Patents Examined by Thanh Tvguyen
  • Integrated pad and fuse structure for planar copper metallurgy
    Patent number: 5795819
    Abstract: A semiconductor interconnection consists of a corrosion resistant integrated fuse and Controlled, Collapse Chip Connection (C4) structure for the planar copper Back End of Line (BEOL). Non copper fuse material is directly connected to copper wiring.
    Type: Grant
    Filed: September 9, 1997
    Date of Patent: August 18, 1998
    Assignee: International Business Machines Corporation
    Inventors: William Thomas Motsiff, Robert Michael Geffken, Ronald Robert Uttecht