Abstract: This invention provides a sticking tool capable of sticking a sticking matter to a sticking target position easily and accurately and executing the sticking operation smoothly. This sticking tool includes a casing body 2, a sticking tool main body 3 which is moved in the direction of being projected from and submerged into the casing body 2 by a pressing force F1 applied at the time of sticking operation so as to stick a patch P to the peripheral portion Xb of a punch hole Xa and an alignment portion 7 for determining a relative position of the sticking tool main body 3 to the punch hole Xa and the alignment portion 7 is so constructed to be capable of moving between an overlapping position (Q) which substantially overlaps the peripheral portion Xb of the punch hole Xa and a retraction position (R) not interfering with the sticking tool main body 3 and paper X.
Abstract: In a method for manufacturing a ceramic multilayer substrate, when a green ceramic stack prepared by stacking a plurality of ceramic green sheets is fired simultaneously with a ceramic chip electronic component disposed inside the green ceramic stack and including an external terminal electrode to produce a ceramic multilayer substrate having the ceramic chip electronic component inside, a paste layer is disposed in advance between the ceramic chip electronic component and the green ceramic stack, and these three are fired.
Abstract: A method and apparatus for applying tape tabs to a traveling web of material, for example, placement of tape tabs on a running web of disposable undergarments. A pair of wheels each has a protuberance come in contact with the running web of material, which comes in contact with an infeeding tape web. The invention allows placement of tape tabs at asymmetrical spacings, where placement of the tape from contact of the first wheel and protuberance may not be equally or centrally spaced from placement of the tape by the second wheel and protuberance.
Type:
Grant
Filed:
April 20, 2005
Date of Patent:
January 5, 2010
Assignee:
Curt G. Joa, Inc.
Inventors:
Thomas C. Meyer, Tim Parrish, Jeff W. Fritz
Abstract: A method of applying a pattern on a topography includes first applying a polymer film to an elastomer member, such as PDMS, to form a pad. The pad is then applied to a substrate having a varying topography under pressure. The polymer film is transferred to the substrate due to the plastic deformation of the polymer film under pressure compared to the elastic deformation of the PDMS member. Thus, upon removal of the pad from the substrate, the PDMS member pulls away from the polymer layer, thereby depositing the polymer layer upon the substrate.
Type:
Grant
Filed:
May 20, 2004
Date of Patent:
November 17, 2009
Assignee:
The Regents of the University of Michigan
Inventors:
Li Tan, Yen-Peng Kong, Stella W. Pang, Albert F. Yee
Abstract: The present application is related to substrates having light transmitting areas and light shielding areas. The application discloses methods of manufacturing the substrates, including modifying a light shielding layer be contact to a structured surface.
Type:
Grant
Filed:
May 13, 2005
Date of Patent:
September 29, 2009
Assignee:
3M Innovative Properties Company
Inventors:
Jeffrey O. Emslander, John R. David, Ronald S. Steelman, Danny L. Fleming, Robert K. Galkiewicz, Graham M. Clarke
Abstract: In accordance with the invention, substrate-supported linear arrays are formed by the steps of adhering a thin layer of polymer between a pair of substrates and separating the substrates perpendicular to the layer. The polymer layer separates to form substrate-supported polymer gratings on both substrates, each grating having a period proportional to the thickness of the layer. The process has been used to make gratings with periods in the sub-micron range or larger over areas covering square centimeters.
Type:
Grant
Filed:
September 29, 2004
Date of Patent:
September 15, 2009
Assignee:
Princeton University
Inventors:
William B Russel, Stephen Y Chou, Leonard F Pease, III, Parikshit A Deshpande
Abstract: A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.
Abstract: Method for printing objects, whereby these objects (15) are provided with a multi-layered print, characterized in that to this aim, on one hand, two or more layers of printing medium (10-11-12), which at least partially are situated one above the other, are provided on a supple carrier (13) and, on the other hand, these layers (10-11-12) are simultaneously transferred onto the object (15) to be printed by bringing said carrier (13), together with the layers of printing medium (10-11-12) present thereon, and the object (15) into mutual contact.
Abstract: The present invention relates to a method for thermally printing a pre-selected dye image (45) onto a three dimensional object (16). The method involves placing an image carrier sheet (24) containing a pre-selected dye image (45) over the object (16). A flexible membrane (26) is lowered over the object (16) and the image carrier sheet (24). A vacuum is established under the membrane (26) causing the image carrier sheet (24) to conform to the shape of the object (16). The membrane (26) or image carrier sheet (24) carry flexible heating elements (36), which are heated, to thermally transfer the dye image (45) onto the object (16). The flexible heating elements (36) can be made by etching an electrical circuit in a metal foil (34) which is bonded to a film substrate (30).
Type:
Grant
Filed:
June 25, 2004
Date of Patent:
July 21, 2009
Assignee:
Key-Tech, Inc.
Inventors:
Patrick Ferguson, Paul Geoffrey Newton, Kenneth Neri
Abstract: A method for cutting apart a glass substrate is provided whereby scribing of the glass substrate is possible without being affected by the presence or thickness of a deposited film formed thereon and without scratching the deposited film. To treat a glass substrate having a deposited film, such as a thin film or resin film, formed on one surface thereof, there are provided a shaving device, which is a blade that removes strip-shaped portions of the deposited film to expose strip-shaped regions on the glass substrate, and a wheel cutter that forms scribed lines along the strip-shaped regions exposed on the glass substrate. The glass substrate is cut apart along the scribed lines.
Abstract: An ink transfer system including an ink transfer decal that is transferable to a final substrate, such as a bare metal or pre-painted autobody part, without use of a separate adhesive. The transferred ink decal is capable of withstanding temperature elevations common during automotive paint baking without significant thermal degradation, discoloration, shrinkage or pealing.
Abstract: A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.
Abstract: An organic electroluminescent device is produced by a method using a transfer material comprising a pressing member having a projection and an organic layer formed on the projection, which comprises the steps of superposing the transfer material on a first substrate having an electrode formed at least partially thereon such that the organic layer faces the electrode; applying pressure thereto to form a laminate; and peeling the pressing member from the laminate so that the organic layer is transferred onto the first substrate via the electrode.
Abstract: The invention relates to a method of fabricating a release substrate produced from semiconductor materials, the method comprising creating a reversible connection between two substrate release layers characterized in that the reversible connection is formed by a connecting layer produced using a first material as the basis, the connecting layer further comprising a nanoparticle concentrating zone of a second material disposed to facilitate release of the substrate, the first and second materials being selected to maintain the bonding energy of the reversible connection substantially constant even when the substrate is exposed to heat treatment.
Type:
Grant
Filed:
July 5, 2006
Date of Patent:
June 9, 2009
Assignee:
S.O.I.Tec Silicon on Insulator Technologies
Abstract: A composite green sheet which comprises a green sheet including an inorganic powder and an organic binder, and a conductive layer formed thereon is prepared; the composite green sheet is then placed on a supporting surface of a base member containing a liquid; and the composite green sheet is irradiated with a laser light so as to form a through hole according to need, and thereby to evaporate the liquid contained in the base member so that waste remaining on the inner wall surface of the through hole is cleaned and removed. As a result, the conductive layer is exposed at the inner wall of the through hole penetrating the conductive layer.
Abstract: A method of fabricating a high density printed circuit board by applying a strippable adhesive layer on a reinforced substrate (rigid substrate or carrier film) used as a base substrate, forming a metal foil on the adhesive layer by means of plating, lamination or sputtering, and forming a high density circuit on the metal foil serving as a seed layer by means of pattern plating. Specifically, the method of the current invention includes the steps of attaching adhesive means to one surface of a reinforced substrate (rigid substrate or carrier film), forming a seed layer on the adhesive means and forming a circuit pattern on the seed layer, laminating an insulating layer on the circuit pattern and removing the reinforced substrate (rigid substrate or carrier film), and removing the seed layer.
Abstract: Methods of forming shaped adhesive fillets are disclosed. The adhesive fillets may be made by stacking multiple layers of adhesive sheets, consolidating the stacked layers, cutting strips from the consolidated layers, and forming the strips into adhesive fillets having desired cross sectional shapes. The fillets may be formed by feeding the strips through an apparatus comprising opposing rollers and a catcher, which facilitates release of the adhesive fillets from the rollers. The formed adhesive fillets are useful for applications such as stiffened panels for aircraft.
Abstract: A film structure of a ferroelectric single crystal which can be beneficially used in the fabrication of high-performance electric or electronic parts or devices is prepared by adhering a ferroelectric single crystal plate to a substrate by a conductive adhesive or metal layer, the ferroelectric single crystal plate being polished before or after the adhesion with the substrate.
Abstract: An optical device includes a substrate having a through hole formed therein, and an optical element mounted on the substrate with its optical section being placed to face the through hole, and a light transmissive member disposed at the through hole. Light transmissive under-fill material is provided between the substrate and the optical element and between the light transmissive member and the optical element.
Abstract: A method of transferring nanoparticles to a surface is provided. The method includes rotating a perimeter surface through a colloidal solution such that nanoparticles are captured by binding sites, removing liquid from the captured nanoparticles and rotating a take-up roll such that the captured nanoparticles contact a carrier surface. Moreover, the method includes removing the captured nanoparticles from the perimeter surface and transferring the nanoparticles to the carrier surface with a carrier adhesive material, rotating the carrier surface such that the transferred nanoparticles contact a target substrate, and removing the transferred nanoparticles from the carrier surface and transferring the transferred nanoparticles to the target substrate with a target substrate material.
Type:
Grant
Filed:
April 17, 2008
Date of Patent:
April 21, 2009
Assignee:
International Business Machines (IBM) Corporation