Patents Examined by Roshin K Varghese
  • Patent number: 11087901
    Abstract: An electrical component cover includes a central portion, a first end portion and a second end portion and one or more flexible portions between the central portion and the first end portion or second end portion to enable the electrical component cover to flex and thereby facilitate varying geometries in power lines attached to insulators.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: August 10, 2021
    Assignee: KADDAS ENTERPRISES INC.
    Inventor: James J. Kaddas
  • Patent number: 11068027
    Abstract: A magnetic flexible cable disposed in the housing of a device has an extended position to engage with a corresponding receptacle on another device. The flexible magnetic cable includes a flanged end that limits the distance of extension when the flexible magnetic cable is in the extended position. A retractor can retain the flexible magnetic cable fully within the housing of the first device when the flexible magnetic cable is not engaged with the corresponding receptacle on the second device.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: July 20, 2021
    Assignee: Intel Corporation
    Inventors: Mark Sprenger, Jim Okuley, Aleksander Magi
  • Patent number: 10681803
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and a flatness improvement portion disposed on an upper portion of the second ground.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: June 9, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Byung Hoon Jo, Sang Pil Kim, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10512158
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: December 17, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10325696
    Abstract: In an electrical cable of the type having an outer sheath enclosing a conductor assembly comprising a plurality of insulated conductors disposed within a binder, the binder having a crush resistance for protecting the insulated conductors, an improvement in which a strength enhancer is mixed within the conductor insulation such that the binder can be removed without decreasing a crush resistance of the electrical cable.
    Type: Grant
    Filed: June 2, 2010
    Date of Patent: June 18, 2019
    Assignee: Southwire Company, LLC
    Inventor: Richard Temblador
  • Patent number: 10320175
    Abstract: A mechanical link includes a carrier for supporting a conductor within a mechanical link. The mechanical link may include a first arm and a second arm, the second arm being arranged for movement with respect to the first arm, and a flexible helical carrier for supporting a conductor, wherein the flexible helical carrier is received within the first and second arms. The carrier may be, or may include a generally helical member of a flexible material, the generally helical member comprising a continuous support portion having on both sides thereof upstanding wall portions.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: June 11, 2019
    Assignee: ULTRA ELECTRONICS LIMITED
    Inventor: Phil Keen
  • Patent number: 10225934
    Abstract: A circuit board (01), including at least two electrically conductive layers (02) arranged one above the other and at least one dielectric layer (03), which is arranged between adjacent electrically conductive layers (02), is provided. The circuit board (01) is characterized in particular in that the plate has at least two magnetically conductive layers (05), wherein each magnetically conductive layer (05) is arranged at least indirectly adjacent to an electrically conductive layer (02), and that the circuit board also has vertical recesses for accommodating magnetic vias (08) for connecting the magnetically conductive layers (05) in a specific manner. A method for producing such a circuit board (01) is provided.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: March 5, 2019
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventor: Joerg Kegeler