Patents Examined by Stepahnie Duclair
  • Chemical mechanical polishing composition and methods relating thereto
    Patent number: 8540893
    Abstract: A chemical mechanical polishing composition useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The chemical mechanical polishing composition comprises an inhibitor for the nonferrous metal; a copolymer of poly(ethylene glycol)methyl ether (meth)acrylate and 1-vinylimidazole; and water.
    Type: Grant
    Filed: August 4, 2008
    Date of Patent: September 24, 2013
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Tirthankar Ghosh, Terence M. Thomas, Hongyu Wang, Scott A. Ibbitson