Abstract: In a plating bath for electrodeposition of aluminum, comprising a nonaqueous electrolyte using a eutectic mixture fusible at room temperature, the plating bath comprises a mixture of about 40 to 80 mol % of an aluminum halide and about 20 to 60 mol % of butyl pyridinium halide, or further comprises an organic solvent mixed in said mixture. This plating bath may not cause any color change of a coating into gray or black to assure white and uniform appearance, even when current density is increased to 30 A/dm.sup.2 or varied in the range from 0.1 to 30 A/dm.sup.2.