Abstract: Circuit boards for lighting systems have identical LED landing zones printed on the board. Each zone includes at least two sets of LED contact pads. One pad set is configured to mate with contacts of an LED of a first structural type, e.g. from a first product line or manufacturer. The other pad set is configured to mate with contacts of an LED of a second type, e.g. from a different product line or manufacturer. The layout may enable an easy system re-design, e.g. to shift from one type of LED to another. Alternatively, the layout may enable one system to use LEDs of the two different types in a single LED set or array. Exemplary systems disclosed herein include an element for mixing light produced by LEDs mounted to the landing zones, such as an optical integrating cavity.

Abstract: A semiconductor device comprising a first wiring board having a plurality of external connection terminals on one side, semiconductor chips mounted on the other side of the first wiring board and electrically connected to the first wiring board by a plurality of wires, a sealing resin for sealing the semiconductor chips and the wires, and a second wiring board having a plurality of contact points on one side and bonded to the top surface of the sealing resin on the other side, wherein the upper end portions of the loops of the plurality of wires for electrically connecting the first wiring board to the semiconductor chips are exposed from the top surface of the sealing resin and electrically connected to the second wiring board.

Abstract: A high frequency module that has a structure in which a frame-shaped shield case 3 is attached to a circuit substrate 2, wherein an extending segment 331 that extends in an inward direction of the case is formed on a case side plate 31 of the shield case 3, a protruding segment 332 is formed by providing a tip end portion of the extending segment 331 so as to stand perpendicularly, and an engaging portion 332a is formed by swelling out an approximate midpoint of the protruding segment 332 in an inward direction of the case by a drawing process. Furthermore, an inserting hole 21 is formed in the circuit substrate 2 at a location that corresponds to the protruding segment 332. Then, the shield case 3 is attached to the circuit substrate 2 by inserting the protruding segment 332 into the inserting hole 21 of the circuit substrate 2 so that the engaging portion 332a is passed over.

Abstract: A flexible printed circuit board includes a flexible substrate, which has a bonding zone, a folding zone, and a folding line between the bonding zone and the folding zone, two electrically conductive contacts respectively located at the bonding zone, two lead wires each having an extension portion respectively electrically connected to the electrically conductive contacts and arranged in parallel to the folding line and a connecting portion extending integrally from the extension portion toward the folding zone, and a protective layer covered on the flexible substrate over the lead wires. The protective layer has openings corresponding to the electrically conductive contacts.

Abstract: Printed wiring boards are disclosed that include regions having different coefficients of thermal expansion. In one aspect of the invention, the regions can be matched to the coefficients of thermal expansion of devices mounted on the printed wiring board. In one embodiment, the invention includes a layer including a base material and at least one insert material that are combined using a resin. In addition, the base material and insert material are located within the same plane.

Abstract: A circuit board structure with embedded selectable passive components and a method for fabricating the same are proposed, wherein a plurality of passive components are embedded in a circuit board and a plurality of electrical connections are formed on a surface of the circuit board and electrically connected to the passive components. A circuit structure is formed close to the electrical connections for selectively forming a conductive layer thereon to electrically connect a portion of the passive components according to different electrical situations, in order to provide a set of passive components for electrical design of electronic devices.

Abstract: A twin-substrate wireless electronic module includes a main substrate, a plurality of integrated circuit chips, a frame substrate, a filter, and a shield member. The main substrate has a first surface and a second surface, and is formed with a notch that extends from the first surface through the second surface. The integrated circuit chips are surface-mounted on the first and second surfaces of the main substrate. One of the integrated circuit chips disposed on the first surface is a transceiver integrated circuit chip. The frame substrate has a first frame surface and a second frame surface. The first frame surface has a filter-mounting area aligned with the notch. The filter is surface-mounted on the filter-mounting area and is accommodated in the notch. A method for manufacturing the twin-substrate wireless electronic module is also disclosed.