is coupled to a radio frequency driver, and receives a modulation signal input by the radio frequency driver. The modulation electrode is configured to perform electro-optic modulation on the optical waveguide layer based on the modulation signal. A second end of the metal electrode is coupled to a direct-current voltage end, and the direct-current voltage end is configured to input a voltage signal and provide a bias voltage for the radio frequency driver by using the metal electrode. This reduces costs and a size of the electro-optic modulator, and is conducive to device miniaturization.Type: GrantFiled: November 29, 2022Date of Patent: July 14, 2026Assignee: Huawei Technologies Co., Ltd.Inventors: Hongmin Chen, Mengdie Sun, Xin Chen, Fusheng Tang, Haifeng Shao, Lei Zhao, Lei Liu
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Patent number: 12681244Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a photonic die and at least one optical fiber. Devices and methods are shown that include an optical coupler and one or more correction regions to align a beam between the photonic die and the optical fiber.Type: GrantFiled: December 30, 2022Date of Patent: July 14, 2026Assignee: Intel CorporationInventors: Yonggang Li, Bai Nie
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Patent number: 12674932Abstract: An optical waveguide mounted substrate includes an interconnect substrate having a recess that opens on a first surface thereof, and an optical waveguide device including: an optical waveguide substrate including a support and a core layer disposed on the support; and a silicon photonic chip including a silicon substrate and a silicon waveguide disposed on the silicon substrate, the silicon waveguide being optically coupled with the core layer, wherein the optical waveguide substrate is mounted on the interconnect substrate such that the core layer faces away from the recess and at least a part of a thickness of the support is situated inside the recess.Type: GrantFiled: April 16, 2024Date of Patent: July 7, 2026Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Hisashi Kaneda
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Patent number: 12675007Abstract: In one aspect, an integrated photonic device is disclosed, which comprises a waveguide through which radiation having one or more wavelengths within a wavelength band can propagate, a phase shifter optically coupled to said waveguide. The phase shifter comprises a heat-actuable phase change material (PCM) optically coupled to the waveguide, and a heater having a layer of a two-dimensional material in thermal communication with the PCM and configured to receive a reset voltage pulse for causing heating of the graphene layer followed by cooling thereof, wherein the thermal communication between the heated graphene layer and the PCM causes at least a portion of the PCM to undergo a phase transition from a crystalline state to an amorphous state, thereby causing a change in a refractive index of the PCM and a resultant phase shift in the radiation propagating through the waveguide.Type: GrantFiled: May 22, 2023Date of Patent: July 7, 2026Inventors: Zhuoran Fang, Rui Chen, Jiajiu Zheng, Asir Intisar Khan, Kathryn M. Neilson, Sarah J. Geiger, Dennis M. Callahan, Jr., Michael G. Moebius, Abhi Saxena, Michelle E. Chen, Carlos Rios, Juejun Hu, Eric Pop, Arka Majumdar
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Patent number: 12674947Abstract: A fiber-optic cable includes an optical fiber that transports a forward-propagating laser beam. The optical fiber includes a core, a cladding, and an output end-face emitting the forward-propagating beam. The fiber-optic cable also includes a mode-stripper, along a segment of the optical fiber, that couples out backward-propagating radiation that has been coupled into the cladding at the output end-face. The fiber-optic cable further includes a waveguide having a waveguide body with a bore containing at least part of the segment of the optical fiber. The bore is defined by an inward-facing surface that guides at least a fraction of the backward-propagating radiation, coupled out of the cladding by the mode-stripper, toward a rear opening of the bore farthest from the output end-face. Additionally, the fiber-optic cable includes one or more sensors or fiber ports that receive portions of the backward-propagating radiation emerging from the rear opening.Type: GrantFiled: January 17, 2024Date of Patent: July 7, 2026Assignee: Optoskand ABInventors: Fredrik Johansson, Christian Rydberg, Olof Sallhammar, Mats Blomqvist
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Patent number: 12650567Abstract: An electronic package and a manufacturing method thereof are provided, in which a first optoelectronic element having a first optical fiber connection portion is disposed on an electronic module, a second optoelectronic element having a second optical fiber connection portion is disposed on a first level layer of a lower carrying portion of a step-shaped carrier structure, and the electronic module is disposed on a second level layer of the step-shaped carrier structure and the second optoelectronic element having the second optical fiber connection portion, so that the electronic module is electrically connected to the second optoelectronic element having the second optical fiber connection portion. Thereby, two optoelectronic elements having optical fiber connection portions can be easily and vertically integrated, and the second optoelectronic element can be stably carried by the step-shaped carrier structure.Type: GrantFiled: February 2, 2024Date of Patent: June 9, 2026Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Shuai-Lin Liu, Nai-Hao Kao, Yu-Po Wang
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Patent number: 12645129Abstract: To prevent deterioration in an extinction ratio due to asymmetry between a pair of optical waveguides. An optical modulator has a Mach-Zehnder optical waveguide including mutually parallel first and second waveguides and a signal electrode for controlling the phase of light propagating in the Mach-Zehnder optical waveguide. The first and second waveguides have a first section in which the second waveguide has a line width smaller than that of the first waveguide and a second section in which the first waveguide has a line width smaller than that of the second waveguide. The first section and the second section are replaced with each other in curved parts.Type: GrantFiled: October 26, 2020Date of Patent: June 2, 2026Assignee: TDK CorporationInventors: Hiroki Hara, Shinji Iwatsuka
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Patent number: 12631839Abstract: An optical fiber unit includes: a plurality of optical fibers; and a tube covering the plurality of optical fibers. In the optical fiber unit, a tensile elongation rate of the tube is 100% or more and 500% or less. An optical cable includes: a plurality of optical fiber units; and a cable sheath covering the plurality of optical fiber units. In the optical cable, each of the plurality of optical fiber units includes: a plurality of optical fibers; and a tube covering the plurality of optical fibers, and a tensile elongation rate of the tube is 100% or more and 500% or less.Type: GrantFiled: February 1, 2024Date of Patent: May 19, 2026Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Takemasa Akiyama, Fumiaki Sato
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Patent number: 12631821Abstract: Various embodiments disclosed herein describe photonic passive delay lines that have a waveguide wound into a plurality of straight segments and bends. The photonic passive delay lines are configured to reduce losses from parasitic modes of light generated at the bends. Embodiments of the photonic passive delay lines vary the dimensions of the straight segments to provide different amounts of dephasing between a mode of input light received by the photonic passive delay line and one or more parasitic modes.Type: GrantFiled: August 16, 2023Date of Patent: May 19, 2026Assignee: APPLE, INC.Inventors: Jason S. Pelc, Yu Miao, Mark A. Arbore, Meng Huang, Zhechao Wang
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Patent number: 12631911Abstract: Embodiments herein describe a photonic platform having a chiplet with a Pockels effect electro-optic layer made of LN or BTO and a substrate. The chiplet is bonded to a photonic wafer which includes a waveguide. In this manner, a ridge waveguide formed by the Pockels effect electro-optic layer and the waveguide utilizes electro-optic effects to tune a signal.Type: GrantFiled: April 7, 2023Date of Patent: May 19, 2026Assignee: Cisco Technology, Inc.Inventors: Vipulkumar K. Patel, Ming Gai Stanley Lo, Mark A. Webster, Farnood Khalilzadeh Rezaie
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Patent number: 12631827Abstract: Various embodiments disclosed herein describe optomechanical phase shifters. The optomechanical phase shifters may be configured with an asymmetry that improves the performance of the OM phase shifter as a function of wavelength. In some instances, the optomechanical phase shifter includes a section of a waveguide having an asymmetric cross-sectional shape. In other instances an optomechanical phase shifter is incorporated into a controllable optical switch, such that OM phase shifters may be actuated to selectively route light to different outputs of the controllable optical switch.Type: GrantFiled: August 3, 2023Date of Patent: May 19, 2026Assignee: APPLE, INC.Inventors: Mark A. Arbore, Jason S. Pelc
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Patent number: 12631842Abstract: An optical fiber cable includes: a spacer including a plurality of ribs and a plurality of grooves defined by the plurality of ribs; a plurality of optical fiber units accommodated in each of the plurality of grooves; and a cable sheath configured to cover the spacer and the plurality of optical fiber units. The spacer and the cable sheath are integrally formed.Type: GrantFiled: December 9, 2022Date of Patent: May 19, 2026Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Fumiaki Sato, Kenta Tsuchiya, Eimi Kasai
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Patent number: 12625323Abstract: A method for forming an optical fiber having at least one of a microresonator and a coupler integrated therein is described. The method includes providing an optical fiber having a light guiding core. modifying at least one region of the optical fiber using a laser, immersing the optical fiber having the at least one region as modified inside an etchant that selectively etches the at least one region as modified to generate at least one of a microresonator and a coupler integrated in the optical fiber, and removing the optical fiber from the etchant. The optical fiber as removed from the etchant may include the at least one of the microresonator and the coupler. The method may further include heating the optical fiber using, for example, a CO2 laser or other heating apparatus, to smoothen surface irregularities of at least one of the microresonator and the coupler.Type: GrantFiled: March 31, 2022Date of Patent: May 12, 2026Assignee: VIRGINIA TECH INTELLECTUAL PROPERTIES, INC.Inventors: Shuo Yang, Anbo Wang
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Patent number: 12625334Abstract: A 400G silicon photonic integrated optical module with an embedded thermoelectric cooler (TEC) substrate includes: a housing, a printed circuit board (PCB) substrate, and a silicon photonic integrated circuit board, where an accommodating cavity is formed in the housing; the PCB substrate is provided in the accommodating cavity; a TEC substrate is embedded into the PCB substrate; the silicon photonic integrated circuit board is provided on the TEC substrate; the silicon photonic integrated circuit board is provided with an extended segment; the extended segment extends to one side and to the PCB substrate; a fiber array, an electronic integrated circuit board, a light emission assembly, and a light-receiving detector are arranged on the silicon photonic integrated circuit board; the light emission assembly is mounted on the silicon photonic integrated circuit board; and the light emission assembly and the light-receiving detector are provided above the TEC substrate.Type: GrantFiled: February 9, 2024Date of Patent: May 12, 2026Assignee: SHUNYUN TECHNOLOGY (ZHONGSHAN) LimitedInventor: Jie Huang
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Patent number: 12625397Abstract: Systems and methods are described herein for an electro-absorption modulator (EAM) device. An example EAM device comprises an optical waveguide comprising a waveguide core configured to facilitate a propagation of an optical signal therethrough; a segmented traveling wave electrode structure comprising electrode segments disposed on the optical waveguide; and an electrical transmission line operatively coupled to the electrode segments via conducting bridges, wherein the electrical transmission line is configured to facilitate a propagation of an electrical signal therethrough, wherein the electrode segments are configured to overcome bandwidth and extinction ratio constraints of a lumped EAM.Type: GrantFiled: March 13, 2023Date of Patent: May 12, 2026Assignee: Mellanox Technologies, Ltd.Inventors: Moshe B. Oron, Oren Steinberg, Isabelle Cestier, Elad Mentovich, Timothy De Keulenaer
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Patent number: 12619120Abstract: The present disclosure describes photodetectors with multiple inputs and methods of operating photodetectors with multiple inputs. An apparatus includes a substrate, an optical absorber, an optical device, and a tuner. The optical absorber is positioned on the substrate. The optical device produces a first optical signal and a second optical signal from an optical signal received at a first port of the optical device and directs the first optical signal and the second optical signal to the optical absorber. The tuner adjusts a first phase of the first optical signal and a second phase of the second optical signal such that a reflection of the first optical signal from the optical absorber destructively interferes with a reflection of the second optical signal from the optical absorber at the first port.Type: GrantFiled: April 18, 2023Date of Patent: May 5, 2026Assignee: Cisco Technology, Inc.Inventors: Rajat Sharma, Donald B. Adams, Attila Mekis, Gianlorenzo Masini
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Patent number: 12619121Abstract: Structures for a power splitter that include a multimode interference coupler and methods of forming such structures. The structure comprises a multimode interference coupler including a grating having a plurality of grating lines, an input waveguide core, and an output waveguide core. The grating lines are disposed between the input waveguide core and the output waveguide core. The structure further comprises a resistive heating element adjacent to the grating lines.Type: GrantFiled: September 26, 2023Date of Patent: May 5, 2026Assignees: GlobalFoundries U.S. Inc., Khalifa University of Science and TechnologyInventors: Michal Rakowski, Yusheng Bian, Roderick A. Augur, Ayat M. Taha, Marios Papadovasilakis, Yonas Hadush Gebregiorgis, Jaime Viegas
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Patent number: 12613446Abstract: A leaky-mode acousto-optical modulator may be used to generate visual images suitable for direct viewing, without image-forming optics. To extend a field of view of the modulator to limits suitable for visual displays, an array of acoustic transducers is coupled to a waveguide along its length. Each acoustic transducer generates an acoustic wave causing a corresponding leaky mode to appear. A reflector is disposed proximate each transducer for directing the out-coupled light portion at a unique angle, providing a corresponding field of view portion for that direction. The field of view portions coalesce into a continuous synthetic field of view suitable for wide-angle visual display applications.Type: GrantFiled: April 14, 2023Date of Patent: April 28, 2026Assignee: Meta Platforms Technologies, LLCInventors: Sundeep Kumar Jolly, Sihui He
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Patent number: 12613388Abstract: A slot type optical fiber cable includes a slot rod including a plurality of ribs for forming a plurality of slot grooves, and a plurality of optical fibers accommodated in the slot grooves. The number of the slot grooves is three or four.Type: GrantFiled: July 6, 2022Date of Patent: April 28, 2026Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Fumiaki Sato, Eimi Kasai, Kenta Tsuchiya, Yuuki Shimoda, Takao Hirama, Satomi Ido, Kentaro Takeda, Hitoshi Tsubakiyama, Ken Takahashi
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Patent number: 12578596Abstract: An optical module configuration includes a circuit board and a transmitter optical subassembly. The circuit board includes an accommodation through opening. The transmitter optical subassembly includes a light emitting unit and a thin film LiNbOx modulator. The thin film LiNbOx modulator is optically coupled with the light emitting unit, and the thin film LiNbOx modulator is disposed in the accommodation through opening. The accommodation through opening allows placement of various thin film LiNbOx modulators supportive of different optical module specifications.Type: GrantFiled: January 10, 2023Date of Patent: March 17, 2026Assignee: Global Technology Inc.Inventors: Jian-Hong Luo, Rui Huang, Yanrong Pan