Abstract: A method of laminating a transfer section of a transfer layer to a substrate is performed using a reverse-image transfer printing device. The device includes a transfer ribbon, a print ribbon, a print head, and a laminating device. The transfer ribbon comprises the transfer layer, which is attached to a carrier layer. The print head is configured to transfer print material from the print ribbon to the transfer layer. Non-transfer portions of the transfer section are heated to a deactivation temperature using the print head. The transfer section is laminated to the substrate by heating the non-transfer portions and transfer portions of the transfer section using the laminating device. This bonds the transfer portions the substrate. The carrier layer is the removed from the transfer portions leaving the transfer portions bonded to the substrate. The non-transfer portions remain attached to the carrier layer.

Abstract: Provided is a manufacturing method that is able to manufacture a design member superior in a design property. In a manufacturing method of a design member for transferring a decorative layer onto a design surface of a base body, the manufacturing method provides a recessed parting groove that is formed in at least a part of a border between a general surface and the design surface, arranges the base body in a chamber having a gas pressure adjusting device, places a transfer film on the design surface of the base body, and, with changing a gas pressure in the chamber by the gas pressure adjusting device to crimp the transfer film onto the design surface, presses the transfer film against the design surface under a heated state by a three-dimensional transferring tool made of an elastic body.

Abstract: A method for producing a multi-layered absorbent article is disclosed. At least two of the layers include a colored region.

Abstract: A process for forming an absorbent article comprising a substrate having a composite image printed thereon. The composite image includes artwork portions printed on the top and bottom surfaces of the printed article substrate, which are vertically aligned with each other.

Abstract: Systems and methods for decoratively coating a substrate are disclosed wherein the ink is diffused into the substrate, as opposed to onto the substrate. Substrates are able to comprise metals, plastics, bamboo, wood, glass, and metals wherein such materials can also be pre-coated. A system for transferring a decorative image to a substrate comprises a chamber configured to receive a substrate, a means for securing a transfer medium containing the decorative image to be transferred, an optional vacuum source coupled to the chamber, and a heat source removably coupled to the chamber. The transfer is positioned face down onto a surface of the substrate, secured into position. The vacuum source may be used to evacuate the chamber to more tightly pull the transfer medium to the substrate. Then the substrate and transfer are heated, and the transfer medium ink diffuses into the substrate, thereby diffusing the image into the substrate.

Abstract: A method of producing a floor panel (1), including providing a carrier (3) including a thermoplastic material, applying a primer comprising at least one salt, preferably a metal salt, on a first surface of the carrier (3), printing by means of digital printing a first print (10) on said first surface of the carrier (3) with an aqueous pigment ink composition, and applying a protective layer (4) on said first surface of the carrier (3) and applying the carrier (3) on a core (2) and pressing by applying heat and pressure the protective layer (4), the carrier (3) and the core (2) together to form a floor panel (1). Also, a method for forming a decorative substrate.

Abstract: A method and device for transferring a chip (18) situated on a transfer substrate (26) to a contact substrate (50), and for contacting the chip with the contact substrate, in which the chip, the back side (19) of which is attached adhesively to a support surface of the transfer substrate facing the contact substrate, is charged with laser energy from behind through the transfer substrate, and the chip contacts (59, 60) thereof that are arranged opposite a contact surface (58) of the contact substrate are brought into contact with substrate contacts (56, 57) arranged on the contact surface by means of a pressing device (45, 46) from behind through the transfer substrate, and a thermal bond is created between the chip contacts and the substrate contacts.

Abstract: A bonding device includes a first feeding mechanism, a second feeding mechanism, a glue spraying mechanism positioned between the first feeding mechanism and the second feeding mechanism, and a bonding mechanism. The first feeding mechanism comprises a mounting frame and a transmission belt mounted on the mounting frame. The second feeding mechanism includes a support frame, a feeding member positioned on the support frame, a positioning plate mounted on the support frame and located below the feeding member, and a first driver connected to the positioning plate. The feeding member vertically defines at least one feeding groove. The positioning plate defines a matching groove matching with the first workpiece The bonding mechanism includes a second driver and a suction member connected to the second driver.

Abstract: An applicator suitable for converting a white-light endoscope into an endoscope for combined white-light/fluorescence imaging is disclosed. The applicator facilitates attachment of an optical element, for example an optical filter, to a distal optical port of an endoscope. The applicator engages with alignment feature on the endoscope's distal end and releasably supports the optical element in an opening that is aligned with the optical port. The optical element is released in a proximal direction by pressing down on an actuator.

Abstract: A machine for creating multi-layer price tags. The machine has a proximal end and a distal end. The machine further has a base. A frame is attached to the base toward the distal end of the machine. A secondary frame is attached to the base toward the proximal end of the machine. An unwinder is mounted to the frame toward the distal end of the machine. At least two printers are mounted to the frame, and at least one automated label applicator is mounted between the at least two printers. A rewinder is mounted to the secondary frame. The at least two printers are preferably thermal transfer printheads. The automated label applicator preferably utilizes either a low-stick or non-stick adhesive. In an alternative embodiment of the machine, the rewinder is replaced by an automated label applicator mounted to the secondary frame.

Abstract: [Object] To provide a method for transferring a graphene film, which can transfer a graphene film on a desired substrate with excellent adhesiveness, can effectively prevent defects from being generated in a graphene film and is excellent also in mass productivity, and a method for manufacturing a transparent conductive film. [Solving Means] One layer or a plurality of layers of graphene films 12 formed on a first substrate 11 and a second substrate 14 are stuck with a resin layer 13 that contains less than 1% by weight of a volatile component and has adhesiveness, the first substrate 11 and the second substrate 14 are pressurized to reduce a thickness of the resin layer 13, the resin layer 13 is cured, after that the first substrate 11 is removed.

Abstract: A machine that processes gift cards in an in-line process where the gift cards travel along a generally straight transport path from a card feed mechanism to a delivery end where the cards and carrier combinations are discharged. During the in-line processing, a magnetic stripe, integrated circuit chip or RFID tag on the gift cards can be encoded with account information, a serial number or other information. In addition, the cards are transported to a print mechanism that personalizes the cards with a bar code, account information, serial number or other information. After printing, the cards are transported to a gluing system which applies adhesive to one side of the cards. The cards are then transported to a feeding mechanism that feeds and applies a carrier to one or more cards.

Abstract: An applicator, related applicator system, and a method for delivering a self-adhesive material are provided. The applicator includes an outer surface, and an inner surface opposite the outer surface. The inner surface of the applicator defines a void that is operable to receive the self-adhesive material. At least a portion of the inner surface releasably adhere the applicator side of the self-adhesive material where the adhesive force between the portion of the inner surface and the applicator side being less than adhesive force between the substrate and the substrate side. The applicator is used by placing the applicator in contact with a substrate, pressing the applicator against the substrate such that the self-adhesive material adheres to the substrate, and releasing the applicator from the substrate.

Abstract: A pick tool for picking a planar object from a supply station is presented, in particular to be used for picking a semiconductor die from a carrier tape, said pick tool comprising: a work surface, said work surface comprising at least one contact region that may be brought into contact with a first surface on a first side of the planar object; one or more vacuum outlets in the work surface that may be connected to a vacuum source to allow for temporarily fixing the planar object to the work surface; and wherein a flexible seal is provided to maintain vacuum if the planar object becomes deformed.

Abstract: An applicator, related applicator system, and a method for delivering a self-adhesive material are provided. The applicator includes an outer surface, and an inner surface opposite the outer surface. The inner surface of the applicator defines a void that is operable to receive the self-adhesive material. At least a portion of the inner surface releasably adhere the applicator side of the self-adhesive material where the adhesive force between the portion of the inner surface and the applicator side being less than adhesive force between the substrate and the substrate side. The applicator is used by placing the applicator in contact with a substrate, pressing the applicator against the substrate such that the self-adhesive material adheres to the substrate, and releasing the applicator from the substrate.

Abstract: Apparatus and methods for filling a prescription order with plurality of products each containing a pharmaceutical. The apparatus and method verifying a barcode on each of the products and printing and applying a patient label with a verified barcode to each of the products. After the patient label is applied, the barcodes are independently verified before the products are released.

Abstract: Provided is a label production method capable of significantly reducing production costs by producing many single labels using one member. A label substrate that an adhesive and a release agent are applied to is passed through a laminating device twice, first label substrate passed for the first time and second label substrate passed for the second time are pseudo-adhered by joining the release agent of the first label substrate passed for the first time to the adhesive of the second label substrate passed for the second time, and single labels are punched out from the second label substrate by a cutting tooth of a punching device at a position on the downstream side after the label substrate is passed through the laminating device for the second time. The first label substrate passed for the first time is used as a seat for the cutting tooth of the punching device.

Abstract: A method for material deposition employs a printing press, such as those used in cold foil transfers, that permits a greater usage of the foil web than traditional methods. This is achieved by increasing the number of times the foil web is passed through the press, while simultaneously taking into account the area that has not been used and adjusting the impacted area of the foil web accordingly. The foil web is adjusted by using a series of adjustable rollers and angular bars to change the length of the circumferential path the foil takes through the press. By modifying the angle of these rollers and the distance between them, the path can be lengthened or shortened to correspond to the particular needs for a particular print job. This allows the press to use the foil in such a way that reduces foil waste and manufacturer and consumer costs.

Abstract: A wafer transfer assembly and method of using the assembly to transfer device wafers between processing tools in a manufacturing process are described herein. The assembly comprises a wafer transfer disk, an end effector configured to receive and support the wafer transfer disk, and an elongated handle extending from the end effector. The wafer transfer disk comprises a wafer-engaging surface configured to support a debonded device wafer placed on the wafer transfer assembly with the device surface adjacent the wafer-engaging surface. The wafer-engaging surface has non-stick properties, and yields a low bonding strength interface between the wafer-engaging surface and device surface. The resulting transfer stack can be transported to other processing tools for additional processing of the debonded device wafer, followed by separating the debonded device wafer and the wafer transfer disk without damaging the device wafer.

Abstract: In a laminating apparatus and a method of manufacturing an organic light-emitting display, the laminating apparatus includes a heater which generates heat and the heating member which transfers heat received from the heater to a donor film. The heating member includes a first conducting layer which receives heat from the heater, a second conducting layer which is formed on the first conducting layer and which has a thermal conductivity different from that of the first conducting layer, and a third conducting layer which is formed on the second conducting layer and which has a thermal conductivity different from that of the second conducting layer.