Patents Examined by Seth Dumbris
  • Decorative component and article including the same
    Patent number: 11019890
    Abstract: A decorative component includes: a frame fixed to an article; a body-to-be-suspended; and a suspending portion provided to the frame. The suspending portion suspends the body-to-be-suspended such that the body-to-be-suspended is swingable about an imaginary swing axis. The body-to-be-suspended and the suspending portion are held in contact with each other at two contact points located on the imaginary swing axis. The frame covers a part of a periphery of one of the two contact points in one of outer ranges, and covers a part of a periphery of another one of the two contact points in another one of the outer ranges, the parts being not covered with the article.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: June 1, 2021
    Assignee: Crossfor Co., Ltd.
    Inventor: Hidetaka Dobashi
  • Sn-plated steel sheet and method for manufacturing Sn-plated steel sheet
    Patent number: 11021806
    Abstract: A Sn-plated steel sheet according to the present invention includes a steel sheet, a Sn-plated layer that is provided on at least one surface of the steel sheet, and a film that is provided on a surface of the Sn-plated layer and includes zirconium oxide and tin oxide, in which an amount of the zirconium oxide in the film is 0.2 mg/m2 to 50 mg/m2 in terms of metal Zr amount, in a depth direction analysis by X-ray photoelectron spectroscopy, a depth position A at which an element concentration of Zr present as the zirconium oxide is maximum is positioned closer to a surface of the film than a depth position B at which an element concentration of Sn present as the tin oxide is maximum, and a distance between the depth position A and the depth position B in a depth direction is 0.5 nm or more.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: June 1, 2021
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Shintaro Yamanaka, Shigeru Hirano, Masakazu Noda, Yasuhiko Sato
  • Method for manufacturing copper foil with rough surface in plating tank and its product
    Patent number: 11008665
    Abstract: A method for manufacturing a copper foil with a rough surface in a plating tank includes causing an electrolyte solution to flow between an anode and a cathode with a current density of 5 ASF-40 ASF. The copper foil with a rough surface including dense nodules of single copper crystals is deposited on the cathode. The electrolyte solution includes chloride ions (20 ppm-80 ppm), polyethylene glycol (PEG) with a molecular weight of 400-8000 (100 ppm-700 ppm), sulfuric acid (20 g/L-200 g/L), copper sulfate pentahydrate (70 g/L-320 g/L) and a sulfur compound (1 ppm-60 ppm).
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: May 18, 2021
    Assignee: NATIONAL CHUNG HSING UNIVERSITY
    Inventors: Wei-Ping Dow, Liang-Jie Lin, Chia-Hsiang Chen
  • Multilayer ceramic substrate and electronic device
    Patent number: 11011441
    Abstract: A multilayer ceramic substrate that includes a first layer positioned at a surface of the multilayer ceramic substrate, a second layer adjacent the first layer and positioned inward of the first layer, and a surface layer electrode disposed on a surface of the first layer. The first layer has a porosity of 13% or less and a maximum pore size of 10 ?m or less. The second layer has a porosity of 14% or less and a maximum pore size of 11 ?m or less.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: May 18, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Seiji Fujita
  • Stainless steel sheet and stainless steel foil
    Patent number: 11008636
    Abstract: A stainless steel foil having a chemical composition comprising, by mass %, C: 0.015% or less, Si: 0.50% or less, Mn: 0.50% or less, P: 0.040% or less, S: 0.010% or less, Cr: 10.0% or more and less than 16.0%, Al: 2.5 to 4.5%, N: 0.015% or less, Ni: 0.05 to 0.50%, Cu: 0.01 to 0.10%, Mo: 0.01 to 0.15%, at least one selected from the group consisting of Ti: 0.01 to 0.30%, Zr: 0.01 to 0.20%, Hf: 0.01 to 0.20%, and REM: 0.01 to 0.20%, where Ti+Zr+Hf+2REM?0.06 and 0.30?Ti+Zr+Hf are satisfied.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: May 18, 2021
    Assignee: JFE STEEL CORPORATION
    Inventors: Akito Mizutani, Mitsuyuki Fujisawa
  • Discrete metallic particles and multilayer structures comprising reflective core layers
    Patent number: 10998639
    Abstract: A metallic component including a metallic material and having a skin depth ? of greater than or equal to 1.0 ?m in a frequency range from 20-40 GHz, as calculated by: ? = 2 ? ? ( 2 ? ? ? ? f ) ? ( ? 0 ? ? r ) ? 5 ? 0 ? 3 ? ? ? r ? f . In this equation, ? is skin depth in meters (m); ? is resistivity in ohm meter (?·m); f is frequency of an electromagnetic radiation in hertz (Hz); ?0 is permeability; and ?r is relative permeability of the metallic material. The metallic component may be a discrete metallic particle or a layer in a multilayer thin film.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: May 4, 2021
    Assignees: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
    Inventors: Debasish Banerjee, Songtao Wu, Naohide Uchida, Takeshi Yamakawa, Hidetaka Asano
  • Nickel-chromium particles and multilayer structures comprising nickel chromium core layers
    Patent number: 10998638
    Abstract: A metallic component including NiCr and having a skin depth ? of greater than or equal to 1.0 ?m in a frequency range from 20-40 GHz, as calculated by: ? = 2 ? ? ? ( 2 ? ? ? ? ? f ) ? ( ? 0 ? ? r ) ? 503 ? ? ? ? r ? f . In this equation, ? is skin depth in meters (m); ? is resistivity in ohm meter (?·m); f is frequency of an electromagnetic radiation in hertz (Hz); ?0 is permeability; and ?r is relative permeability of the NiCr metallic material. The metallic component may be a discrete metallic particle or a layer in a multilayer thin film.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: May 4, 2021
    Assignees: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
    Inventors: Debasish Banerjee, Songtao Wu, Naohide Uchida, Takeshi Yamakawa, Hidetaka Asano
  • Calcium sulphate-based products
    Patent number: 10988413
    Abstract: This invention relates to improved high temperature resistant calcium sulphate-based products e.g. gypsum wallboard products and, in particular, to products having reduced shrinkage at high temperatures. The invention provides calcium sulphate-based product comprising gypsum and a shrinkage resistance additive. The shrinkage resistance additive is melamine polyphosphate or melamine pyrophosphate.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: April 27, 2021
    Assignee: CertainTeed Gypsum, Inc.
    Inventor: Robin Fisher
  • Electrolyzed copper foil and current collector of energy storage device
    Patent number: 10985378
    Abstract: An electrolyzed copper foil and a current collector of an energy storage device are provided. The electrolyzed copper foil includes a transition layer and a nano-twin copper layer formed on the transition layer. The transition layer has an equiaxial grain of a (111) plane having a volume ratio of 20-40%, a (200) plane having a volume ratio of 20-40%, and a (220) plane having a volume ratio of 20-40%. A thickness of the transition layer is 0.2 ?m to 1.5 ?m. The nano-twin copper layer has a columnar grain of the (111) plane having a volume ratio of more than 85%, and a thickness of the nano-twin copper layer is 3 ?m to 30 ?m.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: April 20, 2021
    Assignee: Industrial Technology Research Institute
    Inventors: Jhen-Rong Chen, Chiu-Yen Chiu
  • Patterning of a composition comprising silver nanowires
    Patent number: 10983615
    Abstract: The present invention relates to the production of a layer structure, comprising the following process steps: i) coating a substrate with a composition at least comprising silver nanowires and a solvent; ii) at least partial removal of the solvent, thereby obtaining a substrate that is coated with an electrically conductive layer, the electrically conductive layer at least comprising the silver nanowires; iii) bringing into contact selected areas of the electrically conductive layer with an etching composition, thereby reducing the conductivity of the electrically conductive layer in these selected areas, wherein the etching composition comprises an organic compound capable of releasing chlorine, bromine or iodine, a compound containing hypochloride, a compound containing hypo-bromide or a mixture of at least two of these compounds.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: April 20, 2021
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Wilfried Lovenich, Rüdiger Sauer, Udo Guntermann
  • Silicon-containing structure, method of preparing the same, carbon composite using the same, and electrode, lithium battery, and device each including the same
    Patent number: 10974965
    Abstract: A silicon-containing structure including: a silicon composite including a porous silicon secondary particle and a first carbon flake on a surface of the porous silicon secondary particle; a carbonaceous coating layer on the porous silicon composite, the carbonaceous coating layer comprising a first amorphous carbon; and the silicon composite comprises a second amorphous carbon and has a density that is equal to or less than a density of the carbonaceous coating layer, wherein the porous silicon secondary particle includes an aggregate of silicon composite primary particles, each including silicon, a silicon suboxide on a surface of the silicon, and a second carbon flake on a surface of the silicon suboxide.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: April 13, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: Jongseok Moon, Mijong Kim, Sewon Kim, Kyueun Shim, Sungsoo Han, Inhyuk Son, Jumyeung Lee, Minwoo Lim
  • Electrolytic copper foil and electrode and copper-clad laminate comprising the same
    Patent number: 10975487
    Abstract: Provided are an electrolytic copper foil, and an electrode and a copper-clad laminate comprising the same. The electrolytic copper foil comprises a base copper layer having a drum side and a deposited side; wherein the electrolytic copper foil has a Charpy impact strength from 0.4 J/mm2 to 5.8 J/mm2.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: April 13, 2021
    Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
    Inventors: Huei-Fang Huang, Yao-Sheng Lai, Jui-Chang Chou
  • Sandwich structure with lattice having hard points
    Patent number: 10968620
    Abstract: A sandwich structure includes two face plates, with a lattice structure between the plates, and with hard points at selected locations. The face plates, and the lattice structure with its hard points, may all be made as a single continuous piece by an additive manufacturing process. The hard points may be strengthened and/or stiffened areas of the lattice that may be used for connecting fasteners, or for other purposes. The hard points may be located at the junction between the lattice and one of the faces, and may be a locally thickened portion on one of the faces, for example being a cylindrical or parallelepiped protrusion out from the face. The hard points may serve the purpose of a built-in nut plate, such as themselves containing threaded holes, or by having a threaded inserts put into holes or recesses in the hard points.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: April 6, 2021
    Assignee: Raytheon Company
    Inventor: Andrew Truxel
  • Sliding member
    Patent number: 10955003
    Abstract: Provided is a sliding member including: a back-metal layer and a sliding layer including a copper alloy. The back-metal layer includes a hypoeutectoid steel including 0.07 to 0.35 mass % of carbon and has a structure including a ferrite phase and pearlite. The back-metal layer has a high ferrite phase portion at a bonding surface between the back-metal layer and the sliding layer. A volume ratio Pc and a volume ratio Ps satisfy Ps/Pc?0.4, where the volume ratio Pc is a volume ratio of pearlite in the structure at a center portion in a thickness direction of the back-metal layer, and the volume ratio Ps is a volume ratio of pearlite in the high ferrite phase portion.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: March 23, 2021
    Assignee: DAIDO METAL COMPANY LTD
    Inventors: Asako Ikegami, Takaaki Kitahara
  • Boron nitride nanotube-magnesium alloy composites and manufacturing methods thereof
    Patent number: 10947607
    Abstract: Boron nitride nanotube (BNNT)-magnesium (Mg) alloy composites and methods of fabricating the same are provided. The BNNT-Mg alloy composites can have a sandwich structure and can be fabricated by high-pressure spark plasma sintering. A mat of BNNTs can be sputter-coated with Mg, and then sandwiched between Mg alloy particles, followed by a sintering step. The BNNTs can include a hexagonal boron nitride phase.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: March 16, 2021
    Assignee: The Florida International University Board of Trustees
    Inventors: Arvind Agarwal, Pranjal Nautiyal, Benjamin Peter Boesl
  • Steel sheet coated with a metallic coating based on aluminum and comprising titanium
    Patent number: 10947608
    Abstract: A steel sheet coated with a metallic coating is provided. The coating includes from 1.0 to 22.0% by weight of zinc, from 0.1 to 1.0% by weight of titanium, from 1.6 to 15.0% by weight of silicon, below 0.5% by weight of magnesium, below 0.05% by weight of La or Ce or both, below 0.2% by weight of Sn and optionally, less than 0.3% by weight of additional elements chosen from Sb, Pb, Ca, Mn, Cr, Ni, Zr, In, Hf or Bi. A balance of the coating includes aluminum and optionally unavoidable impurities and residual elements. A microstructure of the coating does not include Al—Zn binary phases. A coated part is also provided.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: March 16, 2021
    Assignee: ArcelorMittal
    Inventors: Christian Allely, Tiago Machado Amorim, Beril Corlu, Joost De Strycker
  • Sliding member
    Patent number: 10941810
    Abstract: Provided is a sliding member capable of realizing the wear resistance effect by Si particles. The sliding member includes an aluminum alloy layer containing 7.0% by mass or more and 13.0% by mass or less of Sn, 6.5% by mass or more and 12.0% by mass or less of Si, 0.5% by mass or more and 3.0% by mass or less of Cu, unavoidable impurities, and a balance Al. Si particles are dispersed in the aluminum alloy layer. A Vickers hardness of a matrix of the aluminum alloy layer is 40 HV or more and 60 HV or less. A load resistance value, which is a product of a volume concentration and average area of the Si particles and the Vickers hardness of the matrix, is 0.00001 N or more and 0.00029 N or less.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: March 9, 2021
    Assignee: TAIHO KOGYO CO., LTD.
    Inventor: Maki Aoki
  • Automotive member having resistance weld
    Patent number: 10940556
    Abstract: Provided is an automotive member, or particularly, a steel sheet having a tensile strength exceeding 900 MPa. The automotive member has a resistance weld for fixing two or more steel sheets containing a predetermined composition, in which a maximum hardness (HVBM) in a heat-affected zone of the resistance weld is at least 1.1 times hardness (HVW) of a nugget in the resistance weld formed in a softest steel sheet of a sheet set during resistance welding, and furthermore, an average grain size of a steel sheet structure of the heat-affected zone within 2 mm in a direction at a right angle to a sheet thickness from an end part of the nugget of the high-strength steel sheet is 3 ?m or less, and a minimum hardness (HVmin) in the heat-affected zone is at least 90% of hardness (HV?) of the high-strength steel sheet before the resistance welding.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: March 9, 2021
    Assignee: JFE Steel Corporation
    Inventors: Katsutoshi Takashima, Hiroshi Matsuda, Rinsei Ikeda, Yoshiyasu Kawasaki
  • Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic device
    Patent number: 10925171
    Abstract: The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer on the surface of the copper foil is suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is suppressed. The surface of the roughening treatment layer satisfies one or more of the following: a roughness Ra is 0.08 to 0.20 ?m, a roughness Rz is 1.00 to 2.00 ?m, a roughness Sq is 0.16 to 0.30 ?m, a roughness Ssk is ?0.6 to ?0.35, a roughness Sa is 0.12 to 0.23 ?m, a roughness Sz is 2.20 to 3.50 ?m, a roughness Sku is 3.75 to 4.50, and a roughness Spk is 0.13 to 0.27 ?m, a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: February 16, 2021
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Yuki Ori, Hideta Arai, Atsushi Miki, Ryo Fukuchi
  • Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
    Patent number: 10925170
    Abstract: The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: February 16, 2021
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Yuki Ori, Hideta Arai, Atsushi Miki, Ryo Fukuchi