Abstract: A dishwasher with a tub at least partially defining a washing chamber, a liquid spraying system, a liquid recirculation circuit, and a liquid filtering system where the liquid filtering system includes a rotating filter and where a granular agent contacts the rotating filter to clean the filter. Methods of cleaning a rotating filter provided within a liquid flow by scouring the filter with a granular agent.

Abstract: Embodiments of the invention generally relate to methods of removing and/or cleaning a substrate surface having different material layers disposed thereon using water vapor plasma treatment. In one embodiment, a method for cleaning a surface of a substrate includes positioning a substrate into a processing chamber, the substrate having a dielectric layer disposed thereon forming openings on the substrate, exposing the dielectric layer disposed on the substrate to water vapor supplied into the chamber to form a plasma in the water vapor, maintaining a process pressure in the chamber at between about 1 Torr and about 120 Torr, and cleaning the contact structure formed on the substrate.

Abstract: Blockages of turbomachine cooling circuit cooling holes resulting from coating processes can be removed by introducing a cleaning agent into the cooling circuit. The cooling circuit can be connected to a cleaning agent supply under pressure, adding force on the blockage to chemical action by the cleaning agent. The cleaning agent is chemically reactive with the coating material and substantially chemically non-reactive with the underlying material of the cooling circuit and other parts of the turbomachine. A neutralization agent can also be introduced to reduce toxicity and/or action of the cleaning agent. A turbomachine cooling hole cleaning method includes introducing a cleaning agent into a cooling circuit of a turbomachine part, pressurizing the cleaning agent in the cooling circuit until a first defined condition is met, and introducing a neutralization agent to the turbomachine part while the cleaning agent is applied to the cooling circuit.

Abstract: A clean-in-place system for piping systems uses a pig train having a dry ice and glycol section. The pig train is moved through the piping system as part of a cleaning sequence. The system and method of the disclosure provide an alternative, effective clean-in-place system that significantly reduces water, chemical and energy usage as well as significantly reducing the related environmental impact.

Abstract: A substrate cleaning apparatus includes: a substrate holder configured to hold and rotate a substrate; an ultrasonic cleaning unit configured to impart an ultrasonic vibration energy to deaerated pure water and then supply the deaerated pure water onto a surface of the substrate; a pure water spray nozzle configured to spray deaerated pure water onto the surface of the substrate; a chamber surrounding the substrate holder and the pure water spray nozzle; and an inert gas supply line configured to supply an inert gas into the chamber.

Abstract: A system for capturing dust during the movement of sand between a container and a fracing blender includes a conveyor system having a lateral portion for transporting sand discharged from the container, a lifting portion for lifting sand received from the lateral portion, and a spout for discharging sand received from the lifting portion into a bin of the fracing blender. An enclosure encloses a substantial length of the lateral portion of the conveyor, with portions of the enclosure disposed above and along opposing sides of a belt of the lateral portion of the conveyor system. A manifold is supported on the ground and is coupled in fluid communication with a flexible conduit, which has an inlet disposed in an area proximate a discharge end of the spout. An air system is coupled in fluid communication with the manifold and the flexible conduit for drawing air through the inlet of flexible hose to capture dust around the discharge end of the spout.

Abstract: A plasma processing apparatus includes a processing chamber, in which a wafer W is plasma-processed, and a CPU controlling an operation of each component. A processing gas is introduced into the processing chamber under a first condition defined by a flow rate and a molecular weight of the processing gas, specifically based on a magnitude of a product A1 (=Q1×m1) of the flow rate Q1 and the molecular weight m1 of the processing gas, and a surface of the wafer W is physically or chemically etched. And then, a pre-purge gas which may be identical to or different from the processing gas is introduced into the processing chamber through a shower head under a second condition derived from the first condition.

Abstract: A cleaning device (14) for cleaning mop material (33) which freely hangs from a holder (31,32), having an opening (15) in which the hanging mop material (33) is receivable, including a pair of bristle carrying parts (22, 24), each of the bristle carrying parts (22, 24) being rotatable about a respective axis (22a, 24a) by at least one motive device in opposite senses of direction such as to draw the hanging mop material (33) between the bristle carrying parts (22, 24), whereby bristles carried by the bristle carrying parts (22, 24) engage the mop material, and a method of cleaning mop material which freely hangs from a holder, using the cleaning device (14), the method including resisting the drawing-in of the mop material between the bristle carrying parts (22, 24), so that the bristles act on and brush the mop material.

Abstract: A method of cleaning an area using an automatic cleaning device may include receiving, from a video camera, information associated with an edge located on a surface, determining, by an automatic cleaning device, a position of the automatic cleaning device on the surface relative to the edge and using the received information to move the automatic cleaning device from the determined position along a path so that the automatic cleaning device cleans the surface along the path. The path may be substantially parallel to the edge, and the edge may be located a distance from a reference point on the automatic cleaning device during movement of the automatic cleaning device.

Abstract: System and method for CMP station cleanliness. An embodiment comprises a chemical mechanical polishing (CMP) station comprising a housing unit covering the various components of the CMP station. The CMP station further comprising various surfaces of a slurry arm shield, a slurry spray nozzle, a pad conditioning arm shield, a platen shield, a carrier head; and the interior, vertical surfaces of the housing unit. A cleaning liquid delivery system configured to dose a cleaning liquid on the various surfaces of the CMP station at set intervals.

Abstract: A substrate processing method includes a rinsing step of supplying water of a first temperature to a surface of a silicon substrate to apply a rinsing process using the water to the silicon substrate surface, a second temperature water supplying (coating) step of supplying water of a second temperature lower than the first temperature to the silicon substrate surface after the rinsing step, and a drying step of rotating the silicon substrate after the second temperature water supplying step to spin off the water on the silicon substrate surface to a periphery of the silicon substrate and thereby dry the silicon substrate.

Abstract: A dishwasher with a tub at least partially defining a washing chamber, a liquid spraying system, a liquid recirculation circuit, and a liquid filtering system where the liquid filtering system includes a rotating filter and where a granular agent contacts the rotating filter to clean the filter. Methods of cleaning a rotating filter provided within a liquid flow by scouring the filter with a granular agent.

Abstract: A device and method for processing wafer-shaped articles comprises a process chamber and a rotary chuck located within the process chamber. The rotary chuck is adapted to be driven without physical contact through a magnetic bearing. The rotary chuck comprises a series of gripping pins adapted to hold a wafer shaped article in a position depending downwardly from the rotary chuck. The rotary chuck further comprises a plate that rotates together with the rotary chuck. The plate is positioned above an area occupied by the wafer-shaped article, and shields upper surfaces of the process chamber from liquids flung off of a wafer-shaped article during use of the rotary chuck.

Abstract: A hole cleaning apparatus includes a member, a brush, and a vacuum source. The brush rotates around a longitudinal axis of the member, or translates in a direction which is substantially parallel to the longitudinal axis of the member. The vacuum source provides vacuum suction within the member.

Abstract: Blockages of turbomachine cooling circuit cooling holes resulting from coating processes can be removed by introducing a cleaning agent into the cooling circuit. The cooling circuit can be connected to a cleaning agent supply under pressure, adding force on the blockage to chemical action by the cleaning agent. The cleaning agent is chemically reactive with the coating material and substantially chemically non-reactive with the underlying material of the cooling circuit and other parts of the turbomachine. A neutralization agent can also be introduced to reduce toxicity and/or action of the cleaning agent.

Abstract: A cleaning method for a UV chamber involves providing a first cleaning gas, a second cleaning gas, and a purge gas to one or more openings in the chamber. The first cleaning gas may be an oxygen containing gas, such as ozone, to remove carbon residues. The second cleaning gas may be a remote plasma of NF3 and O2 to remove silicon residues. The UV chamber may have two UV transparent showerheads, which together with a UV window in the chamber lid, define a gas volume proximate the UV window and a distribution volume below the gas volume. A purge gas may be flowed through the gas volume while one or more of the cleaning gases is flowed into the distribution volume to prevent the cleaning gases from impinging on the UV transparent window.

Abstract: A cleaning or care device for the cleaning or care of medical or dental instruments, having a cleaning or care chamber in which at least two connections for the instruments to be cleaned are provided, and a supply device for supplying the at least two connections with a cleaning or care agent. The at least two connections and the supply device can be moved relative to one another in such a way that one of the connections can be connected to the supply device and supplied with a cleaning or care agent, while another of the connections is not connected to the supply device and cannot be supplied with a cleaning or care agent. A corresponding method for the cleaning or care of medical or dental instruments with such a cleaning or care device is also described.

Abstract: A device (5), arranged for fluid communication with a washing chamber (2) of a dishwasher (1), the device further being arranged to allow a passage of air (9) between the washing chamber and the device, the device comprising a drying material (10) arranged in a bed (11), the drying material being able to withdraw moisture from the air passing through the bed during a withdrawal step, and release moisture to the air during a regeneration step, a heating element (13) arranged in the bed arranged to heat the drying material during the regeneration step such that moisture is released from the drying material, and a fan (14), arranged to circulate the air between the device and the washing chamber such that the air flow rate during the withdrawal step is higher than the air flow rate during the regeneration step by altering the fan speed.

Abstract: The present invention provides a method of cleaning steel sheet, said method of cleaning steel sheet feeding a cleaning solution activated by ultrasonic waves of a frequency of 0.8 MHz to 3 MHz to a surface of steel sheet at an angle inclined by 1 to 80° with respect to a line perpendicular to the surface of the steel sheet in a direction opposite to the running direction, thereby enabling megasonic waves to be applied to cleaning of running steel sheet and improving the cleaning effect and cleaning speed, and a continuous cleaning system of steel sheet.

Abstract: A device for cleaning a fixed abrasive polishing pad includes a main body having a surface facing the polishing pad, an inlet coupled to an end of the main body and configured to supply a cleaning liquid, an inject orifice coupled to the inlet for injecting the cleaning liquid and being provided on the surface of the main body, an outlet coupled to the end of the main body, and a recycle orifice coupled to the outlet, and being provided on the surface of the main body.