Abstract: A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; a rotation mechanism configured to rotate the substrate holder; a contact member 494-4 having a substrate contact point 494-4a for contacting an outer peripheral portion of the surface to be plated of the substrate held by the substrate holder and a main body 494-4b extending above with respect to the substrate contact point 494-4a, and attached to the substrate holder; and a contact cleaning member 482 for discharging a cleaning liquid toward the main body 494-4b of the contact member 494-4 from a lower side of the substrate holder.

Abstract: Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio A/S greater than the aspect ratio A/B of the base.

Abstract: A device for a cell of an apparatus for wet processing of a planar workpiece, comprises a structure comprising first and second walls. The workpiece is movable in a central plane through a space between the first and second walls in a first direction (y). Apertures for introducing pressurised liquid between the first and second walls are on opposite sides of the central plane and facing the central plane. The apertures are distributed in the first direction (y) and in a second direction (x) transverse to the first direction (y). Discharge openings for the liquid to leave the space are on opposite sides, in the second direction (x), along the space in the first direction (y). The first and second walls form barriers to liquid flow from the space in a direction (z) perpendicular to the central plane. Channels through the walls are arranged to conduct liquid to respective one of the apertures.

Abstract: A method for passivating a tinplate strip after electrodepositing the tin layer or tin layers, or after an optional flow-melting of the electrodeposited tin layer or tin layers, and an apparatus for producing the passivated tinplate strip.

Abstract: A method of making an electrical component includes transmitting electrical energy from a power source through one or more deposition anodes, through an electrolyte solution, and to an intralayer electrical-connection feature of a build plate, such that material is electrochemically deposited onto the intralayer electrical-connection feature and forms an interlayer electrical-connection feature. The method also includes securing a dielectric material so that the dielectric material contacts and electrically insulates the intralayer electrical-connection feature and contacts and at least partially electrically insulates the interlayer electrical-connection feature.

Abstract: Electroplating apparatus includes an electroplating tank that stores an electrolyte solution in which at least objects to be electroplated and magnetic media sink, and at least one magnetic rotator rotatably arranged under the electroplating tank so as to generate an alternating magnetic field. The magnetic rotator is arranged to section an internal space of the electroplating tank into a first space occupying a space above the magnetic rotator and a second space occupying a remaining space other than the first space. The magnetic rotator is arranged to be movable in a lateral direction intersecting a rotational axis of the magnetic rotator, allowing the objects to be shifted between a condition of being present in the electrolyte solution and in the first space and a condition of being present in the electrolyte solution and in the second space.

Abstract: A method for manufacturing a wiring substrate includes forming a conductor layer including first and second pads, forming a resin insulating layer on the conductor layer, forming, in the insulating layer, a first opening exposing the first pad and a second opening exposing the second pad, forming a covering layer on the insulating layer such that the covering layer covers the first and second openings, forming a third opening in the covering layer such that the third opening communicates with the first opening and the first pad is exposed in the third opening, forming, on a surface of the first pad, a protective film formed of material different from material forming the conductor layer, removing the covering layer from the insulating layer, and forming a conductor post on the second pad such that the conductor post is formed of material that is same as the material forming the conductor layer.

Abstract: Provided is a technique that ensures suppressing deterioration of a plating quality of a substrate caused by gas bubbles accumulating on an entire lower surface of a membrane. A plating process method includes a step of guiding an anode liquid to a second region R2 positioned below a membrane 40 and above a first region R1 to decrease a concentration of gas bubbles contained in the anode liquid in the second region below a concentration of gas bubbles contained in the anode liquid in the first region; a step of discharging the anode liquid from the first region; a step of discharging the anode liquid from the second region; a step of supplying a cathode liquid to a cathode chamber 12 in which a substrate Wf is disposed; and a step of flowing electricity between the substrate Wf and an anode 13 to electroplate a metal on the substrate.

Abstract: A titanium surface treatment method for manufacturing a polymer-titanium joint structure having excellent bond strength is provided. A titanium surface treatment method for bonding with a polymer composite includes a first etching step wherein the titanium surface is etched by acidic solution; a first surface treatment step wherein the titanium surface is treated by ultrasonic wave; a second etching step wherein the titanium surface is etched again by acidic solution; a second surface treatment step wherein the titanium surface is treated again by ultrasonic wave; a first silane coupling treatment step wherein the titanium surface is treated by ultrasonic wave; a third surface treatment step wherein the titanium surface is treated again by ultrasonic wave; and a second silane coupling treatment step wherein the titanium surface is treated by anodic oxidation.

Abstract: A method for processing a smooth or structured surface of a pressing element is described, the method comprising the steps of: a) chrome-plating said surface of the pressing element so as to form a coating comprising a first layer having chrome grains oriented in a first direction and a second layer overlapping said first layer, said second layer having chrome grains oriented in a second direction which is different from said first direction; b) applying a mask on the chrome-plated surface of the pressing element by means of a digital printing technology; c) chemically treating the chrome-plated surface of the pressing element on which said mask was applied, said chemical treatment being performed so as to partially remove said chrome coating in the exposed areas of said chrome-plated surface, i.e.

Abstract: A device for pre-lithiation including a pre-lithiation reactor sequentially divided into an impregnation section, a pre-lithiation section, and an aging section. The pre-lithiation reactor accommodates a pre-lithiation solution through which a negative electrode structure is moved. A negative electrode roll is arranged outside the pre-lithiation solution, and the pre-movement negative electrode structure is wound. A lithium metal counter electrode is arranged in the pre-lithiation solution of the pre-lithiation section, and is arranged to be spaced apart from the negative electrode structure to face the negative electrode structure moving in the pre-lithiation solution. A charging and discharging unit is connected to the negative electrode structure and connected to the lithium metal counter electrode.

Abstract: Provided is a anodizing apparatus, including: a base configured to support a target product including a first bore that requires an anodizing surface treatment and a second bore that is connected to the first bore and excluded from the anodizing surface treatment; a working part configured to perform the anodizing surface treatment on the first bore; and a cover part configured to cover an outer surface of the target product, wherein the working part includes at least one electrode bar configured to access and enter the first bore, and a plurality of spray nozzles provided integrally with each of the at least one electrode bar and configured to selectively supply one of a degreasing solution, an electrolyte, and a cleaning solution to the first bore.

Abstract: A method for manufacturing a three-dimensional structure by localized electroforming of a material from an electrolytic solution includes emitting a jet of the electrolytic solution towards a target substrate, controlling position of the jet with respect to the target substrate, and controlling potential difference between a control electrode and the target substrate or an ion current intensity through the jet between the control electrode and the target substrate to obtain deposition of material on the target substrate or removal of material from the target substrate.

Abstract: An object is to reduce the field shielding effect of a paddle during plating. There is provided an apparatus for plating that is configured to plate a substrate and comprises a plating tank; an anode placed in the plating tank; a rotation mechanism configured to rotate the substrate in a first direction and in a second direction that is opposite to the first direction; and a control device configured to control the rotation mechanism, such that a time period when the substrate is rotated in the first direction becomes equal to a time period when the substrate is rotated in the second direction or such that a time integrated value of a rotation speed in the first direction becomes equal to a time integrated value of a rotation speed in the second direction.

Abstract: A method for treating a carbonaceous biochar electrode with an applied electric potential and resulting electric current, while submerged in an electrolyte, is disclosed in order to increase the biochar electrode's pore surface area and pore hierarchy, to affect a cleaning of unwanted materials and compounds from within the electrode and to optionally plate materials onto the surface pores of the electrode, such as graphene or metals, thus increasing the energy storage capacity of the biochar electrode when used in an energy storage device. Exemplary applications include electrodes for ultra-capacitors, pseudo-capacitors, batteries, fuel cells and other absorbing and desorbing applications.

Abstract: The disclosure provides a polyester polymers, and aqueous polyester-based coating composition, for use in forming coatings via electrodeposition. The disclosure also provides materials and methods for electrodepositing coating compositions onto metal substrates, and particularly coil substrates for beverage can ends.

Abstract: Disclosed is a post-plating treatment method for a one-step brass-electroplated steel wire, comprising the following steps: electroplating the surface of the steel wire with a brass alloy; immediately washing the electroplated steel wire with cold water, removing residues from the surface of the steel wire, and blow-drying the steel wire with cold air; immersing the blow-dried steel wire in a water-based coating solution; and taking the immersed steel wire out, blow-drying the steel wire with natural air, and taking the steel wire up. The water-based coating solution comprises a polyoxyethylene organic salt, sodium hypophosphite and the balance of pure water, the polyoxyethylene organic salt comprising a salt of alkyl polyoxyethylene ether phosphate and polyoxyethylene alkylamine.

Abstract: An injector component of an injector for introducing a fluid is described as including a base body, a coating on at least one first end face of the base body, the coating having a maximum, which lies on an outer half of the base body, and an outer lateral surface of the base body does not have any coating.

Abstract: The disclosure discloses a method for manufacturing a solar cell, a solar module, and a power generation system. The manufacturing method includes the following steps: S1: perforating film layer in a first region and/or a second region of a solar cell where an electrode is to be disposed, thus forming a plurality holes; S2: growing a plurality seed layers on the solar cell, contacting with the first region and/or the second region through the plurality of holes or grooves in S1; and S3: horizontally transporting a to-be-electroplated solar cell on a horizontal electroplating device, to form a cathode on the seed layer, where an anode terminal is disposed in an electroplating liquid in an electroplating bath, and a moving mechanism disposed in the electroplating bath drives the solar cell to move from inlet to outlet, thus achieving electroplating.

Abstract: A nickel electrodeposition composition for via fill or barrier nickel interconnect fabrication comprising: (a) a source of nickel ions; (b) one or more polarizing additives; and (c) one or more depolarizing additives. The nickel electrodeposition composition may include various additives, including suitable acids, surfactants, buffers, and/or stress modifiers to produce bottom-up filling of vias and trenches.