Patents Examined by Sunita Joshi
  • Patent number: 10448176
    Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: October 15, 2019
    Assignee: Starkey Laboratories, Inc.
    Inventors: Douglas F. Link, David Prchal, Sidney A. Higgins
  • Patent number: 10433045
    Abstract: An earbud design is disclosed that is configured to sit securely within an ear of a user. The earbud can be secured within the ear by an anchoring feature formed from an elastomeric material. The anchoring feature has a size and shape in accordance with an interior geometry of an ear of a user. Because the anchoring feature positions the earbud with respect to the ear, geometries of the earbud can be focused upon audio performance and/or device aesthetics. In some embodiments, the earbud housing can have a linear design which allows an audio driver within the earbud housing to be positioned close to an opening defined by the earbud housing. In this way, acoustic degradation associated with a long audio path from the audio driver to the opening can be avoided.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: October 1, 2019
    Assignee: Apple Inc.
    Inventors: Glenn K. Trainer, Scott C. Grinker, Craig M. Stanley
  • Patent number: 10433043
    Abstract: An in-ear hearing device having an ear interfacing portion integrally formed with an elongated stem portion, wherein the ear interfacing portion extends away from the elongated stem portion; a first acoustic port formed in the ear interfacing portion; a speaker disposed in the ear interfacing portion and aligned to emit sound from the acoustic port; a plurality of electrical contacts disposed at an end of the stem portion, the plurality of electrical contacts including first and second contacts; a second acoustic port formed at the end of the elongated stem portion between the first and second contacts; a microphone disposed in the stem portion; and a channel that fluidically couples the microphone to the second acoustic port.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: October 1, 2019
    Assignee: Apple Inc.
    Inventors: M. Evans Hankey, Emery A. Sanford, Christopher D. Prest, Way Chet Lim
  • Patent number: 10433075
    Abstract: A hearing aid system and method is disclosed. Disclosed embodiments provide for low latency enhanced audio using a hearing aid earpiece and an auxiliary processing unit wirelessly connected to the earpiece. These and other embodiments are disclosed herein.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: October 1, 2019
    Assignee: Whisper.ai, Inc.
    Inventors: Dwight Crow, Shlomo Zippel, Andrew Song, Emmett McQuinn, Zachary Rich
  • Patent number: 10425715
    Abstract: A headphone stand with a base, a stem extending vertically therefrom, and a holder affixed to the stem at or near the top. The holder may be lined, cushioned or padded. The stem is hollow in whole or in part. A recharging cable and plug (which may be a power plug, USB plug, or other form of plug) extends upwards from the base inside the stem, and emerge from an opening located in the stem. The portion of the cable corresponding to the opening is shaped so that the cable forms the cover for the opening when in the neutral position. The outside of the cable may be curved to match the curvature of the stem, and similarly colored, so that when in place as a cover for the opening, the plug on the cable is facing the interior of the stem and this section of the cable appears to be part of the stem.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: September 24, 2019
    Inventor: Andrew Bradford Green
  • Patent number: 10425743
    Abstract: A capacitive transducer includes a substrate having an opening in a surface thereof, a back plate facing the opening in the substrate, a vibration electrode film facing the back plate across a space, the vibration electrode film being deformable to have a deformation converted into a change in capacitance between the vibration electrode film and the back plate, the vibration electrode film having a through-hole as a pressure relief hole, and a protrusion integral with and formed from the same member as the back plate, the protrusion being placeable in the pressure relief hole before the vibration electrode film deforms. The pressure relief hole and the protrusion have a gap therebetween defining an airflow channel as a pressure relief channel. The protrusion has a through-hole extending from a distal portion of the protrusion to a portion of the back plate opposite to the protrusion.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: September 24, 2019
    Assignee: OMRON Corporation
    Inventors: Takashi Kasai, Yusuke Nakagawa
  • Patent number: 10412504
    Abstract: A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate and having a plurality of acoustic holes, a diaphragm disposed over the substrate to cover the cavity, the diaphragm being disposed under the back plate to be spaced apart from the back plate, including venting holes communicating with the cavity, and sensing an acoustic pressure to create a displacement, a first insulation layer interposed between the substrate and the diaphragm to support the diaphragm, and the first insulation layer including an opening formed at a position corresponding to the cavity to expose the diaphragm, a second insulating layer formed over the substrate to cover an upper face of the back plate and an insulating interlayer formed between the first insulation layer and the second insulation layer, and the insulation interlayer being located outside the diaphragm and supporting the second insulation layer to make the back plate be spaced from the diaphragm.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: September 10, 2019
    Assignee: DB HITEK CO., LTD.
    Inventors: Jong Won Sun, Han Choon Lee
  • Patent number: 10412513
    Abstract: A hearing device comprising a first shell member and a second shell member constituting a housing when assembled is disclosed. The hearing device comprises a chassis provided with attachment structures for attachment of the first shell member and the second shell member to the chassis.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: September 10, 2019
    Assignee: Oticon A/S
    Inventor: Lars Monroy
  • Patent number: 10405086
    Abstract: An apparatus includes a printed wiring board (PWB) that defines an aperture. A microphone is mounted on the PWB such that the aperture provides an acoustic path to the microphone. An acoustic interface member defines a cavity that is acoustically coupled to the microphone via the aperture. A first gasket between the printed wiring board and the acoustic interface member forms an acoustic seal. A housing is included, and a second gasket is disposed between the acoustic interface member and the housing to form an acoustic seal. An acoustic chamber is defined by a sealed volume that extends from a first (bottom/inner) surface of the housing down to a junction between the microphone and the PWB. The housing defines apertures which provide an acoustic path between a region external to the housing and the acoustic chamber. The acoustic chamber and the apertures in the housing form a Helmholtz resonator.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: September 3, 2019
    Assignee: Bose Corporation
    Inventors: Austin Mackey, Brandon Hicks, Donna Marie Sullivan, Christopher Ratcliffe
  • Patent number: 10405101
    Abstract: A MEMS loudspeaker for generating sound waves in the audible wavelength spectrum includes a carrier substrate with a substrate cavity with two substrate openings formed on two opposite sides of the carrier substrate, and a diaphragm anchored in the substrate. An actuator structure is arranged in the region of one of the two substrate openings and configured to vibrate the diaphragm to generate sound waves. An intermediate cavity is formed in a space between the diaphragm and the actuator structure. A coupling element is disposed in the intermediate cavity and connects the actuator structure to the diaphragm and can vibrate with respect to the carrier substrate.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: September 3, 2019
    Assignee: Usound GmbH
    Inventors: Andrea Rusconi Clerici Beltrami, Ferruccio Bottoni
  • Patent number: 10405106
    Abstract: A microphone includes a base; a first micro electro mechanical system (MEMS) device and a second MEMS device disposed on the base. The first MEMS device has a first diaphragm and a first back plate, and the second MEMS device has a second diaphragm and a second back plate. The first MEMS device and the second MEMS device are arranged such that positive pressure moves the first diaphragm towards the first back plate, and the positive pressure simultaneously moves the second diaphragm of the from second back plate.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: September 3, 2019
    Assignee: Knowles Electronics, LLC
    Inventor: Sung Lee
  • Patent number: 10405104
    Abstract: The invention includes a basic approach to simulate the workings of a ribbon microphone based on measurements at an array of more robust small pressure microphones. Embodiments of the invention take an array of microphone elements, either very small microphones that are placed on either side of a printed circuit board or some other device to understand the sound pressure differences from front to back and use those sound pressure differences to emulate the motion of a ribbon if a ribbon were co-located with the array of microphones. The microphone array detects differential pressure, either by a set of elements that that have figure of eight polar patterns, or by having separate elements front and back.
    Type: Grant
    Filed: September 1, 2011
    Date of Patent: September 3, 2019
    Inventor: Jonathan S. Abel
  • Patent number: 10382856
    Abstract: A device having an earphone is provided to be attached to the tragus of the outer ear of a person, wherein two levers held to one another in a pivotal manner from opposite sides, driven by an elastically preloaded part, press onto the tragus. The levers both have two arms, wherein the pivot axis is at a distance from the ends of the two levers in the longitudinal direction of the lever and lies outside the normal projection towards the surface of the tragus when the device is attached as intended to the tragus, and/or the elastically preloaded part is a pre-curved bending spring which is pre-curved by more than 360°.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: August 13, 2019
    Inventor: Jerzy Franciszek Kucharko
  • Patent number: 10375488
    Abstract: Disclosed are various embodiments of systems, devices, components and methods for reducing feedback between a transducer and one or more microphones in a magnetic bone conduction hearing device. Such systems, devices, components and methods include acoustically sealing or welding first and second compartments of the hearing device from one another, where the first compart contains the one or more microphones, and the second compart contains the transducer.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: August 6, 2019
    Assignee: Sophono, Inc.
    Inventors: Peter Ruppersberg, Markus C. Haller, Todd C. Wyant, Nicholas F. Pergola
  • Patent number: 10375470
    Abstract: The invention relates a horn-based multi-driver wide-bandwidth loudspeaker with a flat-frequency response having the property of controlled acoustic directivity at wavelengths larger than the nominal wavelength supported by the horns' mouth circumference which is provided by means of a centerbody fitted with acoustic drivers that are acoustically coupled to the walls of the horn enclosure.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: August 6, 2019
    Inventors: Anthony Allen Bisset, Quang-Viet Nguyen
  • Patent number: 10368157
    Abstract: Various implementations include headphone systems. In one implementation, a headphone system includes: a pair of earcups; a continuous headband spring connecting the pair of earcups, the continuous headband spring having an internal slot with an opening along an inner surface thereof; and an adjustment apparatus coupled with one of the pair of earcups and the continuous headband spring, the adjustment apparatus having: a shoe coupled with the one of the pair of earcups and positioned in the internal slot; a tongue coupled with the shoe and extending at least partially along the continuous headband spring; and a resistance member coupled with the tongue for resisting movement of the tongue relative to the continuous headband spring.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: July 30, 2019
    Assignee: BOSE CORPORATION
    Inventors: Benjamin E. Zelnick, Bennett P. Daley, Daniel P. Baker
  • Patent number: 10368152
    Abstract: The disclosure relates to a microphone arrangement comprising at least three groups of microphones that are mounted on a head-wearable support structure. The at least three groups of microphones comprising a first group of microphones with one or more microphones, a second group of microphones with one or more microphones, and a third group of microphones with one or more microphones, wherein the first group is mounted to a casing that accommodates signal transmission circuitry, the second group is mounted to slide with respect to the casing and the first group is mounted in a direction of a first axis.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: July 30, 2019
    Assignee: SENNHEISER COMMUNICATIONS A/S
    Inventors: Torben Christiansen, Svend Feldt, Kim Larsen
  • Patent number: 10368176
    Abstract: This invention relates to an earpiece (1) for coupling a hearing aid (10) to the ear (20) of a hearing aid user, comprising a seal (2) conforming to the shape of the user's ear canal (30) and therein retained; wherein the seal (2) comprises a sound output bore (3) connected to a receiver (11) of the hearing aid (10); and a multiplicity of through openings (4) spaced around the sound output bore (3). The number of the openings (4) is comprised in a range of 50 to 2000; and the openings (4) have diameters in the range of 50 to 250 micrometers. The present invention also relates to a method of manufacturing such an earpiece (1).
    Type: Grant
    Filed: November 10, 2015
    Date of Patent: July 30, 2019
    Assignee: Sonova AG
    Inventors: Erdal Karamuk, Hans Georg Meier, Markus Mueller
  • Patent number: 10362411
    Abstract: A hearing device comprising a housing configured to be arranged in the ear canal or behind the outer ear of a user, wherein an attachment arrangement is mechanically connected to the housing. The attachment arrangement comprises at least one first attachment part and at least one second attachment part, which is configured to be arranged relative to each other by means of one or more attraction members provided on each of said first and second attachment parts.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: July 23, 2019
    Assignee: Oticon A/S
    Inventor: Lars Riemer
  • Patent number: 10362387
    Abstract: An acoustic resistor for use in an audio device includes a resin film having air permeability in a thickness direction of the resin film, and the resin film is a non-porous film having through holes formed to extend straight through the resin film in the thickness direction. This acoustic resistor is used in an audio device including: a transducing part that performs conversion between sound and an electrical signal and that includes an acoustic element; a housing enclosing the transducing part and having at least one opening; and a passage for gas that is present inside the housing and communicates with the opening and in which the acoustic element is placed. The acoustic resistor is placed between the opening and the acoustic element in the passage. The variation in properties of the acoustic resistor of the present disclosure can be made smaller than that of conventional acoustic resistors.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: July 23, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Bunta Hirai, Satoru Furuyama, Masaaki Mori, Hajime Yamamoto