Abstract: The present invention is used with single devices mounted on a ceramic substrate. The devices are broken out of the sheet, after all testing, electrical conditioning, and screening, as small surface mount devices. Conductive strips are formed on the ceramic substrate and are spaced to match a standard circuit board edge connector. These strips are electrically connected to the devices to allow testing and burn-in in sheet form rather than testing each device individually. The design reduces handling of the individual devices. The invention allows all of the testing and assembly to be done in a "batch" fashion. The board that is used to test the devices is separated to create the package for the individual components. The technique of the invention reduces cost and handling damage.

Abstract: In a prescaler IC test method for carrying out a characterization test to decide whether or not a prescaler IC is normal by the use of an IC tester for carrying out a predetermined decision operation and a probe card for mounting the prescaler IC kept on a wafer, the prescaler IC carries out a frequency dividing operation on reception of a frequency signal to produce a frequency divided signal. The characterization test comprises the steps of generating the frequency signal to supply the frequency signal to the prescaler IC on reception of a direct current control signal, converting the frequency divided signal into a converted signal having a predetermined signal width and a signal level, detecting a first mean value of the signal level, and supplying the first mean value to the IC tester in the form of a direct current signal. The IC tester is supplied with the first mean value and carries out the predetermined decision operation by the use of the first mean value.