Patents Examined by Sam Chuan Yad
  • Process for manufacturing a printed circuit board and printed circuit board
    Patent number: 5560795
    Abstract: Producing a printed circuit board having at least two layers and having a carrier board, a first Conductor layer having contact areas and a second conductor layer having connecting areas, in which a conductive foil, provided with an adhesive coating, is laminated onto the carrier board having the first conductor layer and the contact areas, the adhesive coating an the conductive foal having holes which correspond with the contact areas of the first conductor layer.
    Type: Grant
    Filed: August 2, 1994
    Date of Patent: October 1, 1996
    Assignee: Philips Electronics N.V.
    Inventors: Helmut Bruckner, Siegfried Kopnick, Werner Uggowitzer