Patents Examined by Sung H Park
  • Patent number: 10739518
    Abstract: Wavelength division multiplexing devices, and methods of forming the same, include a coupling lens and a waveguide, the lens being positioned over a mirror formed in a transmission path of the waveguide. The mirror reflects incoming light signals out of the transmission path through the lens and further reflects light signals coming from the lens and into the transmission path. An optical chip is positioned near a focal length of the lens. The optical chip has an optical filter configured to transmit a light signal at a first wavelength and to reflect received light signals at wavelengths other than the first wavelength.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: August 11, 2020
    Assignee: International Business Machines Corporation
    Inventor: Jean Benoit Héroux
  • Patent number: 10718909
    Abstract: An expanded beam fiber optic connection system is disclosed which overcomes the problems associated with known expanded beam fiber optic connection systems. In particular, the expanded beam fiber optic connection system in accordance with the present invention includes a pair of mating fiber optic connectors. Each fiber optic connector includes a connector body and fiber optic termini. In accordance with an important aspect of the invention, the fiber optic termini utilize expanded beam technology and are configured with virtually the same form factor as existing physical contact fiber optic termini. The configuration of the expanded beam termini provides several benefits.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: July 21, 2020
    Assignee: GLENAIR, INC.
    Inventors: Gregory B. Noll, Monish J. Doshi, Deniz K. Armani, Jonathon M. Smith
  • Patent number: 7555184
    Abstract: An optical fiber includes a core, a clad formed around the core, a plurality of holes being formed in the clad, and a UV curing optically-transparent resin which is filled in the holes and hardened. The UV curing optically-transparent resin has a Young's modulus of 8 to 500 MPa after hardening.
    Type: Grant
    Filed: November 16, 2007
    Date of Patent: June 30, 2009
    Assignee: Hitachi Cable, Ltd.
    Inventors: Yoshinori Kurosawa, Kazumasa Ohsono, Yoshihisa Kato