Patents Examined by Temilades S Rhodes-Vivour
-
Patent number: 12239061Abstract: Disclosed is a system for monitoring parts in a machine is provided. The system includes a base unit, and an electronic circuitry. The base unit includes a generator for generating controllable frequency, an impedance unit to resonate impedance with a matching frequency, a controller for modulating the impedance with commands, a first electrode to emit an alternating electric field, a mixer, and a communication unit for communicating the data and commands over a communication network. Further, the controller decodes changes in the impedance.Type: GrantFiled: April 8, 2022Date of Patent: March 4, 2025Inventors: Wolfgang Richter, Faranak Zadeh
-
Patent number: 12228595Abstract: Disclosed are apparatus and method for measuring electric current flowing through an inductive load energized by a half-bridge circuit with at least two semiconductor switches. The semiconductor switches are switched on and off in a complementary manner according to PWM.Type: GrantFiled: July 14, 2020Date of Patent: February 18, 2025Assignee: Conti Temic microelectronic GmbHInventors: Ulrich Joos, Erwin Kessler
-
Patent number: 12228980Abstract: A mounting system for an electronic device is disclosed. The mounting system includes a mounting plate; a plurality of fasteners for coupling the mounting plate with the electronic device; a single main gear mounted on the mounting plate; a plurality of secondary gears coupled, respectively, to the plurality of fasteners; and a plurality of intermediate gears mounted on the mounting plate and rotationally coupled between the single main gear and the plurality of secondary gears. Rotation of each of the plurality of secondary gears causes a fastening movement of a respective one of the plurality of fasteners. Simultaneous rotation of the plurality of intermediate gears causes the plurality of secondary gears to rotate simultaneously in response to a single rotational force being received by the main gear. The simultaneous rotation of the plurality of intermediate gears causes a simultaneous fastening movement of the plurality of secondary gears.Type: GrantFiled: March 3, 2023Date of Patent: February 18, 2025Assignee: QUANTA COMPUTER INC.Inventors: Chao-Jung Chen, Chih-Wei Lin, Yu-Nien Huang, Ming-Lun Liu
-
Patent number: 12214257Abstract: A method for tracking performance of player including determining global direction of magnetic field at first court and computing first court specific data; providing rotation for rotating apparatus about spin axis via player, wherein rotating apparatus comprising XYZ-magnetic field sensor; measuring plurality of magnetic field values as function of time when rotating apparatus is rotating about spin axis; computing magnetic field component of magnetic field in direction of local body co-ordinate of spin axis of rotating apparatus; determining direction of spin axis using computed magnetic field component of magnetic field and determined global direction of magnetic field; determining player specific data comprising angle of spin axis with respect to horizontal ground plane and angle of shot direction with respect to horizontal component of spin axis; and calibrating and storing first court specific data and player specific data to track performance of player at first court.Type: GrantFiled: July 29, 2022Date of Patent: February 4, 2025Assignee: Sstatzz OyInventors: Tuukka Nieminen, Jirka Porupudas, Harri Hohteri
-
Patent number: 12216158Abstract: Systems and methods for testing a photonic IC (PIC) with an optical probe having an out-of-plane edge coupler to convey test signals between the out-of-plane probe and an edge coupled photonic waveguide within a plane of the PIC. To accommodate dimensions of the optical probe, a test trench may be fabricated in the PIC near an edge coupler of the waveguide. The optical probe may be displaced along one or more axes relative to a prober to position a free end of the prober within the test trench and to align the probe's out-of-plane edge coupler with an edge coupler of a PIC waveguide. Accordingly, a PIC may be probed at the wafer-level, without first dicing a wafer into PIC chips or bars. The optical probe may be physically coupled to a prober through a contact sensor to detect and/or avoid physical contact between probe and PIC.Type: GrantFiled: November 24, 2020Date of Patent: February 4, 2025Assignee: Intel CorporationInventors: Jeremy Hicks, Hari Mahalingam, Christopher Seibert, Eric Snow, Harel Frish
-
Patent number: 12215740Abstract: A system for determining at least one defect of a bearing providing a first ring and a second ring capable of rotating concentrically relative to one another, first and second distance sensors mounted on the first ring of the bearing for measuring first and second differential distances between the first ring and the second ring, a storage device for storing each measured differential distance, a device configured to determine a first temporal profile of a radial relative displacement between the first and second rings, and a second temporal profile of an axial relative displacement between the first and second rings according to the stored measured differential distances in the storage device, and a device that identifies a defect of the bearing from the temporal profile.Type: GrantFiled: October 4, 2022Date of Patent: February 4, 2025Assignee: Aktiebolaget SKFInventor: Franck Landrieve
-
Patent number: 12210039Abstract: A measurement probe for producing a test signal for a measurement instrument includes a probe head structured to be connected to at least a first testing point and a second testing point of a Device Under Test (DUT), a current detector in the measurement probe structured to determine a current flowing between the first testing point and the second testing point of the DUT, a first selectable signal path that causes a voltage signal from the first testing point or a voltage signal from the second testing point to be routed to the measurement instrument as a selected voltage test signal, and a second selectable signal path that causes a current signal from an output of the current detector to be routed to the measurement instrument as a selected current test signal. Methods of testing a DUT using the measurement probe are also described, as well as a system for measuring signals from a DUT using the measurement probe.Type: GrantFiled: April 14, 2022Date of Patent: January 28, 2025Assignee: Tektronix, Inc.Inventors: Joshua J. O'Brien, Josiah A. Bartlett
-
Patent number: 12203980Abstract: A wafer-level method of testing an integrated circuit (IC) device includes: (i) applying a plurality of test operation signals to a wafer containing the IC device, (ii) generating a test enable signal in response to detecting, on the wafer, a toggling of at least one of the plurality of test operation signals, and then (iii) testing at least a portion of the IC device in response to the generating the test enable signal. The generating may also include generating a test enable signal in response to detecting, on the wafer, an inactive-to-active transition of a toggle detection signal.Type: GrantFiled: September 21, 2023Date of Patent: January 21, 2025Assignee: Samsung Electronics Co., Ltd.Inventors: Ahn Choi, Reum Oh
-
Patent number: 12203969Abstract: A mount board has a plurality of terminals electrically connected to a plurality of pins of a semiconductor device, and a conductor pattern. An electrostatic withstand voltage test device includes a metal plate on which the mount board is installed, a power supply for applying a voltage to the metal plate, an insulator disposed between the metal plate and the mount board, a switch circuit connected between the terminals and ground wiring, and a controller for controlling the switch circuit. The switch circuit includes a plurality of first switches provided corresponding to the terminals and each connecting a corresponding terminal to the ground wiring. The controller turns on at least one first switch selected from the first switches when an electric charge stored in the conductor pattern is discharged to the ground wiring through the semiconductor device.Type: GrantFiled: June 30, 2021Date of Patent: January 21, 2025Assignee: Mitsubishi Electric CorporationInventors: Kohei Nakanishi, Masao Kanatani, Shinichiro Ando
-
Patent number: 12202462Abstract: A method for automatically detecting a sensor coupled to an electronic computer including steps of detecting the sensor and steps of configuring a hardware interface.Type: GrantFiled: June 24, 2021Date of Patent: January 21, 2025Assignee: VITESCO TECHNOLOGIES GBMHInventors: Jacques Rocher, Yannick Leroy
-
Patent number: 12193516Abstract: A puff detection device (10) comprising a capacitive puff sensor (C2), a detection signal generator (140) for connection with the puff sensor (C2) and having an ESD diode (D2) at an input node (IN2), and a reference signal generator (120) which is configured to generate a train of reference pulses (CKI) having a reference frequency and comprises a reference capacitor (C1). The reference signal generator (120) includes a compensation device (D1) which is configured to provide a leakage current path at a charging node (IN1) of the reference capacitor (C1).Type: GrantFiled: September 23, 2021Date of Patent: January 14, 2025Assignee: SMART CHIP MICROELECTRONIC CO., LIMITEDInventor: Loi Ying Liu
-
Patent number: 12196909Abstract: A floor-mounted security device able to test personnel for metal material carried in or at the bottom of their footwear includes an induction module, a pressure sensing module, and an automatic alarm module. The pressure sensing module senses weight and pressure of a person standing, and outputs a trigger signal to the induction module to trigger operation of the induction module. The induction module can detect the presence of a metal mass by the change in a magnetic field, and output a control signal accordingly. The automatic alarm module outputs an alarm when prompted by the control signal.Type: GrantFiled: April 11, 2022Date of Patent: January 14, 2025Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.Inventor: Fei Zhang
-
Patent number: 12196780Abstract: A probe assembly includes a multilayer structure including probe contact pads, an upper guide plate including an array of upper holes therethrough, a lower guide plate including an array of lower holes therethrough, a vertical stack of a plurality of dielectric spacer plates located between the upper guide plate and the lower guide plate and including a respective opening therethrough, and an array of probes attached to the probe contact pads, vertically extending through the array of upper holes and the array of lower holes, and vertically extending through the openings through the vertical stack of the plurality of dielectric spacer plates.Type: GrantFiled: January 10, 2022Date of Patent: January 14, 2025Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Ming-Cheng Hsu, Wen-Chun Tu
-
Patent number: 12188889Abstract: A test system and test method continuously and intelligently measures water content of subgrade in real time. The test system is based on the theory of resistivity, and is equipped with a wheeled machine to measure the water content of subgrade. The wheeled machine includes scroll roller. The test system includes: at least one set of electrode including four probes wherein detection parts of the four probes are linearly and equidistantly arranged on the scroll roller. The arrangement direction of the detection parts of the four probes is parallel to the axis of the scroll roller; a data integration apparatus is connected to the four probes and used for performing data calculation, analysis, and transmission; the electric source is connected to data integration apparatus and used for supplying a working current. The system and method can realize automatic signal collection, non-destructive detection of subgrade soil and dynamic water content measurement.Type: GrantFiled: November 13, 2019Date of Patent: January 7, 2025Assignee: SHIJIAZHUANG TIEDAO UNIVERSITYInventors: Huaiping Feng, Hui Zhao, Deliang Ma, Jianmei Chang, Bing Duan, Chaoliang Ye, Yucheng Zhao
-
Patent number: 12188900Abstract: Embodiments of the present invention relate to a system and method for performing temperature-dependent measurements of a magnetic nanoparticle sample. The system includes high frequency coils and sample temperature tunable assembly to determine the specific relaxation process for magnetic nanoparticle sample using both time and frequency domain techniques. During the temperature-dependent measurements of a magnetic nanoparticle sample, system in accordance with embodiments of the present invention resolve the nanoparticle dynamics using a temperature-tunable dual mode, AC susceptibility and magnetic relaxometry, to cover a broad range of frequencies and time scales. Other operational modes of the invention can drive the nanoparticles with arbitrary waveforms (sinusoidal, sum of sinusoids, or repeated pulses) to elicit and measure tailored response behavior from the magnetic nanoparticle sample.Type: GrantFiled: February 11, 2022Date of Patent: January 7, 2025Assignee: GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCEInventors: Thinh Quoc Bui, Solomon Isaac Woods, Weston Leo Tew, Jr.
-
Patent number: 12183226Abstract: A chip on film (COF) package in which a predetermined driving integrated circuit (IC) is mounted includes a wiring structure connected to the driving IC, and a test pad connected to the wiring structure, wherein the test pad includes a base film divided into a first region and a second region, and a conductive layer located in the first region, and the second region is surrounded by the first region in a plan view.Type: GrantFiled: July 6, 2022Date of Patent: December 31, 2024Assignee: LX SEMICON CO., LTD.Inventors: Seung Hoon Jin, Young Min Choi
-
Patent number: 12174269Abstract: A current sensing method measures a fractional current through a coil having a plurality of coil windings by using a current sensing resistor to measure a current through a subset of the plurality of coil windings and using a voltage sensor to measure a voltage drop across the current sensing resistor. The measured current and voltage values are provided to a processor to determine the fractional current and phase of the coil. For example, the fractional current and phase of the coil may be determined by calculating a total current of the coil as I=n(V/Rx), where n is the number of coil windings of the coil, V is the measured voltage, and Rx is the impedance of the current sensing resistor. The coil may be a secondary winding used in a wireless power transfer system.Type: GrantFiled: December 13, 2022Date of Patent: December 24, 2024Assignee: InductEV, Inc.Inventors: John M. Wolgemuth, Benjamin H. Cohen, Daniel S. Hackman
-
Patent number: 12140555Abstract: A gas sensor includes: a substrate; a first conductor and a second conductor that are disposed on the substrate; an insulating layer; and an adsorbent layer. The insulating layer covers the first conductor and the second conductor, and has a first opening that allows a part of a surface of the first conductor to be exposed therethrough and a second opening that allows a part of a surface of the second conductor to be exposed therethrough. The adsorbent layer contains a conductive material and an organic adsorbent that can adsorb a gas. The adsorbent layer is in contact with the first conductor and the second conductor respectively through the first opening and the second opening.Type: GrantFiled: July 14, 2023Date of Patent: November 12, 2024Assignee: PANASONIC HOLDINGS CORPORATIONInventors: Atsuo Nakao, Masaya Nakatani, Kiyoshi Toko, Rui Yatabe, Bartosz Wyszynski
-
Patent number: 12135348Abstract: A substrate testing device includes a first testing component configured to couple to electrical pads of a substrate and perform electrical testing on one or more dies of the substrate during a test. The substrate testing device includes a second testing component configured to perform optical testing of the one or more dies during the test. The substrate testing device further includes a third testing component comprising a three-dimensional scanner configured to perform a dimensional scan of the one or more dies of the substrate, wherein the third testing component is to perform geometrical testing on the one or more dies during the test.Type: GrantFiled: August 24, 2022Date of Patent: November 5, 2024Assignee: Mellanox Technologies, Ltd.Inventors: Barak Freedman, Amir Silber
-
Patent number: 12132104Abstract: A semiconductor die includes: a SiC substrate; power and current sense transistors integrated in the substrate such that the current sense transistor mirrors current flow in the main power transistor; a gate terminal electrically connected to gate electrodes of both transistors; a drain terminal electrically connected to a drain region in the substrate and which is common to both transistors; a source terminal electrically connected to source regions of the power transistor; a dual mode sense terminal; and a doped resistor region in the substrate between the transistors. The dual mode sense terminal is electrically connected to source regions of the current sense transistor. The doped resistor region has an opposite conductivity type as the source regions of both transistors and is configured as a temperature sense resistor that electrically connects the source terminal to the dual mode sense terminal.Type: GrantFiled: September 13, 2023Date of Patent: October 29, 2024Assignee: Infineon Technologies AGInventors: Dethard Peters, Sascha Axel Baier, Tomas Reiter, Sandeep Walia, Frank Wolter