Patents Examined by Steven Phillips
  • Limiting tin sludge formation in tin or tin-lead electroplating solutions
    Patent number: 5094726
    Abstract: Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.
    Type: Grant
    Filed: September 20, 1990
    Date of Patent: March 10, 1992
    Assignee: LeaRonal, Inc.
    Inventors: Fred I. Nobel, Barnet D. Ostrow, David N. Schram