Patents Examined by Shawntina L. Fuqua
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Patent number: 6222161Abstract: A heat treatment table is divided into two or more regions, a heater is disposed for each region. On a predetermined portion of the heat treatment table, a plurality of sensors are disposed separately each other. A relation between temperatures of the respective portions on the heat treatment table and temperatures detected by the sensors is grasped in advance, thereby enables to surmise a temperature of the respective portion of the heat treatment table from the temperature detected by the sensors. In the case of an wafer being actually treated by placing on the heat treatment table, the temperatures detected by the sensors are observed, from these detected temperatures, the temperatures of the respective portions on the heat treatment table, that is, temperatures affecting the wafer, are surmised.Type: GrantFiled: January 7, 1999Date of Patent: April 24, 2001Assignee: Tokyo Electron LimitedInventors: Eiichi Shirakawa, Nobuyuki Sata
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Patent number: 6191395Abstract: A heating roller 10 comprises a surface layer 157 formed of a prepreg material including carbon fibers having a high tensile strength and a high elastic modulus, and a heating unit 153 mounted in the inner area of the surface layer and communicated to a power supply unit 30 formed of a prepreg material including carbon fibers having a high electric resistance. A metal material working as an electrode 20 communicated to the power supply unit 30 and the heating unit 153 is mounted to both ends of the heating roller 10. The electric resistance of the heating unit 153 is adjusted either by changing the thickness (number of laminated layers) of the prepreg material including carbon fibers, or by adjusting the mounting angle of the carbon fibers inside a prepreg material being laminated and the angle of the carbon fibers inside another prepreg material being laminated.Type: GrantFiled: September 20, 1999Date of Patent: February 20, 2001Assignee: Jamco CorporationInventors: Toru Kasai, Akiyoshi Sugawara
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Patent number: 6180922Abstract: A muffle furnace for producing dental prosthesis has a muffle into which dental material is placed and a drive to which a piston is connected. The piston is moveable by the drive into the muffle to apply pressure onto the dental material. A pressure sensing device for measuring pressure applied to the dental material is provided. The pressure sensing device has a pressure sensor and a deformation member having a first side and a second side. The first side of the deformation member is subjected to a counter force of the piston and the second side of the deformation member is fixedly attached to the muffle furnace.Type: GrantFiled: September 8, 1999Date of Patent: January 30, 2001Assignee: Ivoclar A.G.Inventors: Gottfried Rohner, Johannes Lorunser, Horst Ulbricht
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Patent number: 6163648Abstract: A heating device of the light irradiation type and a holding device which can be used for it, in which it is possible to easily effect control to make the temperature of the semiconductor wafer uniform without distortion of the guard ring occurring, even if the same heating device is used for heating semiconductor wafers of different sizes is achieved by the fact that a substrate which is subjected to heat treatment by light irradiation is fixed by not only by a guard ring but also by a concentrically disposed annular auxiliary ring with a heat capacity per unit of area which is equal to the heat capacity of the guard ring. Furthermore, several guard rings can be concentrically arranged with the outermost guard ring being fixed by a guard ring support frame.Type: GrantFiled: August 9, 1999Date of Patent: December 19, 2000Assignee: Ushiodenki Kabushiki KaishaInventors: Atsushi Moto, Shinji Suzuki
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Patent number: 6147329Abstract: The substrate unloaded from the exposure device is received at the interface unit, and then carried by the substrate carrying means to the heat treatment unit, where a heat treatment is carried out on the substrate. After that, the substrate is carried from the heat treatment unit to the cooling unit, where the substrate is cooled. After the completion of the cooling process, the substrate is carried by the carrying means from the cooling unit to the development unit, where the resist film on the substrate is developed. In this resist process, the required time for the process at the heat treatment unit is changed in accordance with the required time for the process at the exposure unit. The required time for the process at the heat treatment unit is equalized with the required time for the process at the exposure device. The required time for the process at the heat treatment process is changed by prolonging or shortening the pre-process at the heat treatment unit.Type: GrantFiled: August 21, 1998Date of Patent: November 14, 2000Assignee: Tokyo Electron LimitedInventors: Kouji Okamura, Masami Akimoto