Abstract: A method and apparatus are disclosed which allow for the detection of an object (14) by the generation of a radiated beam (18) and a subsequent reflection by the object (14) of a portion (20) thereof. The detection of particulate object material (16) due to a reflection of a portion (22) of the generated beam (18) is minimized.

Abstract: A large area video camera is suitable for high energy imaging applications. The sensor-target of the camera tube is composed of TlBr, TlI, PbI.sub.2, or PbBr.sub.2 or a two layer structure comprising CsI and a photoconductive layer of materials such as amorphous silicon, amorphous selenium, cadmium sulphide, antimony trisulfide or antimony sulphide oxysulphide. A disclosed tube incorporates various modifications for dealing with problems associated with stray capacitance, premature electron leakage and secondary electron emission.

Abstract: A scanning probe microscope according to the present invention comprises a cantilever having a free end portion and a fixed end portion, the free end portion bearing a probe thereon, a semiconductor laser attached to the fixed end portion of the cantilever, an optical waveguide for guiding a laser beam, emitted from the semiconductor laser, to the free end portion, an optical element for dividing part of a center beam of the laser beam, guided through the optical waveguide, into laser beams in at least two perpendicular directions, a photoelectric transducer for receiving the divided laser beams and converting the laser beams into electrical output signals corresponding thereto, and a differential circuit for receiving the electrical signals and subjecting the signals to predetermined arithmetic processing, thereby detecting a three-dimensional displacement of the free end portion of the cantilever.

Abstract: A circuit primarily for use in conjunction with focal plane arrays which rejects input reset noise without adding power and complexity to the circuit. The circuit includes a preamplifier having input and output terminals, a first capacitor coupled between the input terminal and a source of reference potential, a second capacitor coupled between the output terminal and the source of reference potential, a switch coupled between the output terminal and the second capacitor coupling the output terminal to the second capacitor in response to a first predetermined signal, a third capacitor coupled between the junction of the switch and the second capacitor and a circuit output terminal and a plurality of fourth capacitors, each of the fourth capacitors coupled to a photodetector and having a switch responsive to a second predetermined signal controlling coupling of the fourth capacitor in parallel with the first capacitor.

Abstract: A monitoring system continuously monitors fibre optic cables for faults and then enables automatic location of the fault in the cable. In the system an optical monitoring signal is generated and connected as an output signal to a first end of the fiber optic cable for transmission to the second end. The signal is then returned through the fiber optic cable to provide a return signal at the first end of the cable. A comparator at the first end compares the output signal and the return signal and provides corresponding difference data. An optical time domain reflectometer detects the location of a signal loss along the fiber optic cable and a data processing system determines the location of the signal loss from the corresponding difference data. A single optical time domain reflectometer can be used for monitoring a plurality of fiber optic cables.

Abstract: A flow imaging cytometer for imaging the dimensions and shapes of particle components in a flow of a specimen solution employs a separate control solution, which is for managing precision, containing standard particles. A method of adjusting focal point with respect to the specimen flow includes steps of imaging the standard particles in the control solution, calculating an evaluation parameter which represents the definition of the image, and moving the flow cell or associated optical system so as to maximize the value of this parameter.

Abstract: A confocal scanning microscope comprises a light projecting device with which a small light spot of a light beam is formed on a sample, and a scanning mechanism which causes the light spot to scan the sample in main scanning and sub-scanning directions. A light receiving device condenses the light beam, which has passed through the sample, and an image of the condensed light beam is formed as a point image. A shutter array provided with a plurality of small light shutters, which are arrayed two-dimensionally, is located at a plane on which the point image is formed. An operating circuit sets a light shutter corresponding to the position, at which the point image is formed at any given instant, to an open state in synchronization with the main scanning and the sub-scanning with the light spot. A photodetector having a light receiving surface, which faces the whole surface of the shutter array, detects the point image through the light shutter, which has been set to the open state.

Abstract: A fiber optic calibration standard apparatus having a fiber optic cable pair which have difference in length of one quarter the wavelength of the applied modulated signal and are coupled to a mirrored reflecting surface to provide reflection reference signals that are utilized to generate error correction signals. A matched termination has one end of an optical fiber sealed in a vial of index matching fluid to absorb the optical power incident to the fiber.

Abstract: A first high-power element chip having high current consumption is mounted and fixed of a first bed portion on a heat radiating fin by soldering. A second high-power element chip is mounted and fixed by high-temperature die bonding on a second bed portion formed by denting a part of one end of a lead frame made of a metal thin plate, and an insulating paste is filled between the lower surface of the second bed portion and the upper surface of the first bed portion. In addition, a logic element chip is mounted and fixed on one end of another lead frame made of a metal thin plate by a conductive adhesive such as a silver paste.

Abstract: A dual-mode resonant scanning system comprising an electronic control circuit and a dual-mode resonant mechanical scanner to produce an essentially triangular scan pattern. The dual-mode mechanical scanner is mechanically tuned to simultaneously oscillate at a predetermined third harmonic frequency and the free running fundamental thereof. The electronic control circuit drives the mechanical scanner to oscillate at the exact fundamental frequency of the predetermined third harmonic frequency and phase locks the fundamental oscillation to the third harmonic oscillation. The dual-mode resonant mechanical scanner includes an optical scanning element having a first mass, a second mass, at least one torsion rod, a rotational actuator and a mechanical ground designed and integrated together such that the mechanical scanner is self resonant at the predetermined third harmonic frequency and at or within a few hertz of the exact fundamental frequency of the predetermined third harmonic frequency.

Abstract: An integrated circuit chip packaging structure comprising a substrate, preferably a semiconductor base substrate, a conductive layer on said substrate in regions where connections to metallization layers of the substrate are formed, solder balls and gold bumps connected to said conductive layer in said regions of said conductive layer, and a solder stop layer on said conductive layer at least around said solder balls. The conductive layer, further comprises wiring lines. Further, a method of forming the structure is disclosed which uses only two masks for providing terminals for connecting the substrate to integrated circuits and to other substrates or to the printed circuit board and wiring lines. Thus, there is a need for one less metallization layer. The method is applicable to 200 mm wafers and allows two different packaging technologies (C-4 and TAB or wire-bonding) on the same substrate. Thus, packaging of VLSI circuits is improved.