Abstract: A heat-sensitive stencil master making apparatus for making a stencil master by imagewise perforating thermoplastic film of heat-sensitive stencil master material according to an image on an original includes a thermal head which has an array of a plurality of heater elements and is brought into thermal contact with the thermoplastic film. Heater elements selected from the array of the heater elements according to the image on the original are applied with an electric voltage so that perforations are formed in the parts of the thermoplastic film of the heat-sensitive stencil master material in contact with the selected heater elements.