Abstract: A liquid-cooled rectifier assembly includes first and second bus bars, each having at least one cooling channel formed therein, which are adapted and configured to carry a cooling fluid therethrough, and a first power diode array arranged between and in contact with the first and second bus bars. A third bus bar can be provided, along with a second power diode array.

Abstract: A middle frame assembly includes a middle frame, connectors, and a vapor chamber. The middle frame is provided with a through hole, the connectors are fixedly coupled to the middle frame, and some of the connectors are exposed to form a welding part. The vapor chamber includes a vapor chamber body and a surrounding edge surrounding the vapor chamber body. The vapor chamber is accommodated in the through hole, and the surrounding edge is welded to the welding part. The connectors are configured to couple the middle frame and the vapor chamber and are welded to the vapor chamber.

Abstract: A liquid cooler includes a liquid cooling head, a liquid cooling radiator and liquid delivery pipes connected between the liquid cooling head and the liquid cooling radiator. The liquid cooling radiator has a liquid pump box, a heat dissipation pipe set and a liquid return box. The liquid pump box is divided into a hot liquid chamber and a cold liquid chamber by an air barrier space. The space of the hot liquid chamber is smaller than that of the cold liquid chamber, so that the hot liquid quickly enters the heat dissipation pipe set through the liquid pump box and overcomes the problems that the hot liquid in the liquid pump box is easy to accumulate heat and conduct heat to the cold liquid.

Abstract: Systems are provided for a power electronics cooling assembly. In one example, a system for a power electronics cooling assembly includes: a first cooling plate, a mounting plate, the mounting plate having mounting points to be attached to a housing, an electronic module disposed between the first cooling plate and the mounting plate, and a spring bracket applying force towards the first cooling plate, the spring bracket having mounting points aligned with the mounting points of the mounting plate.

Abstract: A cooling arrangement for cooling at least one power cell, in particular of a motor vehicle, includes a power cell and a cooling fluid circuit, wherein the power cell is directly electrically connected to at least one power conductor of an electric power supply, wherein a cooling fluid circulates in the cooling fluid circuit, wherein the cooling fluid circuit is fluidly connected to the power cell and/or the power conductor, and wherein the cooling fluid is a cooling medium having electrically insulating properties, in particular a dielectric medium.

Abstract: An error-unlocking protection structure for heat dissipation base seat includes a heat dissipation base seat, an operation member and a cover body. The operation member has a cam section pivotally connected with the connection section disposed on the heat dissipation base seat. A linking member is disposed between the cover body and the operation member and respectively connected with the cover body and the cam section. When operating the operation member, the cam section is forced to press the heat dissipation base seat and make the heat dissipation base seat tightly attached to the heat generation component and located thereon. At the same time, the linking member is driven to horizontally move the cover body relative to the heat dissipation base seat, whereby the cover body shields locking members to prevent the heat dissipation base seat from being uninstalled from the heat generation component by error.

Abstract: The present disclosure relates to a thermal coupling element, a method of manufacturing the coupling element, and a switchable arrangement for heat dissipation from electrical or electronic components of a motor vehicle.

Abstract: A micromobility transit vehicle may include a wheel, an electric motor associated with the wheel, and a motor controller configured to control a motive force provided by the electric motor to the wheel. The motor controller may include a printed circuit board (PCB), one or more MOSFETs attached to the PCB, and a respective aperture defined through the PCB below each MOSFET. The motor controller may include a thermal assembly associated with each MOSFET and capable of dissipating heat from the MOSFETs to a heat sink. Each thermal assembly may include a heat transfer plug positioned at least partially within an associated aperture of the PCBA to contact an associated MOSFET, and a thermal interface material positioned between the heat transfer plug and the heat sink and capable of dissipating heat from the heat transfer plug to the heat sink.

Abstract: A method for assembling a liquid cooling assembly includes: providing liquid cooling blocks each defining an internal fluid conduit; providing a first heat spreading base defining at least one first pocket; and providing a second heat spreading base defining second pockets, a number of second pockets being greater than a number of the at least one first pocket. When assembling a first liquid cooling assembly: at least one liquid cooling block is selected to mate with the first heat spreading base; and the selected at least one liquid cooling block is inserted at least partly into a corresponding one of the at least one first pocket. When assembling a second liquid cooling assembly: at least two liquid cooling blocks are selected to mate with the second heat spreading base; and the selected at least two liquid cooling blocks are inserted at least partly into corresponding ones of the second pockets.

Abstract: A heat sink retention device for retaining a heat sink, including a spring, proximate an electronic device in a circuit board. The device includes a first component configured to be attached to a circuit board, and a second component configured to be adjustably attached to the first component, and including an opening configured to retain a portion of a spring of a heat sink. When the first and second components are attached together and the first component is attached to the circuit board, the heat sink retention device is adapted to allow application of a force on the spring in order to retain the heat sink proximate an electronic device mounted on the circuit board.

Abstract: According to one embodiment, an apparatus is provided that includes a first block and a second block, one or more springs provided between the first block and the second block, and a thermally conductive wrap extending from the first block to the second block, wherein the thermally conductive wrap is configured to conduct heat away from the first block. An assembly including a chassis, a receptacle, and the apparatus is also provided, as well as a method for operating the apparatus.

Abstract: A power inverter may include a housing including an arrangement space having a capacitor, a pair of cooling spaces formed on opposite sides of the arrangement space and include first and second cooling spaces, a cooling passage communicating first ends of the pair of cooling spaces with each other, and a pair of through holes respectively fluidically-connecting second ends of the pair of cooling spaces to outside of the power inverter apparatus; a first cooling plate coupled to the first cooling space to seal the first cooling space thereby; a second cooling plate coupled to the second cooling space and provided with a pair of flow holes; a first power module contacting with the first cooling plate; a second power module contacting with the second cooling plate; an extrusion cooler contacting with the second power module; and a third power module contacting with the extrusion cooler.

Abstract: An inverter apparatus of a mobility has a structure in which a power module and a cooler are stacked so that an overall size of the inverter apparatus is reduced, and the cooler is pressed by a cover so that the cooler and the power module are in contact with each other, increasing the cooling performance of the cooler.

Abstract: A cooling apparatus for an electronic element includes a first chamber in a non-vacuum state, the first chamber being configured such that a printed circuit board equipped with a heat-generating element is disposed in the first chamber, a second chamber in a vacuum state, the second chamber being configured such that a spray unit configured to spray a refrigerant and a refrigerant supply unit configured to supply the refrigerant to the spray unit are disposed in the second chamber, and an evaporation unit disposed between the first chamber and the second chamber, in which the spray unit sprays the refrigerant, which is supplied by the refrigerant supply unit and condensed in the second chamber, into the second chamber, and in which the evaporation unit evaporates the refrigerant, which is sprayed into the second chamber by the spray unit.

Abstract: A semiconductor module includes a cooling device that includes: a ceiling plate; a side wall; a bottom plate; a plurality of pin fins having a polygonal shape and arranged in a matrix form in which one end of the respective pin fins is connected to a fin region having a rectangular shape; an inlet for a coolant at a first position adjacent to a part of one of long sides of the fin region, and an outlet for the coolant at a second position adjacent to a part of the other long side of the fin region. The matrix directions of the respective pin fins make an angle with a straight line connecting the first position and the second position, and a length of a segment of the straight line passing across the fin region is longer than a length of short sides of the fin region.

Abstract: A flexible circuit board includes an electrically insulating cover layer, at least one electrical component arranged on the upper side of the cover layer with electrical contacts, a conducting track structure arranged on the underside of the cover layer and with contact regions, wherein the electrical contacts are each electrically conductively connected to one of the contact regions through one of a plurality of openings in the cover layer, a heat sink which is thermally conductively connected to each electrical component through the cover layer, and a layer with high conductivity. To create an improved cooling capacity of the electrical component, the heat arising in the electrical components is first dissipated effectively within the conducting paths of the conducting path structure and then dissipated out of the conducting paths directly into the heat sink by the layer with high heat conductivity.

Abstract: A container for one or more electronic devices is provided with a heat exchanger usable in extreme conditions to keep the contained electronic device(s) within a desired temperature range. The container has an external enclosure, insulation, an interior enclosure, and a heat exchanger. The electronic devices or components can be a board, a card or other type of electronic component, and they are contained within the interior enclosure. The interior enclosure is filled with a dielectric fluid. The heat exchanger is a passive heat exchanger and can be made of heat pipes. The heat exchanger has a first section within the interior enclosure and a second section exterior of the interior enclosure. Heat is drawn out of the interior enclosure through the interior enclosure shell and via the heat exchanger. Any water within the interior enclosure falls to the bottom of the interior enclosure.

Abstract: A cable inlet device consists substantially of an open frame part and at least one sealing insert arranged therein. This cable inlet device is attached to a switchgear cabinet so that the sealing insert and the frame part of the cable inlet device terminate flush with the opening. When the switchgear cabinet is closed, for example by a switchgear cabinet door or switchgear cabinet wall or the like, this door or wall is sealingly pressed with a counterpart seal against the cable inlet device. For replacement of cables it is merely necessary for the switchgear cabinet door/switchgear cabinet wall to be opened and for the cable to be changed to be removed together with the corresponding sealing element, and for the new cable to be provided with a matching sealing element and to be inserted.

Abstract: An electronic control device 1 includes: a circuit board 4 having a first surface 4A on which heat-generating components 21, 22, 23 and heat-degradable components 31, 32 are mounted; a first metallic case 2 covering the first surface 4A; a second case 3 covering a second surface 4B of the circuit board 4 opposite to the first surface 4A; supporting members 51, 52 provided between the heat-degradable components 31, 32 and the first case 2 to support the heat-degradable components 31, 32; and heat-dissipating members 41, 42, 43, each provided on at least any of the heat-generating components 21, 22, 23, and the first case 2, to transmit heat generated from the heat-generating component 21, 22, or 23, to the first case 2. A heat conductivity of the heat-dissipating members 41, 42, 43 is higher than a heat conductivity of the supporting members 51, 52.

Abstract: Disclosed is a heat dissipation subrack, including a cabinet body defining an accommodating space. The cabinet body defines an air inlet, two air supplementing openings, and an air outlet. The accommodating space has an air inlet region, and a heat source region communicatively coupled to the air inlet region. An opening direction of the air inlet and an opening direction of each of the air supplementing openings intersect in the air inlet region. The cabinet body includes multiple baffles, each of the baffles includes two wind shielding surfaces, and airflow passages are defined between each two adjacent baffles and between one of inner walls of the cabinet body and an baffle adjacent to the one of the inner walls of the cabinet body.