Patents Examined by T. Basma
  • Patent number: 4604678
    Abstract: An improved circuit board having electrically conductive traces connected to respective terminals of a number of electrically current components mounted on a substrate. The substrate has cavities for mounting the components, and a plurality of grooves extend into one or both of a pair of opposed surfaces of the substrate. The grooves are filled by plating with an electrically conductive material to form the traces. Thus, the traces not only extend in the plane of a surface of the substrate but also extend perpendicular to such plane and into the substrate itself whereby a high packing density of traces can be achieved while maintaining essentially electrical paths between the components. The depth of each trace is a number of times greater than the width of the trace, a typical ratio being 10:1. The substrate can be molded from a plateable plastic or ceramic material and the grooves can be machined by a laser beam.
    Type: Grant
    Filed: July 18, 1983
    Date of Patent: August 5, 1986
    Assignee: Frederick Parker
    Inventor: George R. Hagner
  • Patent number: 4602318
    Abstract: Substrates for interconnecting components in which a filament is applied and affixed to a base in a pre-determined pattern, the base surface and applied filaments are coated with a coating and the coating is hardened to form a substantially flat surface over the base and filaments. The coated base is then positioned on a table movable along "x" and "y" axes and the coated base is positioned under a high energy beam at pre-programmed points on the applied filament pattern and access openings are formed in the coating on the base at such points to expose the filament at each such point so that the exposed filament can be interfaced with the exposed surface of the coated base and articles for mounting and interconnecting components formed thereby.
    Type: Grant
    Filed: July 25, 1984
    Date of Patent: July 22, 1986
    Assignee: Kollmorgen Technologies Corporation
    Inventor: Charles L. Lassen
  • Patent number: 4591950
    Abstract: An insulating housing has a circuit board mounted on its interior with separate conductive tab end portions of the board protruding outwardly through apertures in the housing. The tab portions have printed thereon conductive parts which connect with selected printed points or components on the board within the housing. Each tab has a hole for a screw in its conductive part so that when a wire is wound around the screw and the screw is tightened, good low-ohmic contact with a designated part of the board is made and the tab is positionally fixed to the housing. Slots between the tabs permit each screw binding post to be electrically insulated from its adjacent post by the interposition of integrally molded perpendicular barriers in the slots.
    Type: Grant
    Filed: September 9, 1983
    Date of Patent: May 27, 1986
    Assignee: American Manufacturing Company, Inc.
    Inventor: Grover K. Houpt
  • Patent number: 4516188
    Abstract: A logic card comprises a printed circuitboard equipped with integrated modules, a plug connector and a contact pressure component, for example, a cooling device, which exerts a pressure against a surface of the printed circuitboard. In order to prevent sag of the printed circuitboard which could result by the contact pressure component, or to prevent line ruptures and the like caused by plug-in and pulling events, a counterpressure is generated against the printed circuitboard and an elastic connection is produced between the plug connector and the printed circuitboard. To this end, the contacting elements of the plug connector are uniformly, planarly distributed over the printed circuitboard. Each comprises a spring shank for receiving a contact pin and a terminal lug for resiliently pressing against the printed circuitboard.
    Type: Grant
    Filed: August 25, 1983
    Date of Patent: May 7, 1985
    Assignee: Siemens Aktiengesellschaft
    Inventor: Claus Kessler