Abstract: An integrated thermoelectric module is formed of a set of thermoelectric elements, consisting of N type and P type conductor and/or semiconductor elements electrically connected in series and thermally connected in parallel, the thermoelectric elements being electrically connected in series and/or in parallel and thermally connected in parallel and being assembled on flexible supports of polymeric material, capable of electrically isolating said circuit, but having a high thermal conductivity efficiency. Each support is connected to a heat exchanger by means of connection materials having low thermal impedance allowing optimum connection even at low adhesion pressures.