Patents Examined by Syed A Warsi
  • Patent number: 11404878
    Abstract: The invention relates to a method for controlling an electrical transmission link (3) between first and second AC voltage buses (11, 21) comprising a high-voltage DC line (320), first and second AC/DC converters (321, 322) connected to the high-voltage DC line (320), comprising: retrieving a setpoint active power value (Pdc0) applied to a converter (321, 322); retrieving the instantaneous values V1 and V2 of the voltages on the first and second buses; wherein the setpoint active power of the first or of the second converter is modified by a value including a term ?Pdc, so as to impose new dynamics on the first and second areas, where: ?Pdc=?Pdcs+?Pdca.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: August 2, 2022
    Assignees: SUPERGRID INSTITUTE, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
    Inventors: Juan Carlos Gonzalez, Valentin Costan, Gilney Damm, Abdelkrim Benchaib, Françoise Lamnabhi-Lagarrigue, Bruno Luscan
  • Patent number: 11392099
    Abstract: A control system for controlling a power generator of a power generation system executes a control policy to map an input-and-output sequence to a current value of the excitation voltage, submits the current value of the excitation voltage to the power generator, accepts a current value of the rotor angle caused by actuating the power generator according to the current value of the excitation voltage, and updates the input-and-output sequence with the corresponding current values of the rotor angle and the excitation voltage. The input-and-output sequence of values of the operation of the power generator includes a sequence of multiple values of the rotor angle of the power generator and a corresponding sequence of multiple values of excitation voltage to the power generator causing the values of the rotor angle. The control policy maps the input-and-output sequence to a current control input defining the current value of the excitation voltage.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: July 19, 2022
    Assignee: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: Yebin Wang, Weinan Gao
  • Patent number: 11385627
    Abstract: A semiconductor fabrication scheduling method includes creating a load scheduling data schema including facility data of product lots to be dispatched to a plurality of workstations; generating a load schedule profile using a load-balancing model and based on the load scheduling data schema, wherein the load-balancing model includes one or more objective functions and there is at least one weight factor in an objective function; generating a current load schedule based on the load schedule profile; dispatching the product lots to the plurality of workstations using the current load schedule to complete fabrication of the product lots; obtaining a set of current key performance indicators (KPIs) of the completed fabrication of the product lots; and automatically adjusting the weight factors of the objective functions of the load-balancing model based on the current KPIs using a big-data architecture to generate a next load schedule for next cycle of fabrication.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: July 12, 2022
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Weirong Zheng, Heqing Wang
  • Patent number: 11340583
    Abstract: The invention relates to a device designed to determine manufacturing data for producing objects that have variable, freely orientable orthotropic elasticity characteristics, by calculating data relating to grains of branches, which combined define branches, the number of grains of branches and the thickness of each branch being related to the desired elasticity characteristics.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: May 24, 2022
    Assignee: INRIA INSTITUT NATIONAL DE RECHERECHE EN INFORMAT
    Inventors: Jonas Martinez, Sylvain Lefebvre, Jérémie Dumas, Haichuan Song
  • Patent number: 11327464
    Abstract: A method of manufacturing a collimator (134) on a three-dimensional printer (510) includes obtaining design specifications (536) for the collimator, the design specifications including a channel perimeter pattern and an overall collimator thickness, determining a first quantity of deposit layer permutation types based on the channel perimeter pattern, determining a respective second quantity of permutation layer elements (310, 320, 330) for each respective one of the deposit layer permutations, generating respective sets of sequences for each respective one of the deposit layer permutations, the number of sets equal to the respective second quantity for the corresponding deposit layer permutations, assembling the respective sets of sequences into a three-dimensional print file (538), providing the three-dimensional file to the three-dimensional printer, and manufacturing the collimator by depositing additive layers of material based on contents of the three-dimensional file.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: May 10, 2022
    Assignee: Siemens Medical Solutions USA, Inc.
    Inventor: Miesher Rodrigues
  • Patent number: 11307559
    Abstract: Methods, systems, and apparatus, including medium-encoded computer program products, for computer aided design and manufacture of physical structures using subtractive manufacturing systems and techniques include, in one aspect, a method including: obtaining a toolpath specification for a three dimensional model of geometry of a part to be machined from a workpiece; calculating predicted cutting forces to be applied to the workpiece when machining the part; generating a set of holding tabs for the part based on the predicted cutting forces, wherein each of the holding tabs bridge from the part to the workpiece so as to keep the part fixed, in situ, within the workpiece during the machining, and at least one position of a holding tab from the set is determined in accordance with the predicted cutting forces; and providing the set of holding tabs for use by a computer-controlled manufacturing system.
    Type: Grant
    Filed: June 1, 2020
    Date of Patent: April 19, 2022
    Assignee: Autodesk, Inc.
    Inventors: Lee Sanders, Mark Antony Millership