Abstract: A spring contact 10 has a pair of round contact projections 11 and 12 symmetrically formed at both sides of a peak of a bending top thereof. The spring contact is fixed to an insulator 20 at a central portion thereof and has a second contact region 13 at a lower end thereof. The spring contact is located in a natural condition where no external force is applied. In this condition, the round contact projection 11 is located at a position remotest from the surface of the insulator. When an electronic part approaches perpendicularly to the surface of the insulator, a contact pad of the electronic part at first touches one of the round contact projections 11 and finally touches the other of the round contact projections 12 after the spring contact is deformed and displaced to a deformed position. At this time, the wiping displacement d of the spring contact in the direction perpendicular to the connecting direction of this connector is extremely small.