Abstract: An electrical joint using spheroidal tipped leads improves the strength of a connection regardless of the material used to bond the connections. Axial leads of a component are formed into spheroids using an appropriate heat source to melt a small portion of the lead tip. Melting a portion of the lead alloys the lead with any non-wettable solder mask rendering a wettable spheroid. Surface tension in the molten metal forms the spheroid. The spheroid increases the area to which solder or other bonding agent adheres to. Solder mask remaining on the lead decreases solder wicking further up the lead. Reduced solder wicking retains the compliance of the lead. Controlled melting of the lead maintains planarity for multileaded components.

Abstract: A method and apparatus for feeding preform wire into a preform dispenser, cutting a piece of preform, transferring the preform to a location over an integrated circuit ceramic package, and placing the preform in the package prior to placing and attaching a die in the ceramic package.

Abstract: An arrangement for the exchange of implements in foundry or mold casting hines, in which the implement is moved from a changing station towards an implement receiving and work station, and there connected with the implement holder.