Patents Examined by Roberto Velez
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Patent number: 12761249Abstract: The present application provides a current monitoring device and a current monitoring method based on the current monitoring device. The current monitoring device includes: a magnetic ring, formed by a magnetic medium and having an air gap, the magnetic ring being used for being sleeved on a wire to be measured; a current sensor located in an air gap, a sensitive axis of the current sensor is parallel to tangent direction corresponding to center point projected by the current sensor on the magnetic ring, the current sensor including a magnetic sensing circuit having a magneto-resistive sensor, and the magnetic sensing circuit being used for outputting a first voltage signal which varies with a resistance value of the magneto-resistive sensor; a post-processing circuit is electrically connected to a current sensor. The post-processing circuit is used for analyzing a current of a wire to be measured according to a first voltage signal.Type: GrantFiled: July 19, 2024Date of Patent: October 13, 2026Assignee: Zhongshan Power Supply Bureau of Guangdong Power Grid Co Ltd.Inventors: Xiangfeng Zhou, Chunyuan Cai, Yongjian Li, Lifei Li, Weixia Jian, Yanhe Yin, Lei Liu, Zhenjiang Chen, Hua Li, Huibin Zhou, Shaoyan Jiang
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Patent number: 12761259Abstract: A test system implemented method is for measuring the noise margin of a repeating signal under test (SUT). The method includes determining a digitizer noise of a digitizer channel of the test system, and applying the repeating SUT to the digitizer channel of the test system. An oversampled equivalent-time waveform representation of the repeating SUT is acquired, and then a filtered waveform representation is obtained. A noise margin om of the repeating SUT is determine in accordance with the equation ?m=(?c2+?i2??d2)1/2, where ?c is a standard deviation of a maximum amount of gaussian noise that can added to the filtered waveform representation without its symbol error rate (SER) exceeding a target value, ?i is a standard deviation of the digitizer noise, and ?d is a standard deviation of the noise components removed to obtain the filter waveform representation.Type: GrantFiled: August 23, 2024Date of Patent: October 13, 2026Assignee: KEYSIGHT TECHNOLOGIES, INC.Inventor: David Leyba
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Patent number: 12758114Abstract: A non-invasive method for analyzing liquid implants in the deep anatomical planes of humans is described, which uses magnetic resonance imaging (MRI) spectroscopy combined with nuclear magnetic resonance (NMR) spectroscopy to obtain data on the structure and properties of the implanted material, making it possible to identify its origin, type and quantity in order to speed up interventions in the event of adverse events, or even for analysis and diagnostic purposes.Type: GrantFiled: May 3, 2024Date of Patent: October 13, 2026Inventors: Rodrigo Cadore Mafaldo, Danuza Dias Mafaldo, Elenilson De Godoy Alves Filho, Lorena Mara Alexandre E Silva
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Patent number: 12761172Abstract: A method of measuring impedance, includes: providing an input voltage (Vin) across an impedance determination circuit comprising a first resistance (R1) and a known second resistance (R2) connected in series, the first resistance being switchable between a known first resistance and a dust build up resistance between a dust sensor and a process wall; switching the first resistance to the dust build up resistance; measuring an output voltage (Vo) across the second resistance or the dust build up resistance; and determining the dust build up resistance based on Vin, Vo, and R2.Type: GrantFiled: October 7, 2024Date of Patent: October 13, 2026Assignee: Dust Company, Inc.Inventor: Frederick E. Frantz
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Patent number: 12742798Abstract: An example printed circuit board (PCB) with integrated current sense includes a direct current (DC) bus including a first DC trace and a second DC trace. The PCB with integrated current sense further includes a planar Rogowski coil positioned between the first DC trace and the second DC trace and electrically separated from the first DC trace and the second DC trace. The planar Rogowski coil can extend beyond an edge-to-edge distance between a first side edge and a second side edge of the first DC trace in a first direction. The planar Rogowski coil can further extend beyond an edge-to-edge distance between a first edge and a second edge of the second DC trace in the first direction.Type: GrantFiled: April 3, 2024Date of Patent: September 22, 2026Assignee: VIRGINIA TECH INTELLECTUAL PROPERTIES, INC.Inventors: Matthias Spieler, Dong Dong, Rolando Burgos
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Patent number: 12710468Abstract: The present disclosure relates to a method and system of developing and executing a test program for verifying a device under test (DUT).Type: GrantFiled: March 28, 2024Date of Patent: August 18, 2026Assignee: MICROTEST S.P.A.Inventor: Giuseppe Amelio
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Patent number: 12710486Abstract: A magnetic field sensor for detecting a magnetic field. The sensor includes a magneto-optical material, an excitation light source configured to emit excitation radiation for exciting electronic states of the magneto-optical material, a microwave source configured to generate an electromagnetic field for feeding a resonator structure, a detector configured to detect fluorescent radiation that the magneto-optical material may emit as a result of irradiation with the excitation radiation, a magnetic field generating apparatus arranged and configured to generate a permanent magnetic field in the region of the magneto-optical material, a resonator structure, arranged on a dielectric, configured to shape the electromagnetic field emitted by the microwave source in such a way that a microwave field is created that is suitable for manipulating spin states of the magneto-optical material.Type: GrantFiled: September 27, 2024Date of Patent: August 18, 2026Assignee: ROBERT BOSCH GMBHInventors: Kai Worms, Julian Kassel, Andreas Brenneis, Florian Mauch
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Patent number: 12704534Abstract: In a method for determining a superconducting impedance matched parametric amplifier, a center wavelength parameter, a gain parameter, and a bandwidth parameter of the superconducting impedance matched parametric amplifier are determined. An impedance value of an impedance matching line of the superconducting impedance matched parametric amplifier and a capacitance value of the amplifier are determined based on the wavelength parameter, the gain parameter, and the bandwidth parameter. A line width dimension of a coplanar waveguide of the superconducting impedance matched parametric amplifier is calculated based on the impedance value of the impedance matching line. A stub dimension of the superconducting impedance matched parametric amplifier is calculated based on the impedance value of the impedance matching line and the capacitance value of the amplifier.Type: GrantFiled: August 23, 2024Date of Patent: August 11, 2026Assignee: Tencent Technology (Shenzhen) Company LimitedInventors: Shuoming An, Maochun Dai, Jingjing Hu, Wenlong Zhang, Dengfeng Li, Shengyu Zhang
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Patent number: 12699137Abstract: A test and measurement instrument includes one or more processors to acquire first, second, and third phase drive signals applied to a three-phase motor. A motor drive analyzer performs a direct-quadrature-zero, DQZ, transformation on the acquired first, second, and third phase drive signals to produce direct (D), quadrature (Q), and zero (Z) components, and generates an overlapped DQ phasor plot illustrating the D and Q components along with frequency domain representations of the D and Q components. The motor driver analyzer displays, on a user interface, the generated overlapped DQ phasor plot and an overlapped DQ spectra plot from the frequency domain representations of the D and Q components to enable a user to detect motor defects through visual characteristics of the overlapped DQ phasor and DQ spectra plots. The motor driver analyzer removes an offset and filters the D and Q components prior generating the overlapped DQ phasor plot.Type: GrantFiled: April 8, 2024Date of Patent: August 4, 2026Assignee: Tektronix, Inc.Inventors: Krishna N H Sri, Niranjan R Hegde, Shubha B, Christopher J. Loberg
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Patent number: 12687583Abstract: A method, a battery management system, and an article of manufacture for testing a battery system are disclosed. The battery system can include a plurality of battery modules. A test process is performed with respect to the battery system via the battery management system that includes a controller device and a plurality of module interface devices. For each battery module of the plurality of battery modules, a respective module interface device of the plurality of module interface devices is operatively coupled to anode and cathode terminals of that battery module. Each module interface device can include a measurement circuit and a switching circuit. The test process can be used to independently connect, disconnect, and measure various operating conditions of the battery modules and load.Type: GrantFiled: July 31, 2024Date of Patent: July 21, 2026Assignee: The Boeing CompanyInventors: Robert J. Atmur, Deborah A. Beron-Rawdon
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Patent number: 12687575Abstract: One exemplary embodiment relates to a circuit which is integrated into a semiconductor substrate and which comprises a lateral field effect transistor having a drift region and a field plate electrode, which is isolated from the drift region by an isolation zone. The integrated circuit further comprises a first terminal, which is coupled to the field plate electrode, for applying a test voltage to the field plate electrode in a test operating mode. An electronic switch is configured to connect the field plate electrode to a circuit node that is at a reference voltage in a normal operating mode of the integrated circuit. The integrated circuit further comprises a second terminal, which is connected to a control terminal of the electronic switch and is configured to receive a control signal for switching on or off the electronic switch.Type: GrantFiled: December 22, 2023Date of Patent: July 21, 2026Assignee: Infineon Technologies AGInventors: Till Schloesser, Axel Reithofer, Jens Barrenscheen
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Patent number: 12681047Abstract: [Problem] The purpose of the present invention is to facilitate the insertion of a probe into two or more guide plates. [Solution] The present invention is provided with: a probe body 600 accommodated in a guide unit 30 for a probe card 1, the guide unit 30 comprising a first guide plate 301 and a second guide plate 302 disposed with a gap therebetween, and supported by a first guide hole 311 of the first guide plate 301 and a second guide hole 312 of the second guide plate 302; and a leader rod 610 that has a substantially linear shape with one end thereof connected to the probe body 600, that is inserted into the first guide hole 301 earlier than the probe body 600, and that can be separated from the probe body 600 after passing through the second guide hole 302.Type: GrantFiled: March 16, 2022Date of Patent: July 14, 2026Assignee: JAPAN ELECTRONIC MATERIALS CORPORATIONInventors: Kazuo Yokoyama, Masaya Inoue, Yuusuke Miyagawa
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Patent number: 12681053Abstract: A sensor integrated circuit includes a sensing circuit configured to generate the sensor output signal and a fault circuit to detect a fault and generate a fault signal indicative of the fault. A combined signal indicative of the fault signal when a fault is detected and indicative of a reference voltage associated with the sensor IC at other times is provided at a shared connection of the sensor IC. Embodiments include a current sensor IC and fault detectors configured to detect one or more faults.Type: GrantFiled: February 2, 2024Date of Patent: July 14, 2026Assignee: Allegro MicroSystems, LLCInventors: Matthew Hein, Benjamin Damkroger
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Patent number: 12644918Abstract: A testing device for testing a high or medium-voltage cable comprises a circuit arrangement with a test voltage generator, which comprises a low voltage-side earthing input and a high voltage-side output and is designed to provide a variable test voltage, a test specimen connection for connecting the high voltage-side output to a conductor of the cable, a protective earth connector for connecting to protective earth, a connecting conductor which electrically connects the low-voltage-side earth input to the protective earth connector, so that the connecting conductor represents a current collection point through which a measuring current flows during the test, and a high-frequency signal pick-up at the current collection point, at which a high-frequency pre-location signal is generated based on the measuring current.Type: GrantFiled: March 19, 2024Date of Patent: June 2, 2026Assignee: b2 electronics GMbHInventors: Stefan Baldauf, Christian Mathies, Joseph Kruijen
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Patent number: 12631781Abstract: A method and/or system comprising: disposing a bottom hole assembly into a wellbore, wherein the bottom hole assembly comprises: a transmitter sub comprising a transmitter coil; a first receiver sub comprising a first receiver coil; transmitting an electromagnetic wave into a subterranean formation with the transmitter coil; receiving a plurality of response signals with the first receiver coil, wherein the plurality of response signals are from two or more depths and are formed from the electromagnetic wave interacting with the subterranean formation. Additionally, the method and/or system may be configured to analyze a gradient of the response signals to determine if the gradient exceeds a threshold, wherein the threshold indicates a presence of a fracture or fault.Type: GrantFiled: December 27, 2023Date of Patent: May 19, 2026Assignee: Halliburton Energy Services, Inc.Inventors: Hsu-Hsiang Wu, Jin Ma, Yi Jing Fan
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Patent number: 12631680Abstract: This application discloses a testing structure for locating a source of a plasma damage. A testing substructure corresponding to a selected metal layer includes a first MOS transistor, a first gate lead, a first antenna and a monitoring gate pad. The first gate lead is composed of a metal wire of the selected metal layer. The first antenna is connected with the first gate lead. The first gate lead is connected with a first gate conductive material layer of the first MOS transistor. The first antenna, the first gate lead and the first gate conductive material layer form a first pathway for accumulating plasma charges towards a surface of a first gate dielectric layer. The monitoring gate pad is connected with the first gate lead. This application further discloses a testing method for locating a source of a plasma damage. This application can locate the source of the plasma damage.Type: GrantFiled: August 20, 2024Date of Patent: May 19, 2026Assignee: Shanghai Huali Microelectronics CorporationInventors: Yekai Zhu, Yueqin Zhu, Ke Zhou
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Patent number: 12625165Abstract: [Problem] The objective is to provide a probe card that are less prone to contact failure, with good high-frequency characteristics, current endurance, and good conductivity.Type: GrantFiled: December 6, 2021Date of Patent: May 12, 2026Assignee: JAPAN ELECTRONIC MATERIALS CORPORATIONInventor: Chikaomi Mori
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Patent number: 12625162Abstract: A test socket is provided and includes a base with a first surface, a second surface opposing the first surface and through holes, a conductive elastic sheet located on the first surface, and a plurality of elastic metal members with first contact ends facing toward the conductive elastic sheet. The first contact ends include bumps suitable for inserting into the conductive elastic sheet, and each elastic metal member may be prevented from being contaminated by covering the base with the conductive elastic sheet. When the elastic metal members are pressured to insert the bumps into the conductive elastic sheet, a low resistance better than the resistance of the elastic metal members without squeezing can be obtained. When the bumps are inserted into the conductive elastic sheet, the surface of the bumps can be cleaned and the elastic metal members are stably in contact with the conductive elastic sheet.Type: GrantFiled: February 15, 2024Date of Patent: May 12, 2026Assignee: WinWay Technology Co., Ltd.Inventors: Po-Han Yeh, Chia-Pin Sun
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Patent number: 12618869Abstract: Provided is a rotating body inspection apparatus for an electrification component, the rotating body inspection apparatus including a main sprocket on which a rotating body is seated and which is shaped as a disk and rotates, a sub sprocket shaped as a disk and rotating, a connection portion connecting the main sprocket to the sub sprocket, and a linear conversion portion which is connected to the sub sprocket and which converts a rotational movement into a linear movement, wherein a diameter of the sub sprocket is less than a diameter of the main sprocket.Type: GrantFiled: December 19, 2022Date of Patent: May 5, 2026Assignee: VIEWON CO., LTD.Inventors: Young Wook Yoon, Young Yeop Yoon
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Patent number: 12618870Abstract: Proposed is a vertical probe card capable of effectively testing the electrical characteristics of a test object without a body thereof being elastically bent or curved in a convex shape in the horizontal direction by pressure applied to opposite ends thereof.Type: GrantFiled: July 29, 2022Date of Patent: May 5, 2026Assignee: POINT ENGINEERING CO., LTD.Inventors: Bum Mo Ahn, Seung Ho Park, Sung Hyun Byun