Patents Examined by Spe Au
  • Thermal interface material on a mesh carrier
    Patent number: 6523608
    Abstract: A thermal interface comprising a grid frame having a thermally conductive interface material coated thereon. The thermal interface is disposed between a heat source and a heat dissipation device wherein the thermally conductive material preferably melts at a temperature at or below the temperature of the heat source.
    Type: Grant
    Filed: July 31, 2000
    Date of Patent: February 25, 2003
    Assignee: Intel Corporation
    Inventors: Gary L. Solbrekken, Craig B. Simmons, Chia-Pin Chiu