Patents Examined by Steven Ngo
  • Patent number: 11943894
    Abstract: A robot control device includes a casing including a main body having a first opening and a second opening, and a door opening and closing the first opening, a first circuit including a heat generating element, and at least one blower device. The main body includes a first chamber accommodating the first circuit and open at the first opening, and a second chamber adjacent to the first chamber and open at the first opening and the second opening. When the door closes the first opening, the door closes the first chamber and communicates the second chamber with the outside via a door opening of the door. The blower device is disposed at least one of positions at the door opening, near the door opening, at the second opening, and near the second opening, and is configured to introduce and discharge air into/from the second chamber.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: March 26, 2024
    Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Noriaki Fujisawa, Yoshiaki Tonoue
  • Patent number: 11937400
    Abstract: A heat dissipation device includes a first heat dissipator, a second heat dissipator, a first tank connected to one side of each of the first heat dissipator and the second heat dissipator in a first direction, and a second tank connected to another side in the first direction. A coolant flows through an inside of the first heat dissipator, the second heat dissipator, the first tank, and the second tank. The first tank includes a tank-side first outflow port through which the coolant flows out to a first cooling device, and a tank-side first inflow port through which the coolant from the first cooling device flows in. The second tank includes a tank-side second outflow port through which the coolant flows out to a second cooling device, and a tank-side second inflow port through which the coolant from the second cooling device flows in.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: March 19, 2024
    Assignee: NIDEC CORPORATION
    Inventors: Naoyuki Takashima, Takehito Tamaoka, Toshihiko Tokeshi
  • Patent number: 11937402
    Abstract: A heat dissipation device includes a plurality of fins, at least one first heat pipe and at least one second heat pipe. Each of the fins includes a main body and two first deflectors. The main body has an inflow side, an outflow side and two first communication openings. The first communication openings are located between the inflow side and the outflow side. The first deflectors are arranged obliquely relative to the main body and respectively located on sides of the first communication openings. Air flowing out of the first communication openings is guided by the first deflectors to flow into an area between the first deflectors. The first heat pipe is located between the first deflectors. The second heat pipe is located on one side of one of the first deflectors located relatively far away from the other one of the first deflectors.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: March 19, 2024
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Shun-Yu Shih
  • Patent number: 11930623
    Abstract: A board structure includes: a board with a heat generating element; a heat sink including a plate-shaped base member with one face contacting the heat generating element, and plural fins side by side on another face of the base member, the fins extending in a cooling air flow direction, the fins having distal ends downstream in the flow direction; a first resisting member on a downstream side with respect to the heat sink and acting as a resistor for exhaust of the cooling air; and a second resisting member on the downstream side and on a first side that the fins are arranged respective to the heat sink and acting as a resistor for the cooling air. Distal ends of the fins on a second side that the fins are arranged are upstream of the distal ends of the fins on the first side.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: March 12, 2024
    Assignee: FUJIFILM Business Innovation Corp.
    Inventor: Takanobu Ono
  • Patent number: 11818869
    Abstract: A heat dissipation structure assembly includes an elastic limiting member, a thermal grease wall, a fitting member, a phase-change metal, and an assembling plate. The elastic limiting member is adapted to be disposed at a periphery of a heat source. The thermal grease wall is adapted to be in contact with the periphery of the heat source. The fitting member is in contact with the thermal grease wall and engaged with the elastic limiting member. The phase-change metal is adapted to be filled into a region among the fitting member, the thermal grease wall, and the heat source. When a temperature of the phase-change metal exceeds a critical temperature, a state of the phase-change metal is changed to a liquid state. The assembling plate is connected to the fitting member, and the assembling plate is in contact with the thermal grease wall.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: November 14, 2023
    Assignees: MICRO-STAR INT'L CO., LIMITED., MSI ELECTRONIC (KUN SHAN) CO., LTD.
    Inventors: Cheng-Lung Chen, Chia-Ming Chang
  • Patent number: 11792912
    Abstract: A heat dissipation structure includes a heat sink, a first thermal interface material, a second thermal interface material, a circuit board and a circuit element. The first thermal interface material is connected to the heat sink and has fluidity. The second thermal interface material is connected to the first thermal interface material and has no fluidity. The circuit board is connected to the second thermal interface material and has an opening, a top board surface and a bottom board surface. The circuit element includes a convex portion and a base portion. The convex portion has a top convex surface and is disposed in the opening. The base portion is connected to the convex portion and the bottom board surface. The second thermal interface material is connected to the top board surface and the top convex surface.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: October 17, 2023
    Assignee: WISTRON NEWEB CORPORATION
    Inventor: Bo-Yen Chen