Abstract: The present disclosure relates to the technical field of semiconductor technologies and discloses a semiconductor device and a manufacturing method therefor. The method includes forming a growth substrate by providing a substrate structure containing a sacrificial substrate, a first dielectric layer on the sacrificial substrate, and a plurality of recesses formed through the first dielectric layer and into the sacrificial substrate, by forming a buffer layer covering exposes surfaces of the plurality of recesses, by selectively growing a graphene layer on the buffer layer, and by filling the plurality of recesses with a second dielectric layer. The method further includes attaching the growth substrate to a bonding substrate such that the second dielectric layer attaches to the bonding substrate; removing the sacrificial substrate; and removing the buffer layer so as to expose the graphene layer.

Abstract: An integrated circuit is provided. The integrated circuit includes a continuous resistor body having first and second distal terminals, and a group of electrically-floating dummy conductors that are formed above the continuous resistor body, and between the first and second distal terminals of the continuous resistor body. Each of the group of dummy conductors is coupled to the continuous resistor body through a respective via structure. The group of dummy conductors serves to dissipate heat for the continuous resistor body. If desired, an active conductor is interposed in the dummy conductors and serves as a center-tap for the continuous resistor body. The active conductor is connected to a contact node on the substrate.

Abstract: A ground working tool comprising a tubular base body with an inner receiving space for receiving a cylindrical core of solid ground material, connector mechanism for connecting the tubular base body with a rotary drive and locking mechanism for locking the core in the receiving space of the tubular base body. The locking mechanism involves at least one locking unit having a guide rail being disposed at an inner side of the tubular base body and arranged with a deviation angle relative to a tangential direction of the tubular base body and the locking unit further comprises at least one locking element, which is moveably mounted on the guide rail between a radially outer releasing position and a radially inner locking position, in which the core is clamped within the receiving space by means of the at least one locking element.