Abstract: A method of forming a carrier wafer includes the steps of: lapping a first surface and a second surface of the carrier wafer such that the carrier wafer is substantially flat, the carrier wafer comprising a glass, glass-ceramic or ceramic material, wherein the carrier wafer has a diameter of from 250 mm to 450 mm and a thickness of from 0.5 mm to 2 mm after lapping; and polishing the first surface of the carrier wafer with at least one of a differential pressure, a differential speed or a differential time between a center portion and an edge portion of the carrier wafer such that the first surface has a convex or concave shape.

Abstract: Implementations of rebar jigs may include: a ring including a first member and a second member. The first member may be configured to couple to the second member through a second connector. The rebar jig may also include a stand including a first leg, a second leg, and a support bar. The support bar may be positioned between the first leg and the second leg. The ring may be configured to receive three or more rebar thereon through at least three pegs coupled to a perimeter of the ring. The stand may couple with the ring through two or more couplers.

Abstract: Conductor identification may be provided. A first sleeve may be placed around a first conductor and a second sleeve around a second conductor. Next, a first tag may be placed on the first conductor and a second tag on the second conductor. Then, the first conductor and the second conductor may be pulled together through a conduit. The first conductor may slideably move through the first sleeve and the second conductor may slideably move through the second sleeve as the first conductor and the second conductor are pulled together through the conduit.

Abstract: Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module having a platen, and a platen temperature control system. The platen temperature control system includes a PID controller, a fluid controller, and a heat exchanger. The flow controller is configured to control an amount of fluid provided from the heat exchanger to a channels of the platen in response to instructions provided by the PID controller.

Abstract: There is disclosed a polishing apparatus which can regulate a surface temperature of the polishing pad without causing a defect such as a scratch on a substrate such as a wafer. The polishing apparatus includes: a non-contact type pad-temperature regulating device; a pad-temperature measuring device. The pad-temperature measuring device is arranged adjacent to the pad-temperature regulating device and on a downstream side of the pad-temperature regulating device in a rotation direction of a polishing table.

Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier laterally movable by an actuator across the polishing pad to hold a substrate against a polishing surface of the polishing pad during a polishing process, a thermal control system including a plurality of independently controllable heaters and coolers to independently control temperatures of a plurality of zones on the polishing pad, and a controller configured to cause the thermal control system to generate a first zone having a first temperature and a second zone having a different second temperature on the polishing pad.

Abstract: A tool including a buffer structure adapted to prevent shocks includes a tool head, a first shaft structure, and a second shaft structure. The tool head has a first connection receiving a pivot. The first shaft structure includes a slide. The second shaft structure is disposed on the slide and links with the tool head. The second shaft structure is movable on the slide such that the tool head is moved toward and away from the first shaft structure. The second shaft structure has a second connection receiving the pivot. The tool head is pivotal with respect to the second shaft structure. Further, a resilient member is disposed between the first and the second shaft structures. The second shaft structure is biased by the resilient member.

Abstract: A polishing layer is provided. The polishing layer have a surface pattern, a cross section of the surface pattern along a direction has a plurality of grooves and a plurality of polishing portions, each of the grooves is disposed between every two adjacent polishing portions, and the polishing layer comprises a body layer and a surface layer. The surface layer is disposed on a surface of the body layer, and a top of at least one of the polishing portions has at least one flattened region exposing the body layer.

Abstract: A trowel (10) is equipped with an optical detector (13) that detects a laser beam (12). The optical detector (13) may be arranged detect the laser beam (12) only when aligned with the laser beam (12). The trowel (10) provides feedback to the user when it detects the laser beam (12) and when it does not. The feedback may be a sound, a light or a haptic feedback. When the trowel (10) is used for constructing a tapered floor, such as in a bathroom, the laser beam (12) may be originated from a laser level (40) arranged on a support (30). The support (30) is positioned inside a floor drain (32), for example a bathroom floor drain (32).

Abstract: A chemical mechanical polishing system includes a polishing a port to dispense polishing liquid onto a polishing pad and a liquid flow controller to control a flow rate of the polishing liquid to the port, a temperature control system to control a temperature of the polishing pad, and a control system. The control system is configured to obtain a baseline removal rate, a baseline temperature and a baseline polishing liquid flow rate. A function is stored relating removal rate to polishing liquid flow rate and temperature. The function is used to determine a reduced polishing liquid flow rate and an adjusted temperature such that a resulting removal rate is not below the baseline removal rate. The liquid flow controller is controlled to dispense the polishing liquid at the reduced polishing liquid flow rate and control the temperature control system so that the polishing process reaches the adjusted temperature.

Abstract: A pad-temperature regulating device is disclosed, which can improve a responsiveness of a control for a surface temperature of a polishing pad and regulate the surface temperature of the polishing pad without causing defects, such as scratches, on the substrate. The pad-temperature regulating apparatus includes: a heat exchanger disposed above the polishing pad, whose temperature is maintained at a predetermined temperature; a pad-temperature measuring device configured to measure the surface temperature of the polishing pad; a distance sensor configured to measure a separation distance between the polishing pad and the heat exchanger; an elevating mechanism for moving the heat exchanger vertically with respect to the polishing pad; and a controller configured to control operation of the elevating mechanism based on measured values of the pad-temperature measuring device.

Abstract: A pressure applying system using a modular vise having a fixed base and an adjustable pusher assembly. The modular vise utilizes a bi-directional worm screw to apply a linear force from the pusher assembly to the working member relative to the fixed base. The fixed base is secured and located from below a bottom surface of the fixed base.

Abstract: Disclosed is a high-loading ratchet tool, which has a main body, a braking structure and a working part, wherein the main body forms a first receiving groove, a second receiving groove and a third receiving groove, and the second receiving groove and the third receiving groove are mainly composed of two circular surfaces, and the braking structure is disposed on the main body. The braking structure has a ratchet, and the two ends of the ratchet respectively form a first shaft segment and a second shaft segment. The first shaft segment is disposed in the second receiving groove, and the second shaft segment is disposed in the third receiving groove. According to this, the relative force of the first shaft segment and the second shaft segment and the main body is dispersed, and enhancing the working part restrictions on external torsion.

Abstract: Apparatuses for controlling fluid flow are important components for delivering process fluids for semiconductor fabrication. These apparatuses for controlling fluid flow require a variety of fluid flow components which are tightly packaged within the apparatuses for controlling flow. Servicing the apparatuses requires specialized equipment and methods which enable installation of seals in close quarters in apparatuses which are installed in the field. Seal insertion tools may be used to facilitate installation of the seals to permit efficient assembly of fluid flow components into apparatus for controlling flow.

Abstract: A tool including a buffer structure adapted to prevent shocks includes a tool head, a first shaft structure, and a second shaft structure. The tool head has a first connecting portion. The second shaft structure is attached to the slide and links with the tool head. The second shaft structure is movable with respect to the first shaft structure such that the tool head is moved toward and away from the first shaft structure. The second shaft structure has a second connecting portion receiving the pivot. The tool head is pivotal with respect to the second shaft structure. Further, a resilient member is disposed between the first and the second shaft structures. The second shaft structure is biased by the resilient member.

Abstract: Described herein is a surgical instrument holder for use with a robotic surgical system, for example, during spinal surgery. In certain embodiments, the surgical instrument holder is an interface between the robotic arm and a surgical instrument used during surgery. This interface may hold the surgical instrument precisely, rigidly, and in a stable manner while permitting a surgeon to easily and quickly install or withdraw the instrument in case of emergency.

Abstract: A polishing station for polishing a substrate using a polishing slurry is disclosed. The polishing station includes a substrate carrier having a substrate-receiving surface and a rotatable platen having a polishing pad disposed on a platen surface, where the polishing pad has a polishing surface facing the substrate-receiving surface. The polishing station includes an electromagnetic assembly disposed over the platen surface. The electromagnetic assembly includes an array of electromagnetic devices that are each operable to generate a magnetic field that is configured to pass through the polishing surface. The magnetic fields generated by the array of electromagnetic devices are oriented and configured to induce an electromagnetic force on a plurality of charged particles disposed in a polishing slurry disposed on the polishing surface. The applied magnetic field is configured to induce movement of the plurality of charged particles in a direction parallel or orthogonal to the polishing surface.

Abstract: A substrate processing apparatus according to an aspect of the present disclosure includes a substrate rotating unit, a gas-liquid separator, and an exhaust route. The substrate rotating unit is configured to hold and rotate a substrate. The gas-liquid separator is provided so as to surround an outer circumference of the substrate rotating unit to separate gas and liquid droplets. The exhaust route is provided so as to surround an outer circumference of the gas-liquid separator and discharges the gas separated by the gas-liquid separator.

Abstract: A shot processing apparatus including: a cabinet with a processing chamber formed therein, the processing chamber allowing a workpiece to be conveyed thereinto; a ejecting mechanism ejecting a shot media to a hole of the workpiece; and a conveyance device conveying the workpiece between a preparation position for the workpiece and the cabinet, wherein the conveyance device includes a plate-like rotary table provided to be rotatable about a rotation axis, being provided with a conveyor for moving the workpiece on an upper surface of the rotary table, and allowing the plurality of workpieces to be arranged thereon, the rotary table connects the conveyor to the preparation position and the cabinet at a predetermined rotational position, and the shot processing apparatus has an inspection area for inspecting a state of the hole of the workpiece, between the preparation position and the rotation axis of the rotary table.

Abstract: In one embodiment, a fluid delivery apparatus includes a vessel body having a first chamber and a second chamber disposed therein, a plurality of first delivery lines fluidly coupled to the first chamber, a dispense nozzle fluidly coupled to the second chamber, a second delivery line fluidly coupled to the second chamber, and a valve disposed between the first and second chambers. Here, fluid communication between the first chamber and the second chamber is controlled by the valve disposed therebetween. Polishing fluid components are flowed into the first chamber through the plurality of first delivery lines fluidly coupled thereto to form a batch of polishing fluid. Once formed, the batch of polishing fluid is transferred to the second chamber by opening the valve.