Abstract: An IC package comprising an integrated substrate which includes a cavity, in which an IC chip is mounted, formed by a wall surrounding the IC chip, and a groove formed in the surrounding wall extending to surround and communicate with the cavity and method for fabricating the IC package, wherein an excessive amount of resin is filled in the cavity of the integrated substrate, and the composite structure pressed by a plate whereby the excess of the resin overflows from the cavity pressure to be received in the groove such that, the exposed surface of the filled resin is formed into a predetermined shape without requiring grinding.

Abstract: According to this invention, a semiconductor chip incorporating a power control element is mounted on a heat dissipation member by a conductive solder, and lead members electrically connected to terminals extending from the semiconductor chip are arranged to have a surface level almost equal to that of the heat dissipation member. A main body structure including the semiconductor chip and the members is sealed by a sealing plastic body. A plastic table integrated with the sealing plastic body projects and is formed at a position corresponding to a lower side of outer leads which extends from the heat dissipation and lead members and is extracted from the sealing plastic body, and the outer leads are bent upward at a position corresponding to a position of the plastic table. The sealing plastic body is mounted on an external mounting member having a heat dissipation function.

Abstract: The orientation of a helmet is monitored by illuminating the cockpit volume by a moving interference pattern produced by three beams. The sensors detect the varying phase to produce outputs which are compared to determine the orientation of the helmet.

Abstract: A high power semiconductor device with integral heat sink capable of accommodating substantial heat flux on the order of one kw per cm.sup.2. The integral heat sink is formed on the active surface of the semiconductor and utilizes an AlN thin film of high purity to provide a low thermal impedance heat conductor for removing heat directly from the active semiconductor surface. A microchannel heat sink is formed on the A1N thin film and has a source of cooling fluid flowing through the microchannel heat sink for conducting heat away from the sink. The result is the ability to conduct large heat fluxes away from the intimately contacted heat generating semiconductor surface to the cooling fluid in the microchannel heat sink and thus operate the semiconductor under substantially higher power than has been practical heretofore in a device of such simplicity.

Abstract: Spacers are attached to or made an integral part of the housing of a semiconductor package in order to set a desired spacing between a surface of the package housing and the heatsink. Then when the heatsink is attached to the housing, a uniform clearance is maintained between the heatsink and the surface of the housing. When such clearance is filled with an epoxy for bonding the heatsink to the housing, the bondlength of the epoxy layer will be uniform and be of the desired value.

Abstract: A semiconductor device mounted on a substrate. Outer leads, partially resin-molded, have a greater height above the mounting surface than that of a conventional device. Specifically, each lead projecting from the molded resin has a bent portion which is convex in the direction opposite to the mounting surface, and the length of the lead beyond the bent portion is greater than the distance from the lead portion adjacent to the resin portion of the lead to the mounting surface. The long leads improve reliability during, e.g., heat cycle, tests. In another embodiment, outer leads, partially resin-molded, have reverse J-shaped bent portions, each with a distal end positioned away from the resin. When the bent portions serve as soldering portions, the soldering condition can be easily checked.

Abstract: An optical surface roughness measuring apparatus for measuring roughness of a surface of a subject, by irradiating the surface with two linearly polarized beams of light which have orthogonal planes of polarization and different frequencies, and detecting a change in a beat frequency of the two beams reflected by the surface. The optical surface measuring apparatus includes a laser device for producing two linearly polarized laser beams as the two linearly polarized beams, and an optical device having a single optical path between the laser device and the surface of the subject, so that the two linearly polarized laser beams are propagated from the laser device toward the surface along the single optical path.

Abstract: A low light sensing and amplifying device uses an automatically adjustable electro-optic shutter that quantitatively attenuates the amount of monitored electromagnetic energy impinging on a light processor in proportional relation to the electromagnetic energy's intensity. An output signal from the light processor controls the output of a power supply which provides an output supply signal to the electro-optic shutter.

Abstract: An X-ray image intensifier includes an input screen for converting incident X-ray into photoelectrons. The input screen has a substrate, a phosphor layer having a layer number of columnar crystals of a phosphor formed with gaps therebetween on the substrate, and a photoelectric layer directly or indirectly provided on the phosphor layer. The columnar crystals at a peripheral edge portion of the input screen are thinner than the columnar crystals at a central portion of the input screen.

Abstract: The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.

Abstract: The disclosed invention comprises multiple semiconductor devices within a single carrier structure. In accordance with one embodiment of the invention, a plurality of semiconductor die are coupled to the leads of a leadframe and are encapsulated by individual package bodies. A carrier structure is formed which encircles all of the die and encapsulates portions of the distal ends of the leads. The extreme distal portions of the leads extend through the carrier to form contact points which are used to access the semiconductor die. By having multiple devices within a single carrier, productivity is improved and costs associated with leadframe and carrier structure materials are reduced.

Abstract: The invention relates to apparatus for accurately counting the number of containerized items by movement of a unitary emitting and sensor of a beam of light over rows and columns of the planar surface platform supporting the containerized items.

Abstract: A high hat cymbals device is automatically actuated to hold the cymbals locked in place. The presence or absence of the drummer's foot on or above the foot pedal for actuating the high hat is sensed, and the cymbals held together if the drummer's foot is not sensed. Sensing is accomplished utilizing an infrared LED or other source of light, preferably one that is pulsed and frequency modulated, and a photodiode or other light sensing device. The signal from the photodiode is filtered and amplified and ultimately operates a solenoid to either allow normal operation of the high hat, or move the high hat cymbals together. The light source and sensor are mounted on the bottom of the foot pedal and cooperate with an opening in the foot pedal so that the light is reflected to the photodiode if the drummer's foot is present on or above the foot pedal, but passes through the opening if it is not.

Abstract: A first plurality of contacts are disposed on a first surface of a flexible tape in a pattern matching the pattern of the contacts of a semiconductor die. A second plurality of contacts are disposed on a second surface of the flexible tape in a pattern matching the pattern of the contacts of a substrate. The first and second plurality of contacts are then coupled by conductive lines disposed on the surfaces of the flexible tape and extending through the conductive tape.

Abstract: A light source emits light having two components which ave slightly-different frequencies and which have different planes of polarization. The emitted light is separated into first, second, and third parts travelling along different paths respectively. First, second, and third reference gratings diffract the first, second, and third light parts respectively. First, second, and third illumination optical systems selectively transmit the diffracted first, second, and third light parts respectively. First, second, and third mark gratings having predetermined orientations are formed on a mask and are illuminated with the first, second, and third light parts coming from the first, second, and third illumination systems respectively. Similarly, first, second, and third mark gratings are formed on a wafer and are illuminated with the first, second, and third light parts coming from the first, second, and third illumination systems respectively.