Abstract: The disclosure provides a polyester polymers, and aqueous polyester-based coating composition, for use in forming coatings via electrodeposition. The disclosure also provides materials and methods for electrodepositing coating compositions onto metal substrates, and particularly coil substrates for beverage can ends.

Abstract: Disclosed is a post-plating treatment method for a one-step brass-electroplated steel wire, comprising the following steps: electroplating the surface of the steel wire with a brass alloy; immediately washing the electroplated steel wire with cold water, removing residues from the surface of the steel wire, and blow-drying the steel wire with cold air; immersing the blow-dried steel wire in a water-based coating solution; and taking the immersed steel wire out, blow-drying the steel wire with natural air, and taking the steel wire up. The water-based coating solution comprises a polyoxyethylene organic salt, sodium hypophosphite and the balance of pure water, the polyoxyethylene organic salt comprising a salt of alkyl polyoxyethylene ether phosphate and polyoxyethylene alkylamine.

Abstract: An injector component of an injector for introducing a fluid is described as including a base body, a coating on at least one first end face of the base body, the coating having a maximum, which lies on an outer half of the base body, and an outer lateral surface of the base body does not have any coating.

Abstract: The disclosure discloses a method for manufacturing a solar cell, a solar module, and a power generation system. The manufacturing method includes the following steps: S1: perforating film layer in a first region and/or a second region of a solar cell where an electrode is to be disposed, thus forming a plurality holes; S2: growing a plurality seed layers on the solar cell, contacting with the first region and/or the second region through the plurality of holes or grooves in S1; and S3: horizontally transporting a to-be-electroplated solar cell on a horizontal electroplating device, to form a cathode on the seed layer, where an anode terminal is disposed in an electroplating liquid in an electroplating bath, and a moving mechanism disposed in the electroplating bath drives the solar cell to move from inlet to outlet, thus achieving electroplating.

Abstract: A nickel electrodeposition composition for via fill or barrier nickel interconnect fabrication comprising: (a) a source of nickel ions; (b) one or more polarizing additives; and (c) one or more depolarizing additives. The nickel electrodeposition composition may include various additives, including suitable acids, surfactants, buffers, and/or stress modifiers to produce bottom-up filling of vias and trenches.

Abstract: A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; an elevating mechanism configured to elevate the substrate holder; a cover member arranged above the plating tank and having a side wall surrounding an elevating path of the substrate holder; an opening/closing mechanism configured to open and close an opening formed in the side wall of the cover member; a substrate cleaning member for discharging a cleaning liquid toward a surface to be plated of a substrate held by the substrate holder; and a driving mechanism configured to move the substrate cleaning member between a cleaning position between the plating tank and the substrate holder and a retracted position retracted from between the plating tank and the substrate holder, through the opening.

Abstract: Described herein are electrochemical additive manufacturing systems and methods of using such systems. In some examples, a method comprises flowing an electrolyte solution into the gap formed by an electrode array and a deposition electrode and depositing (electroplating) a target material onto the deposition electrode. The method also comprises changing one or more characteristics of the electrolyte solution within the system, e.g., to remove deposition byproducts, replenish consumed components, and/or change the solution composition to modify various properties of the deposited target material (e.g., composition, morphology) without major changeovers within the system. These electrolyte changes can be performed dynamically while the system continues to operate. The changed characteristics can be acid concentration, feedstock ion concentration, additive concentration, temperature, and flow rate.

Abstract: An apparatus and method for a mandrel used during an electroforming process. The mandrel is formed of a structural wax and includes a metallic layer utilized to formulate a metal component. During the electroforming process, the mandrel is actively cooled utilizing a closed loop. The closed loop includes the mandrel and a heat exchanger through which a coolant flows.

Abstract: A method used to repair a workpiece through a combination of laser and an electrochemical reaction is provided. A tool anode is arranged on the back side of the workpiece and is spaced therefrom. A laser beam is focused on an outer surface of the workpiece to realize localized repairing on the back side. The method realizes localized coating repairing on the back side of the workpiece through coordination between the thermal effect of the laser and the electrochemical deposition based on the characteristic of high thermal conductivity of the workpiece. The electrodeposition reaction does not occur in regions that do not need to be repaired. The operating process is simple, the cost of the plating solution is largely reduced, and the problem that the coating on the inner wall of the thin-walled workpiece is difficult to repair due to stripping is solved.

Abstract: An apparatus for electroplating includes a cup configured to support a substrate, and a cone including at least three distance measuring devices arranged on a lower surface thereof and facing the substrate. Each distance measuring device is configured to transmit a laser pulse towards the substrate, the laser pulse impinging the substrate, receive a reflected laser pulse from the substrate, calculate a turnaround time of the laser pulse, and calculate a distance between the distance measuring device and the substrate using the turnaround time for determining an inclination of the substrate.

Abstract: A flow generator has an electrolyte feed device for feeding an electrolyte and an electrolyte distribution device. There is also described a deposition device having such a flow generator and a method for the deposition of a material on a surface of an object.

Abstract: A method for creating a chrome-plated surface having a matte finish that typically includes: controlling a resistance of a current bridge circuit; depositing a first chromium layer on a substrate positioned in a chromium bath, wherein the first chromium layer is deposited by supplying current from a power source that is electrically connected to the substrate and to anodes positioned in the chromium bath; etching the first chromium layer by engaging a current bridge that closes the current bridge circuit; depositing a first intermediate chromium layer, wherein the first intermediate chromium layer is deposited by supplying current from the power source; etching the first intermediate chromium layer, wherein the first intermediate chromium layer is etched by engaging the current bridge; and depositing a final chromium layer, wherein the final chromium layer is deposited by supplying current from the power source.

Abstract: A plating method capable of saving a substrate in an event of a failure of a transporter, a plating tank, or other component when the substrate is being plated is disclosed. The plating method includes: transporting a plurality of substrates to a plurality of plating tanks, respectively, with a transporter; immersing the plurality of substrates in a plating solution held in the plurality of plating tanks to plate the plurality of substrates; detecting a failure that has occurred in the transporter or a post-processing tank; and replacing the plating solution in the plurality of plating tanks with a preservative liquid to thereby immerse the plurality of substrates in the preservative liquid.

Abstract: Disclosed herein is a method comprising growing a shim by disposing a mandrel having an optional textured surface in an electrolytic bath, where the shim contains a negative image of the optional textured surface formed by electrolytic deposition of a metal; affixing the shim working-side down on a reference plane using a fixture; optically scanning the shim to reverse engineer a geometry of a non-working surface, where reverse engineering a geometry of the non-working surface includes developing a profile of the non-working surface and the thickness of the shim; and adding a material to the non-working surface of the shim via additive manufacturing to form a tool insert.

Abstract: An electroplating device includes an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed, a first anode provided in the electroplating bath, and a liquid spraying device. The liquid spraying device includes a main body part having at least one inlet for conveying the electroplating solution into the main body part, and a plurality of nozzles installed on the main body part. At least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.

Abstract: A formation method is provided during which a cellular core is provided. The cellular core includes a plurality of cavities that include a first cavity. Each of the cavities extends through the cellular core. A metal substrate is disposed within the first cavity. The metal substrate is electroplated to form a septum within the first cavity. The septum is bonded to the cellular core.

Abstract: Provided is a wetting method for substrate that allows reducing an amount of air bubbles attached to a surface to be plated with a simple structure.

Abstract: The present application discloses a photoelectrode and a preparation method therefor, and a Pt-based alloy catalyst and a preparation method therefor.

Abstract: Localized electrochemical deposition (LECD) is provided. The aim of LECD is to create a patterned electrodeposited metal layer on a cathode without the use of pre-deposition patterning steps. In embodiments described herein, an LECD device includes a cathode (a material to be plated) placed sufficiently close to a formation anode in a metal electrolyte chemical bath. The LECD device is then activated electrically in solution. An electric field created by the formation anode determines the locations of metal deposition, providing a localized deposition without need for photolithography or other masking of the material to be plated.

Abstract: An electrochemical treatment system includes a treatment fluid supply manifold, a fluid return manifold, and an electrode section connected to the treatment fluid supply manifold. A plurality of treatment fluid supply ports feed fluid through or across the electrode and a plurality of fluid return ports proximate the treatment fluid supply ports are connected to the fluid return manifold. A porous pad is coupled to the electrode section for contacting a substrate to be treated and receives the treatment fluid via the plurality of treatment fluid supply ports. The plurality of fluid return ports remove spent and excess treatment fluid and gases from the substrate, the surrounding air, and the porous pad.