Abstract: Structures for an optical coupler and methods of forming a structure for an optical coupler. The structure comprises a stacked waveguide core including a first waveguide core and a second waveguide core. The first waveguide core includes a first tapered section, and the second waveguide core includes a second tapered section positioned to overlap with the first tapered section. The structure further comprises a third waveguide core including a third tapered section positioned adjacent to the first tapered section of the first waveguide core and the second tapered section of the second waveguide core.

Abstract: An optical modulator includes a modulation region, an input port, an output port, and a modulation actuator. The modulation region includes an inhomogeneous arrangement of two or more different materials having different refractive indexes to structure the modulation region to manipulate one or more optical properties of an optical carrier wave in response to a modulation bias. The input port is optically coupled to the modulation region to inject the optical carrier wave into the modulation region. The modulation actuator is disposed proximate to the modulation region and adapted to apply the modulation bias to the modulation region to generate a modulated wave. The modulation bias adjusts at least one of the different refractive indexes of the inhomogeneous arrangement to provide variable control of the one or more optical properties of the optical carrier wave. The output port is optically coupled to the modulation region to receive the modulated wave.

Abstract: An example optical fiber signal mode conversion apparatus includes a non-single-mode optical fiber and a single-mode optical fiber. The single-mode optical fiber forms, with the non-single-mode optical fiber, a first coupling region and a second coupling region along a signal transmission direction in the non-single-mode optical fiber, where an effective refractive index of a fundamental mode signal of the single-mode optical fiber in the first coupling region is equal to an effective refractive index of a signal in a first mode, the signal in the first mode is coupled to a fundamental mode channel of the single-mode optical fiber, and an effective refractive index of the fundamental mode signal of the single-mode optical fiber in the second coupling region is equal to an effective refractive index of a signal in a second mode.

Abstract: A resin composition for secondary coating of an optical fiber is a resin composition comprising: a non-reactive urethane compound having a number average molecular weight of 10000 or more and 40000 or less, a photopolymerizable compound, and a photopolymerization initiator, wherein the content of the non-reactive urethane compound is 0.05 parts by mass or more and 10 parts by mass or less based on the total amount of the resin composition of 100 parts by mass, and the non-reactive urethane compound is a reaction product of a polyol having a number average molecular weight of 1800 or more and 4500 or less, a diisocyanate, and a compound having active hydrogen.

Abstract: A Photonic Integrated Circuit (PIC) includes N Ring and Disk type Microstructures (RDMs), N is an integer and greater than 1; at least one spare RDM, wherein each RDM operates spectrally in a periodic nature and has its spectral operation vary by temperature; and circuitry configured to handoff any of the N RDMs and the at least one spare RDM for spectral operation based on a current temperature. For the handoff, the at least one spare RDM is unlocked spectrally and is tuned and locked to a frequency of interest of a current RDM based on the temperature, and the current RDM is unlocked.

Abstract: Provided is an optical control element that can minimize an optical path difference between branched waveguides while reducing a difference in structure between the branched waveguides by disposing an input portion and an output portion of an optical waveguide on the same side of a substrate on which the optical waveguide is formed.

Abstract: Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, a compute die over the package substrate, and an optics die over the package substrate. In an embodiment, the optics die comprises grating couplers. In an embodiment, an optical connector for optically coupling optical fibers to the grating couplers is provided. In an embodiment, the optical connector comprises a fiber array unit (FAU), where the FAU has a turn. In an embodiment, the optical connector further comprises a fiber shuffler, where the fiber shuffler comprises a first V-groove with a first depth and a second V-groove with a second depth that is greater than the first depth. In an embodiment, the optical connector further comprises a ferrule.

Abstract: A multi-fiber reel and adapter assembly includes a base, a cable reel mounted to the base, and a plurality of adapters fixedly mounted to the base. The cable reel is configured to rotate relative to the base and the adapters, and each of the adapters is configured to couple a fiber optic cable from the cable reel with a fiber optic drop cable that is configured to run from the respective adapter to a location of an end user that is remote from the assembly.

Abstract: The present invention relates to a photonic chip carried out by the combination and interconnection of equally-oriented Programmable Photonics Processing Blocks, with all their longitudinal axes in parallel, implemented over a photonic chip that is capable of implementing one or multiple, simultaneous photonics circuits with optical feedback paths and/or linear multiport transformations, by the appropriate programming of its resources and the selection of its input and output ports. The invention also relates to a parallel field-programmable photonic array (P-FPPA) comprising of, at least one programmable circuit based on equally-oriented/parallel tunable beam-splitters with independent coupling and phase-shifting configuration and peripheral high-performance building blocks.

Abstract: Examples described herein relate to an optical device that entails phase shifting an optical signal. The optical device includes an optical waveguide having a first semiconductor material region and a second semiconductor material region formed adjacent to each other and defining a junction therebetween. Further, the optical device includes an insulating layer formed on top of the optical waveguide. Moreover, the optical device includes a III-V semiconductor layer formed on top of the insulating layer causing an optical mode of an optical signal passing through the optical waveguide to overlap with the first semiconductor material region, the second semiconductor material region, the insulating layer, and the III-V semiconductor layer thereby resulting in a phase shift in the optical signal passing through the optical waveguide.

Abstract: A package includes a first die with a compute element and first region, a second die with a compute element and second region, and a bridging element connecting the first and second dies. The bridging element includes interconnect regions for electrical coupling, a first photonic path from the first interconnect region to the second, and a second photonic path in the reverse direction. A photonic transceiver is integrated into the bridging element, with one portion sending and receiving optical signals via the photonic paths, and the other portion located in an AMS block in the first die or second die near the memory and compute elements. The transceiver portions are connected by a short electrical interconnect (less than 2 mm).

Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component, an optical component, and a connection element. The photonic component includes an optical transmission portion, which includes a plurality of first terminals exposed from a first surface of the photonic component. The optical component faces the first surface of the photonic component. The optical component is configured to transmit optical signals to or receive optical signals from the optical transmission portion. The connection element is disposed between the first surface of the photonic component and the optical component. The connection element is configured to reshape the optical signals.

Abstract: A high density fiber enclosure system includes a chassis, cassette trays, an optional unification clip, cassettes, and an optional trunk cable management system. The chassis, cassette trays, and cassettes are configured such that individual cassettes may be installed, removed, and otherwise positioned for easy access by a user. The unification clip allows two adjacent cassette trays to be connected to one other such that cassette trays move as one unit. The trunk cable management system is designed to organize trunk cables and trunk cable furcation legs as well as relieve strain on the trunk cables and trunk cable furcation legs.

Abstract: The present invention relates to a method of re-connecting a first optical fiber (12) with a second optical fiber (34), the first fiber (12) and the second fiber (34) each having a plurality of outer cores, comprising: (a) positioning a first end section of the first fiber (12) and a second end section of the second fiber (34) in proximity so as to be aligned with one another along a longitudinal axis of the first and second end sections in a current connection position including a current connection orientation, in which a current relative rotational angle between the first and second end sections about the longitudinal axis is not known with respect to a relative rotational angle between the first and second end sections in a registered connection orientation determined with respect to a coordinate system during a previous connection of the first fiber (12) with the second fiber (34); (b) optically interrogating the outer cores of the first and second fibers (12, 34) through the current connection position

Abstract: A variable optical attenuator (VOA) may include an input collimator with an input fiber connected on one side and an output collimator with an output fiber connected on one side, where the collimators are on a same surface of a VOA enclosure. A retroreflector may receive a light beam from the input collimator and reflect the light beam to the output collimator. The VOA may include an attenuation element positioned between the input collimator and the retroreflector and/or another attenuation element positioned between the retroreflector and the output collimator to provide variable attenuation to the light beam. The attenuation elements may be moved to set an attenuation level by one or more adjustment elements such as a miniature motor. The attenuation element may include a gradient index (GRIN) element, a polarizer, a neutral density filter, or a wavelength tunable filter.

Abstract: A photonic chip including an optical coupler capable of transferring an optical signal between a first waveguide made of III-V material and a second waveguide made of silicon, this optical coupler including a first extension made of III-V material which extends the core of the first waveguide, a second extension made of silicon which extends the core of the second waveguide, and a SiGe inclusion buried inside of the second extension, this inclusion being made of SiGe whose chemical formula is Si1?xGex, where x is in the range between 0.2 and 0.5, and being optically coupled, on a first side, to the first waveguide and, on a second opposite side, to the second waveguide.

Abstract: A connectorized fiber optic cabling assembly includes a loose tube fiber optic cable and a connector assembly. The cable has a termination end and includes an optical fiber bundle including a plurality of optical fibers, at least one strength member, and a jacket surrounding the optical fiber bundle and the strength member. The connector assembly includes a rigid portion and defines a fiber passage. The connector assembly is mounted on the termination end of the cable such that the optical fiber bundle extends through at least a portion of the fiber passage. The plurality of optical fibers undergo a transition from a ribbonized configuration to a loose, non-ribbonized configuration in the rigid portion of the connector assembly.

Abstract: A package includes a first die with a bridging element with a first interconnect region, a first photonic transceiver portion, a second interconnect region, a first photonic path to an optical interface (OI), and a second photonic path from the OI to the first photonic transceiver portion. The first interconnect region electrically couples the first photonic transceiver portion to a second photonic transceiver portion in an analog/mixed-signal die (AMS die), while the second interconnect region connects a third photonic transceiver portion in a general die to the second photonic transceiver portion using an electrical coupling embedded in the first die. The electrical interconnects in the first interconnect region are less than two millimeters in length.

Abstract: A semiconductor design that uses high refractive index material between low refractive index material. This structure may act as an optical waveguide.

Abstract: An optical ferrule (200) includes an input surface (10) for receiving and transmitting a central light ray (21) from an optical fiber (20) attached to the optical ferrule. A light redirecting side (30) receives, along a first direction (40), the central light ray (21) transmitted by the input surface (10) and redirects the received light along a different second direction (41). The redirected central light ray (23) exits the optical ferrule through an output surface (50) of the optical ferrule. As the central light ray (21) propagates in the optical ferrule from the input surface (10) to the output surface (50), the central light ray (21) propagates through distinct first and second portions (60,70) of the optical ferrule having different respective first and second compositions.