Patents Examined by S. C. Buczinksi
  • Integrated circuit packages
    Patent number: H73
    Abstract: A package for wire-bonded semiconductor integrated circuit chips is disclosed. The chip is covered by a protective layer of material such as room temperature vulcanizing silicone rubber. The thickness of the layer is such that it covers a portion of the arched wires, thereby concentrating the stresses away from the wire-ball bond interfaces. The chip is encapsulated in a plastic material while providing an air gap between the plastic and protective layer.
    Type: Grant
    Filed: August 25, 1983
    Date of Patent: June 3, 1986
    Assignee: AT&T Bell Laboratories
    Inventors: Kenneth K. Claasen, Ronald N. Graver, Frank P. Pelletier, Kurt M. Striny, Ronald J. Wozniak