Patents Examined by Seab D Andrish
  • Patent number: 10941895
    Abstract: In an embodiment, a plug formulation includes a mixture of a first part of a two-part epoxy system and artificial platelets formed from a polymeric material that expands upon exposure to ultraviolet (UV) light, moisture, or heat, wherein a portion of the first part of the two-part epoxy system is covalently bonded to a portion of the artificial platelets. In another embodiment, a plug formulation includes a mixture of a first part of a two-part epoxy system, an acrylate monomer, and artificial platelets formed from a polymeric material that expands upon exposure to ultraviolet (UV) light, moisture, or heat, wherein a portion of the first part of the two-part epoxy system is covalently bonded to a portion of the artificial platelets.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: March 9, 2021
    Assignee: International Business Machines Corporation
    Inventors: Sarah K. Czaplewski, Joseph Kuczynski, Melissa K. Miller, Jing Zhang