Abstract: A semiconductor device may be provided. The semiconductor device may include an address input circuit and a target address generation circuit. The address input circuit may be configured to latch a bank address and an address to generate a bank active signal and a latch address based on the execution of an active operation. The target address generation circuit may be configured to generate the latch address as a target address.

Abstract: A semiconductor memory device includes a block of memory cells including first, second, and third memory cells, a first word line electrically connected to a gate of the first memory cell, a second word line electrically connected to a gate of the second memory cell, a third word line electrically connected to a gate of the third memory cell, and a control circuit configured to access the block in one of at least first and second modes to perform an operation thereon. When the control circuit accesses the block in the first mode, the same voltage is applied to the first and second word lines throughout the operation, and when the control circuit accesses the block in the second mode, the same voltage is applied to the second and third word lines throughout the operation.

Abstract: Systems, methods and/or devices that enhance the reliability with which data can be stored in and read from a memory utilize an error indicator, obtained from using one reading threshold voltage for decoding, to adaptively determine the reading threshold voltage(s) used for subsequent decoding attempts. For example, in some implementations, the method includes initiating performance of a first read operation, using a first reading threshold voltage, to obtain a first error indicator, and further includes initiating performance of a second set of additional read operations using two or more second reading threshold voltages, the second reading threshold voltages determined in accordance with the first error indicator, to obtain a second error indicator. In some embodiments, when the first error indicator is greater than a first threshold, a difference between two of the second reading threshold voltages is greater than when the first error indicator is less than a first threshold.

Abstract: An apparatus includes a detector circuit and a data buffer. The detector circuit may be configured to (i) identify a start of a command sequence associated with a directed access to a memory system and (ii) generate a control signal indicating a non-consecutive clock associated with the start of said command sequence. The data buffer circuit may be configured to initialize a condition of a receiver circuit in response to the control signal prior to reception of a first data bit associated with the command sequence.

Abstract: This technology provides an electronic device. An electronic device in accordance with an implementation of this document includes semiconductor memory, and the semiconductor memory includes a free layer having a variable magnetization direction; a pinned layer having a pinned magnetization direction; and a tunnel barrier layer interposed between the pinned layer and the free layer, wherein the free layer includes: a first ferromagnetic material; a second ferromagnetic material having a coercive force smaller than that of the first ferromagnetic material; and an amorphous spacer interposed between the first ferromagnetic material and the second ferromagnetic material.

Abstract: A memory device may include: at least one memory bank; and a control circuit suitable for: refreshing the at least one memory bank through a first refresh operation in response to a refresh command; and refreshing the at least one memory bank through a second refresh operation when an active operation is performed between a current refresh command and a previous refresh command.

Abstract: An integrated circuit for storing data comprises a memory cell array comprising a plurality of bit cells (BC1, . . . , BCn) comprising a first and a second one of the bit cells (BC1, BC2) having a static random access memory architecture. The first and the second bit cells (BC1, BC2) are coupled to a common wordline (WL_TOP) and are arranged in different columns (C1, C2) of the memory cell array (100). During a write access to the first bit cell (BC1), the first bit cell (BC1) undergoes a write operation, whereas the second bit cell (BC2) is a half-selected bit cell which undergoes a pseudo read operation. The integrated circuit uses a two-phase write scheme to improve the write-ability in low operating voltage environment.

Abstract: A non-volatile storage system includes a three dimensional structure comprising vertical columns of memory cells and a managing circuit in communication with the vertical columns. The managing circuit applies one or more patterns of stress voltages to the vertical columns, with different voltages applied to each vertical column of pairs of adjacent vertical columns being tested for shorts. The managing circuit tests for a short in the pairs of adjacent vertical columns after applying the one or more patterns of stress voltages. In one embodiment, the test may comprise programming a memory cell in each vertical column with data that matches the pattern of stress voltages, reading from the memory cells and determining whether data read matches data programmed. The applying of the stress voltages and the testing can be performed as part of a test during manufacturing or in the field during user operation.

Abstract: A semiconductor memory device includes a memory circuit including a plurality of memory cells and a refresh control circuit. The refresh control circuit is configured to determine a number of times to perform a target row refresh (TRR) in response to a mode register set (MRS) code signal, wherein the MRS code signal is generated in response to a temperature change, and the refresh control circuit is configured to maintain a refresh cycle of at least two of the memory cells for a period of time when the refresh cycle is changed due to the temperature change.

Abstract: A non-volatile semiconductor memory device includes a first memory cell above a substrate and electrically connected to a first word line, a second memory cell above the first memory cell and electrically connected to a second word line, and a controller. The controller is configured to execute a write operation that includes a first step in which a first voltage is applied to a selected word line and to a non-selected word line, a second step after the first step in which a program voltage is applied to the selected word line, and a third step after the second step in which a second voltage higher than the first voltage is applied to the non-selected word line. A time period between a start of the second step and a start of the third step is different depending on whether the first or second memory cell is being written.

Abstract: Methods of operating a memory device having embedded leak checks may mitigate data loss events due to access line defects, and may facilitate improved power consumption characteristics. Such methods might include applying a program pulse to a selected access line coupled to a memory cell selected for programming, verifying whether the selected memory cell has reached a desired data state, bringing the selected access line to a first voltage, applying a second voltage to an unselected access line, applying a reference current to the selected access line, and determining if a current flow between the selected access line and the unselected access line is greater than the reference current.

Abstract: A memory array includes a plurality of memory cells arranged in a matrix, each memory cell including a cell transistor and a variable resistance element connected to an end of the cell transistor, and a cell transistor performance measuring cell including a MOS transistor. The cell transistor performance measuring cell is used to stabilize resistance values in a low resistance state and a high resistance state of the variable resistance element irrespective of variations in the cell transistor and thereby improve read characteristics and reliability characteristics of a nonvolatile semiconductor storage device.

Abstract: Technology for verifying cell programming for a phase change memory array is disclosed. In an example, a method may include sending a reset pulse to a phase change memory cell. The method may further include sensing a threshold voltage of the phase change memory cell in response to applying first and second verify voltages across the phase change memory cell, where the second verify voltage is lower than the first verify voltage. The method may also include determining whether the threshold voltage of the phase change memory cell was below the first or second verify voltages.

Abstract: A memory module includes a command/address (CA) register, memory devices, and a module resistor unit mounted on a circuit board. The centrally disposed CA register drive the memory devices one or more internal CA signal(s) to arrangements of memory devices using multiple CA transmission lines, wherein the multiple internal CA transmission lines are commonly terminated in the module resistor unit.

Abstract: The present disclosure relates to an electronic device, and more particularly, to a peripheral circuit, semiconductor memory device, and an operating method of the semiconductor memory device and/or peripheral circuit. The method of operating the semiconductor memory device may include turning on pass transistors.

Abstract: A memory device may include a plurality of memory banks, a row control signal input unit suitable for receiving a plurality of row control signals, a column control signal input unit suitable for receiving a plurality of column control signals, a row control unit suitable for selecting a memory bank and a row in response to the row control signals, and controlling a row operation for the selected row, and a column control unit suitable for selecting a memory bank and column in response to the column control signals, and controlling a column operation for the selected column.