Patents Examined by Robert Tavlykaev
  • Patent number: 9864109
    Abstract: A plasmonic device having a transparent conducting oxide (TCO) waveguide and a tunable voltage applied across the TCO and a metal layer for modulating an input optical signal.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: January 9, 2018
    Assignee: CALIFORNIA INSTITUTE OF TECHNOLOGY
    Inventors: Ho Wai Lee, Stanley Burgos, Georgia Papadakis, Harry A. Atwater
  • Patent number: 9835851
    Abstract: The force of a piezoelectric element is efficiently transferred to an optical fiber without attenuation, so that the vibration of the optical fiber becomes large. Provided is an optical fiber scanner including an optical fiber which has an elongated cylindrical shape in which illumination light emitted from a light source is guided and can emerge from a distal end thereof and whose distal end can be vibrated in a direction intersecting the longitudinal direction thereof; and at least one piezoelectric element which have a plate shape polarized in a thickness direction thereof and which are separately bonded to an outer circumferential surface of the optical fiber closer to a base side than to a distal end thereof.
    Type: Grant
    Filed: April 1, 2015
    Date of Patent: December 5, 2017
    Assignee: OLYMPUS CORPORATION
    Inventors: Tomoki Funakubo, Hiroshi Tsuruta, Morimichi Shimizu, Yasuaki Kasai
  • Patent number: 9829662
    Abstract: A pluggable optical transceiver implementing a pull-tab is disclosed. The pull-tab includes arms assembled with a body of the optical transceiver and a holder connecting the arms. The holder, which is provided in ends of the arms, provides a tab and a bridge, where the tab and the bridge form a space where an optical fiber mated with the optical transceiver is secured. The tab is dynamically engaged with the bridge after the optical fiber is set on the bridge.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: November 28, 2017
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventor: Hiromi Kurashima
  • Patent number: 9829625
    Abstract: An optical fiber comprises a glass fiber which comprises a core and a cladding, a primary resin coating layer which covers the periphery of the glass fiber, and a secondary resin coating layer which covers the periphery of the primary resin coating layer. The glass fiber is a multimode fiber having a core diameter of 40-60 ?m and a cladding diameter of 90-110 ?m, and the primary resin coating layer is a layer formed by curing a curable resin composition which comprises oligomers, monomers, and a reaction initiator, the curable resin composition containing a one-end-capped oligomer in an amount of 30% by mass or larger based on all the oligomers.
    Type: Grant
    Filed: May 2, 2016
    Date of Patent: November 28, 2017
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Yuya Homma
  • Patent number: 9823432
    Abstract: A termination field and a guide member are independently pivotally coupled to a base body. The termination field pivots relative to the base body along a path of travel. The guide member is coupled to the base body to provide bend radius protection to cables plugged into the termination field. The guide member defines a channel leading the cables from the termination field towards a first side of the base body at an exterior of the base body. In certain examples, the guide member and termination field pivot relative to the base body about different hinge axes. In other examples, the termination field pivots with the guide member for part of the path of travel and relative to the guide member for another part of the path of travel.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: November 21, 2017
    Assignees: ADC Czech Republic, S.R.O., CommScope Connectivity Belgium BVBA
    Inventors: Zoltan Alexi, Bernadus Johannes Nicolas Geling, Simon Reyndert Christiani, Rudi Verbruggen, Johan Geens
  • Patent number: 9815731
    Abstract: Tapered core fibers are produced using tapered core rods that can be etched or ground so that a fiber cladding has a constant diameter. The tapered core can be an actively doped core, or a passive core. One or more sleeving tubes can be collapsed onto a tapered core rod and exterior portions of the collapsed sleeving tubes can be ground to provide a constant cladding diameter in a fiber drawn from the preform.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: November 14, 2017
    Assignee: nLIGHT, Inc.
    Inventors: Joona Koponen, Laeticia Petit, Petteri Väinänen
  • Patent number: 9791649
    Abstract: A mounting frame system is disclosed that facilitates the mounting of optical connector modules to printed circuit boards. The mounting frame system can include a mounting frame that is configured to attach to a printed circuit board, and is adapted to attach to a connector module. Thus, the mounting frame system can further allow releasable mounting of optical connector modules to the printed circuit board, such that the mounting is achieved in a safe and reliable manner.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: October 17, 2017
    Assignee: FCI Asia Pte. Ltd.
    Inventor: Jeroen De Bruijn
  • Patent number: 9791642
    Abstract: A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: October 17, 2017
    Assignee: International Business Machines Corporation
    Inventors: Roger F. Dangel, Daniel S. Jubin, Antonio La Porta, Bert J. Offrein
  • Patent number: 9784924
    Abstract: A protective assembly method using a transparent layer within the fiber interconnect system aids in optical coupling by preventing an air gap from forming between the fiber cores within a connector. A thin transparent film (or with adhesive) is placed over the fiber end-faces at the connector interface, the film having characteristics which allows it to conform to the fiber end and minimize coupling loss between fibers. The film is sized to fit connectors faces and can be temporary, being replaced with each installation. A coating can also applied to the connector surface, providing a similar effect, as well as structurally enhancing the connector surfaces.
    Type: Grant
    Filed: June 28, 2015
    Date of Patent: October 10, 2017
    Assignee: ULTRA COMMUNICATIONS, INC.
    Inventors: Charles B. Kuznia, Richard J. Pommer, Joseph F. Ahadian, Richard T. Hagan, Man W. Wong
  • Patent number: 9784916
    Abstract: A high-refractive-index single-compensation-scattering-cylinder right-angle waveguide of a cylindrical square lattice photonic crystal, being a photonic crystal formed by arranging a first dielectric cylinder having a high refractive index in a background dielectric having a low refractive index in a square lattice; one row and one column of the first dielectric cylinders having a high refractive index are removed from the photonic crystal to form a right-angle waveguide; a second dielectric cylinder having a high refractive index is arranged at a turn of the right-angle waveguide; and the second dielectric cylinder is a compensation scattering cylinder, and the first dielectric cylinders are high-refractive-index cylinders. The structure has an extremely low reflectivity and an extremely high transmission rate, thus facilitating an integration of a large-scale light path.
    Type: Grant
    Filed: December 31, 2016
    Date of Patent: October 10, 2017
    Inventor: Zhengbiao Ouyang
  • Patent number: 9784931
    Abstract: An optical waveguide module includes an optical waveguide sheet including multiple optical waveguides, and a light-emitting device and a light-receiving device each positioned over a surface of the optical waveguide sheet. At least one of the optical waveguides includes a first mirror, a second mirror, and a slit. The first mirror is configured to reflect light entering the corresponding optical waveguide from its first end to the light-receiving device or to reflect light emitted from the light-emitting device toward the first end of the corresponding optical waveguide. The second mirror is configured to reflect light entering the corresponding optical waveguide from its second end toward the surface of the optical waveguide sheet. The slit is provided between the second mirror and the second end of the corresponding optical waveguide. The corresponding optical waveguide is discontinuous across the slit.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: October 10, 2017
    Assignee: FUJITSU COMPONENT LIMITED
    Inventors: Rie Gappa, Osamu Daikuhara, Shinichiro Akieda, Satoshi Moriyama, Hongfei Zhang, Mitsuki Kanda
  • Patent number: 9772447
    Abstract: A method of producing a heterogeneous photonic integrated circuit includes integrating at least one III-V hybrid device on a source substrate having at least a top silicon layer, and transferring by transfer-printing or by flip-chip bonding the III-V hybrid device and at least part of the top silicon layer of the source substrate to a semiconductor-on-insulator or dielectric-on-insulator host substrate.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: September 26, 2017
    Assignees: IMEC VZW, Universiteit Gent
    Inventors: Shahram Keyvaninia, Dries Van Thourhout, Gunther Roelkens
  • Patent number: 9759913
    Abstract: A transparent waveguide for use in eye tracking includes an input-coupler and an output-coupler. The input-coupler comprises a plurality of curved grating lines having a radially varying pitch. When positioned in front of an eye illuminated with infrared light, infrared light beams reflected from the eye and incident on the input-coupler enter the waveguide at the input-coupler, propagate through the waveguide by way of total internal reflections, and exit the waveguide proximate the output-coupler.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: September 12, 2017
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Pasi Saarikko, Xinye Lou, Scott McEldowney, Steven Robbins
  • Patent number: 9759863
    Abstract: A waveguide a core extending along a light propagation and a coupling layer adjacent one side of the core along the light propagation direction. A gradient index material is adjacent to at least one side of the coupling layer. The gradient index material has a first refractive index proximate the coupling layer and a second refractive index away from the coupling layer. The gradient index material is configured to direct light from an input facet to the core layer.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: September 12, 2017
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: Chubing Peng, Mark Ostrowski, Chang Xie, Tae-Woo Lee, Lisa M. Hanson
  • Patent number: 9762334
    Abstract: We disclose a photonic integrated circuit (PIC) having a first photonic chip and a second photonic chip that are bonded and optically coupled to one another in a manner that reduces the number of different photonic chips that need to be integrated into the same PIC package to achieve a desired electro-optical function. In an example embodiment, the first photonic chip may include active optical components, such as lasers and optical amplifiers, and be fabricated using the III-V semiconductor technology. The second photonic chip may include additional optical components, such as modulators, photodetectors, and passive optical components, and be fabricated using the CMOS technology. The second photonic chip may also include one or more 2×2 optical couplers configured to appropriately (re)direct various optical signals between the active optical components of the first photonic chip and the additional optical components of the second photonic chip to achieve the desired electro-optical function.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: September 12, 2017
    Assignee: Alcatel-Lucent USA Inc.
    Inventors: Chia-Ming Chang, Guilhem de Valicourt
  • Patent number: 9746604
    Abstract: A light guide apparatus that can redirect light impinging on the apparatus over a wide range of incident angles and can concentrate light without using a tracking system and methods for fabrication. This apparatus uses conditions of total internal reflection and refraction near the critical angle for total internal reflection (near TIR) in order to trap light within the apparatus.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: August 29, 2017
    Assignee: Agira, Inc.
    Inventor: Bal Mukund Dhar
  • Patent number: 9739967
    Abstract: A wiring member comprises a first module having a first communication unit, second modules having respective second communication units, a cable module having cables which connect the first communication unit to the second communication units, and a branching module which is disposed at a prescribed position in the cable module. The branching module has a first cable insertion portion in which the cables are inserted in bundled form and a second cable insertion portion in which the cables are inserted separately, and the branching module is fixed to at least one of the cables in a first state and is made movable relative to the cables in a second state. One end portions of the cables are connected to the first module in bundled form and the other end portions of the cables are connected to the respective second modules separately.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: August 22, 2017
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Satoshi Yoshikawa
  • Patent number: 9733433
    Abstract: An optical connection box includes, a plurality of first optical connectors to which a plurality of first optical paths are respectively connected, a plurality of second optical connectors that respectively include an operation unit protruding from a peripheral edge side position further from a position of the plurality of first optical connectors on a first surface of the optical connection box, and that are respectively connected to a plurality of receptacle optical connectors which are disposed in the plurality of second optical paths, a plurality of relay optical fibers in which any one of the plurality of first optical connectors is disposed in the first terminal and any one of the plurality of second optical connectors is disposed in the second terminal, and a fitting structure with respect to a substrate in which the receptacle optical connectors are disposed.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: August 15, 2017
    Assignees: FUJIKURA LTD., FUJITSU LIMITED
    Inventors: Seiji Kato, Akihiro Yasuo, Misao Umematsu
  • Patent number: 9733546
    Abstract: An optical component includes an optical device comprising a bonding face and an optically polished end face, and a metal film formed on the bonding face of the optical device and for bonding the optical device onto a substrate. The metal film includes a main covering portion covering a region except an end part of the bonding face on the side of the end face and an end part-covering portion covering the bonding face in the end part. A non-covered part, which is not covered by the metal film, is provided between the main covering portion and end part-covering portion.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: August 15, 2017
    Assignee: NGK INSULATORS, LTD.
    Inventors: Shoichiro Yamaguchi, Naotake Okada, Keiichiro Asai
  • Patent number: 9733497
    Abstract: Provided is a technique for enabling an ? parameter to be approximated to zero. A multiple quantum well structure includes a layer structure including a first barrier layer, an intermediate layer, a well layer, and a second barrier layer. The conduction band energies of the first and second barrier layers, the intermediate layer, and the well layer are larger in this order, and the valence band energies of the intermediate layer, the well layer, and the first and second barrier layers are larger in this order.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: August 15, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Koichi Akiyama, Eiji Yagyu