Patents Examined by Roy Potto
  • Packaging structure of BGA type semiconductor device mounted on circuit substrate
    Patent number: 6020638
    Abstract: A packaging structure of a semiconductor device having a BGA type package structure. The packaging structure has a circuit substrate for mounting a semiconductor device having a BGA type package structure thereon, a semiconductor device having the BGA type package structure in which BGA balls that are external terminals are electrically connected to the circuit substrate, and insulating resin charged between the circuit substrate and the semiconductor device.
    Type: Grant
    Filed: June 24, 1998
    Date of Patent: February 1, 2000
    Assignee: NEC Corporation
    Inventor: Yutaka Kobayashi