Abstract: A method is provided. The method may include providing a substrate, the substrate comprising a substrate surface, the substrate surface having a three-dimensional shape. The method may further include directing a depositing species from a deposition source to the substrate surface, wherein a layer is deposited on a deposition region of the substrate surface. The method may include performing a substrate scan during the directing or after the directing to transport the substrate from a first position to a second position. The method may also include directing angled ions to the substrate surface, in a presence of the layer, wherein the layer is sputter-etched from a first portion of the deposition region, and wherein the layer remains in a second portion of the deposition region.

Abstract: A processing device according to one embodiment includes an object placement unit, a source placement unit, a collimator, and a temperature adjusting unit. The object placement unit is configured to have an object arranged. The object placement unit is configured to have an object placed thereon. The source placement unit is arranged apart from the object placement unit and configured to have a particle source placed thereon, the particle source being capable of ejecting a particle toward the object. The collimator configured to be arranged between the object placement unit and the source placement unit, includes walls, and is provided with through holes formed by the walls and extending a direction from the object placement unit to the source placement unit. The temperature adjusting unit is configured to adjust a temperature of the collimator.

Abstract: Coating method for arc coating or arc ion plating coating of substrates in a vacuum chamber in which using an arc evaporator solid material that functions as cathode is evaporated, during arc evaporation the motion of the cathode spot on the solid material surface is accelerated using a magnetic field for avoiding ejection of a large amount of macro-particles or droplets from the solid material surface, negative charged particles resulted from the arc evaporation flow from the cathode to an anode, characterized by the motion of the negative charged particles from the cathode to the anode fundamentally doesn't cause an additional increase of the absolute value of the potential difference between cathode and anode allowing a lower increment of the substrate temperature during coating.

Abstract: A cylindrical sputtering target includes a plurality of cylindrical sintered compacts adjacent to each other while having a space therebetween. The plurality of cylindrical sintered compacts have a relative density of 99.7% or higher and 99.9% or lower. The plurality of cylindrical sintered compacts adjacent to each other have a difference therebetween in the relative density of 0.1% or smaller.

Abstract: An inflator of a vacuum atmosphere conversion chamber is provided. The inflator comprises a first charging pipe including a first valve body, a second charging pipe including a second valve body, a pressure monitoring and judging module, an oxygen concentration monitoring and judging module and a control module. The pressure monitoring and judging module is connected separately to the vacuum atmosphere conversion chamber and the control module, the oxygen concentration monitoring and judging module is connected separately to the vacuum atmosphere conversion chamber and the control module, and the control module is connected separately to the first valve body and the second valve body. An inflation method of vacuum atmosphere conversion chamber and a vacuum sputtering equipment are also provided. The inflator, the inflation method and the vacuum sputtering equipment can switch the charging gases, for eliminating the safety hazard on the basis of solving the oxidation issue effectively.

Abstract: A deposited amorphous carbon film includes at least 95% carbon. A percentage of sp3 carbon-carbon bonds present in the amorphous carbon film exceeds 30%, and a hydrogen content of the amorphous carbon film is less than 5%. A process of depositing amorphous carbon on a workpiece includes positioning the workpiece within a process chamber and positioning a magnetron assembly adjacent to the process chamber. The magnetron assembly projects a magnetic field into the process chamber. The method further includes providing a carbon target such that the magnetic field extends through the carbon target toward the workpiece. The method further includes providing a source gas to the process chamber, and providing pulses of DC power to a plasma formed from the source gas within the process chamber. The pulses of DC power are supplied in pulses of 40 microseconds or less, that repeat at a frequency of at least 4 kHz.

Abstract: A sputtering target comprising a target material, wherein a sputtering face of the target material has a ramp provided to reduce a thickness of the target material at a position where erosion concentrates most intensively during sputtering.

Abstract: The fluoro-based polymer composite target for sputtering according to the present invention is excellent in adhesion with a metal electrode to which a voltage is applied, can prevent bending, and is capable of stably forming plasma by imparting conductivity even with industrially widely used DC and MF power supply systems, thereby allowing a fluorinated polymer to be effectively deposited on an adherend by sputtering.

Abstract: Magnetron, magnetron sputtering chamber, and magnetron sputtering apparatus are provided. The magnetron has a rotation center, and includes a first outer magnetic pole and a first inner magnetic pole of opposite polarities. The first outer magnetic pole has an annular structure around the rotation center. The first inner magnetic pole is located on the inner side of the first outer magnetic pole, and a first magnetic field track is formed between the first inner magnetic pole and the first outer magnetic pole. A straight line starting from the rotation center and along one of the radial directions passes through the first magnetic field track at least twice in succession, and the magnetic-field directions at the two positions of the first magnetic field track that the straight line passes through twice in succession are opposite to each other.

Abstract: There is provided a cathode unit for a sputtering apparatus, having a construction in which a target can be replaced without opening a vacuum chamber to the atmosphere. The cathode unit having targets and being adapted to be mounted on a vacuum chamber has: a supporting frame mounted on an external wall of the vacuum chamber; an annular moveable base supported by the supporting frame in a manner to be movable toward or away from the vacuum chamber; a rotary shaft body rotatably supported by the movable base in a manner to be elongated through an inner space of the movable base in parallel with a sputtering surface of the target; provided an axial direction of the rotary shaft body is defined to be an X-axis direction, and a forward or backward direction orthogonal to the X-axis direction of the movable base is defined to be a Z-axis direction.

Abstract: Provided is an oxide grain-dispersed ferromagnetic material sputtering target having a fine structure which can effectively reduce abnormal discharge and generation of particles caused by oxide grains. A sintered sputtering target contains, as metal or an alloy, 0 mol % or more and 45 mol % or less of Pt, 55 mol % or more and 95 mol % or less of Co, and 0 mol % or more and 40 mol % or less of Cr; and further contains at least two kinds of oxides. The oxides are present in the metal or alloy, and the standard deviation of the number density of oxides is 2.5 or less.

Abstract: A portable sputtering apparatus for repairing the damaged surface on aircrafts comprises: a cylindrical chamber, having a top chamber plate and a bottom chamber plate. The cylindrical chamber comprises a welded flange for attachment to a high vacuum system and a first tube and flange assembly for attachment to an inert gas bottle. The top chamber plate comprises a cathode housing, comprising a cathode coated with the material to be sputtered onto the surface of the aircraft, and a second tube and flange assembly for discharge of pressure within the chamber. The bottom chamber plate comprises a second housing that attaches to the surface of an aircraft. Within the second housing is a metal sheet, having an aperture that allows sputtered material to flow onto the surface of the aircraft. The material to be sputtered may be carbon composite or copper.

Abstract: A Cu—Ga alloy sputtering target of the present invention is made of a Cu—Ga alloy, in which a carbon concentration is 30 ppm by mass or lower. In an observed structure, an area ratio of crystal grains having a grain size of 10 ?m or less is 5% to 50% and an area ratio of crystal grains having a grain size of 100 ?m or more is 1% to 30%.

Abstract: An AC power connector for connecting an AC power supply with a device is provided. The AC power connector includes at least one first element connectable with the AC power supply and at least one second element connectable with the device, the first element and the second elements being arranged at a first distance with respect to each other for defining a capacitance, wherein the at least one first element and the at least one second element are rotatable with respect to each other, wherein the first element and the second element are configured for a transfer of an AC power between the at least one first element and the at least one second element.

Abstract: Through the present invention, a thin film containing an FePt-based alloy and carbon, the thin film being capable of being used as a magnetic recording medium, is enabled to be formed using one target, and amount of particles is enabled to be reduced. An FePt—C-based sputtering target containing Fe, Pt, and C, wherein the FePt—C-based sputtering target has a structure in which a C phase substantially being C is dispersed in an FePt-based alloy phase containing 33 mol % or more and 60 mol % or less of Pt with the balance substantially being Fe, an average value of the size indices a of the C phase is 4.0 ?m or more and 9.0 ?m or less, and an average value of the nonspherical indices b of the C phase is 3.0 or more.

Abstract: A processing system includes: a vacuum chamber; a plurality of processing sub-systems attached around the vacuum chamber; and a wafer handling system in the vacuum chamber for moving the wafer among the plurality of processing systems without exiting from a vacuum. A physical vapor deposition system for manufacturing an extreme ultraviolet blank comprising: a target comprising molybdenum, molybdenum alloy, or a combination thereof.

Abstract: Provided is a substrate/oriented apatite-type composite oxide film complex which is suitable as a solid electrolyte for a battery, a sensor, a separation membrane, or the like, and can be produced inexpensively. Proposed is a substrate/oriented apatite-type composite oxide film complex provided with an oriented apatite-type composite oxide film on a substrate, wherein a film thickness of the oriented apatite-type composite oxide film is 10.0 ?m or less, a degree of orientation (Lotgering method) thereof is 0.6 or more, and a material of the substrate at a side on which at least the oriented apatite-type composite oxide film is formed is a metal, an alloy, a ceramic, or a composite material thereof.

Abstract: A substrate processing apparatus includes a supporting table having a mounting region for a substrate. A rotation shaft supporting a shutter extends in a vertical direction. The shutter is moved between a first region above the supporting table and a second region by rotating the rotation shaft about its central axis. The shutter includes a pipe having gas output holes. When the shutter is disposed in the first region, the gas output holes are located outside the mounting region in a rotation direction from the second region toward the first region. The minimum distance between the central axis and the gas output holes is smaller than or equal to the minimum distance between the central axis and the mounting region. The maximum distance between the central axis and the gas output holes is greater than equal to the maximum distance between the central axis and the mounting region.

Abstract: A device includes a housing unit and a number of magnets. The housing unit includes a number of holes therein. The magnets are positioned in the holes. The magnets have a same pole orientation. It is appreciated that the magnets are positioned in the holes to form a mechanically balanced and magnetically unbalanced structure.

Abstract: A process for manufacturing an electrochromic glazing unit includes forming, on one face of a glass sheet, a complete all-solid-state electrochromic stack including in succession a first layer of a transparent conductive oxide; a layer of a cathodically colored mineral electrochromic material to form an electrochromic electrode; a layer of an ionically conductive mineral solid electrolyte; a layer of a cation intercalation material to form a counter electrode; and a second layer of a transparent conductive oxide; then heat treatment of the complete electrochromic stack by irradiation with radiation having a wavelength comprised between 500 and 2000 nm, the radiation originating from a radiating device placed facing the electrochromic stack, a relative movement being created between the radiating device and the substrate so as to raise the electrochromic stack to a temperature at least equal to 300° C. for a brief duration, for example shorter than 100 milliseconds.