Abstract: A substrate processing apparatus includes a substrate polishing unit 40 having a polishing pad for polishing a wafer W, and a top ring 41 for holding a wafer and pressing the wafer against the polishing pad. An elastic membrane 80 for holding a surface opposite to a polishing surface of the wafer W is attached to the top ring 41 as a consumable. The elastic membrane 80 is provided with a plurality of strain sensors 85 and 86 for measuring strain occurring in the elastic membrane 80 during polishing, and data of an amount of strain is read to a control device 15 by detection units 90 and 91. The control device 15 sets a processing condition such as a polishing recipe for the wafer W based on strain information of the elastic membrane 80 measured by the strain sensors.

Abstract: A double-tank water spraying mop, comprising a mop rod, a water tank housing, a first water tank, a second water tank, a water pump, a nozzle, and a distribution body, wherein the first water tank, the second water tank, the water pump, the nozzle and the distribution body are located in the water tank housing, the water pump is connected to the nozzle, after the water pump is started, the liquid entering the water pump from the first and second water tanks may be sprayed out through the nozzle; a distribution valve is further arranged in the distribution body, and under the distribution of the distribution valve, the liquid in the first water tank and the second water tank may flow into the water pump through the distribution body.

Abstract: A quick-release captive clamping pin that uses a ball-lock pin and an endcap assembly to provide a tooling assembly with both holding and clamping action with a quick-release function. The captive clamping pin may include an adjustable-length ball-lock pin inserted through the tool and workpiece, where the length adjustment is used to apply clamping force.

Abstract: The present disclosure discloses an abrasive water jet full-section cutting type cutter head and application devices. The cutter head includes a cutter head body and a rotor eccentrically arranged on a working surface of the cutter head body. The rotor revolves with the cutter head body and also rotates about its own axis. At least one first nozzle is arranged on an edge of a working surface of the rotor. At least one group of second nozzles and at least one third nozzle are arranged on the working surface of the cutter head body, and the second nozzles and the third nozzle cooperate during the rotation of the cutter head body and the rotor, then a material to be cut is cut into a plurality of concentric rings, and the first nozzle cuts off the ring material to form fragments.