Patents Examined by Scott J Hawramak
  • Semiconductor wafer having identification indication and method of manufacturing the same
    Patent number: 6268641
    Abstract: An identification indication is formed on a side surface of a semiconductor wafer, and thus even if various treatment processes are repeatedly conducted for forming a semiconductor circuit, or even by the wrapping treatment on the rear side of the wafer, the identification indication cannot disappear or become unclear so that the identification indication can be clearly recognized at least until the process for cutting the wafer into chips.
    Type: Grant
    Filed: March 30, 1998
    Date of Patent: July 31, 2001
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroyuki Yano, Katsuya Okumura