Patents Examined by Theron Milliser
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Patent number: 9468090Abstract: In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering, blocking, or otherwise manipulating current flows. The multilayered printed circuit board includes at least one power plane layer. The power plane layer does not distribute current evenly. Instead, the power plane layer includes multiple patterns with different resistances. The patterns may include a hatching pattern, a grid pattern, a directional pattern, a slot, a void, or a continuous pattern. The pattern is a predetermined spatial variation such that current flows in a first area differently than current flows in a second area.Type: GrantFiled: October 29, 2012Date of Patent: October 11, 2016Assignee: Cisco Technology, Inc.Inventors: Goutham Sabavat, Javid Mohamed, Subramanian Ramanathan, Stephen A. Scearce
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Patent number: 9431693Abstract: Disclosed herein is a mobile terminal including a terminal body comprising a circuit board formed to process radio signals, a first and a second member configured to form an external appearance of the terminal and disposed to cover a lateral surface of the circuit board, a power feed connecting portion to allow the first member and the circuit board to be power feed connected, and a ground connecting portion to allow the first member and the circuit board to be ground connected. Accordingly, an electrical element and an antenna are disposed adjacent to each other, allowing the effective use of a space within the terminal.Type: GrantFiled: June 15, 2011Date of Patent: August 30, 2016Assignee: LG ELECTRONICS INC.Inventors: Daeyong Kwak, Sungjung Rho, Kangjae Jung
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Patent number: 9405064Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.Type: GrantFiled: April 4, 2012Date of Patent: August 2, 2016Assignee: Texas Instruments IncorporatedInventors: Juan A. Herbsommer, Robert F. Payne, Marco Corsi, Baher S. Haroun, Hassan Ali
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Patent number: 9386732Abstract: A communication apparatus performs communication through a power line. The communication apparatus includes an electrical power plug which is capable of connecting to the power line and provides the communication apparatus with a power supply. The communication apparatus also includes a power line communication unit which performs communication through the power line, and a heat radiator which radiates heat generated from the power line communicator, wherein the heat radiator is disposed at a location where is not to overlap the power plug.Type: GrantFiled: April 1, 2013Date of Patent: July 5, 2016Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Tomohiro Morita, Yoshimi Tokunaga, Yoshinori Kaneko, Shuichi Kuriyama
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Patent number: 9326407Abstract: An automated dimmer switch is provided. The dimmer has a color sensor display embodied into plastic or metal housing. The dimmer includes a mother board, a central processor for processing incoming data, an operating memory and a flash memory. The dimmer also has various sensors for use with corresponding smart home technologies and a wireless module for connecting to a network standard IEEE 802.11a/b/n utilizing different internet protocols and chips for other wireless technologies such as Bluetooth and Z-Wave. The dimmer can include a motion sensor, such that the display image changes gradually from stand-by mode to display of interface icons for dimmer operation. The stand-by mode image when not in operation is derived from surrounding wall texture.Type: GrantFiled: August 20, 2013Date of Patent: April 26, 2016Inventor: Sergey Musolin
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Patent number: 9320149Abstract: An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die side, the microelectronic die including an active region and an inactive region. The example optionally includes a release layer having a lower release layer surface, an upper release layer surface parallel to the lower release layer surface, and at least one release layer side, the release layer coupled with the upper surface of the microelectronic die in thermal communication with the inactive region of the die and electrically insulated from the active region. The example optionally includes an encapsulation material encapsulating the die side and the release layer side and lower release layer surface, the encapsulation material including a lower surface substantially parallel to the die lower surface and an upper surface substantially parallel to the die upper surface.Type: GrantFiled: December 21, 2012Date of Patent: April 19, 2016Assignee: Intel CorporationInventors: Liwen Jin, Dilan Seneviratne
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Patent number: 9313912Abstract: An electronic device storage case for use in storing a substrate therein, includes a hollow box-shaped case body. The case body includes an open surface with an opening, a bottom surface opposite to the opening and a sidewall extending upright from the peripheral edge of the bottom surface, wherein the sidewall of the case body including a plurality of deformable ribs each having a slant surface inclined inwards toward the bottom surface, and wherein the substrate is introduced into the case body through the opening and slidingly moves along the slant surface of each of the deformable ribs to make pressure contact with the slant surface.Type: GrantFiled: June 22, 2011Date of Patent: April 12, 2016Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yutaka Abe, Keizo Nishikawa, Hirotaka Hamaguchi
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Patent number: 9287223Abstract: A device for insulating an electrically conducting plane having a first electric potential relatively to a second electric potential is provided. The device comprises an insulating substrate including two parallel planar surfaces, a first conducting outer layer and an electrostatic field reducer. The electrostatic field reducer reduces the value of the electrostatic field in a point of the peripheral edge, the reducer includes at least one conducting area distinct from the first outer layer, positioned on the first surface of the insulating substrate and/or in the insulating substrate. The reducer reduces the value of the electrostatic field in this point relative to the value of the electrostatic field in this point in the absence of the conducting area. The conducting area has a potential with a value strictly comprised between the values of the first and second potentials.Type: GrantFiled: May 17, 2012Date of Patent: March 15, 2016Assignee: Alstom Transport SAInventors: Selim Dagdag, Michikazu Nagata, Bertrand Chauchat, Sebastien Nicolau, Toshiyuki Hamachi
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Patent number: 9232659Abstract: A housing for an electronic device includes a ceramic base comprising ceramic material, at least one electronic element embedded in the ceramic base, and a buffer layer made of resin. The ceramic base includes an inner surface. The buffer layer is formed on the inner surface. A method for making the housing is also provided.Type: GrantFiled: December 6, 2013Date of Patent: January 5, 2016Assignee: FIH (Hong Kong) LimitedInventors: Chwan-Hwa Chiang, Chieh-Hsiang Wang
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Patent number: 9202783Abstract: A printed circuit board (PCB) may include antipads, used to provide clearance for backdrilling, which may be sized to allow backdrilling in a way that minimizes the presence of stubs. The PCB may include pads to connect a component to the PCB and vertically disposed vias connected to at least some of the pads. The PCB may further include horizontally disposed signal layers, electrically connected by the vias, to route signals from the component, received from the vias, to an edge of the component, in which signals associated with the component closer to an inner portion of the component are routed to the edge of the component on higher ones of the signal layers than signals associated with the component further from the inner portion of the component.Type: GrantFiled: March 24, 2011Date of Patent: December 1, 2015Assignee: Juniper Networks, Inc.Inventors: Mark R. Simpson, Joyce Kitabayashi
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Patent number: 9182558Abstract: A communication module includes a housing member, an electronic module, and a slidable mechanism. The housing member includes at least one fastening and releasing region, which is disposed on an external surface thereof. The fastening and releasing region has a first slant. The electronic module is partially disposed within the housing member. The slidable mechanism includes at least one extension arm with a second slant. The extension arm is accommodated within the corresponding fastening and releasing region. The second slant is aligned with the first slant, and a slope of the second slant is larger than a slope of the first slant.Type: GrantFiled: May 31, 2013Date of Patent: November 10, 2015Assignee: DELTA ELECTRONICS, INC.Inventors: Hong-Bin You, Gow-Zin Yiu, Chia-Kai Weng
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Patent number: 9182793Abstract: A tablet storage device includes a module on a cart frame that includes a wheeled base. A cart module defines a selectively accessible interior space having multiple storage slots within the interior space for holding tablets. In some cases a tablet storage device holds multiple tablets using two or more modules in a stacked arrangement on a wheeled base. Each module can hold a portion of the multiple tablets within storage slots within an interior space inside the module. The storage slots may have connectors for connecting to tablets, and the cart frame can have a network connection system that is adapted to provide a network connection for each tablet that is connected to one of the connectors. The cart frame may also have a power supply system for charging each tablet that is connected to one of the connectors.Type: GrantFiled: October 12, 2012Date of Patent: November 10, 2015Assignee: Ergotron, Inc.Inventors: Mustafa A. Ergun, Shaun C. Lindblad, Joe Funk, William D. Tischer, Peter Segar, David J. Prince
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Patent number: 9174690Abstract: A wiring structure to supply power to a license light provided in a two-wheeled vehicle includes a wire, a connector, a vehicle-body-side harness, and a plug. The wire is connected to the license light attached to a fender support. The fender support is attached to a back surface of a rear fender which is detachably attached to a vehicle body. The connector is attached to a leading end of the wire and to the fender support. The vehicle-body-side harness is fastened to a vehicle-body frame with a fastener at a position lower than an attachment position of the connector. The vehicle-body-side harness extends upward toward the connector. The plug is provided to the vehicle-body-side harness and is connected to the connector to supply power from the vehicle body to the license light.Type: GrantFiled: March 2, 2011Date of Patent: November 3, 2015Assignee: HONDA MOTOR CO., LTD.Inventors: Koji Suzuki, Kazuhiko Ono, Katsuhisa Yamada
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Patent number: 9179581Abstract: A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing member sealing the plurality of power semiconductor elements, a positive electrode-side terminal and a negative electrode-side terminal each connected with any of the plurality of power semiconductor elements and protruding from the first sealing member, a second sealing member sealing at least a part of the positive electrode-side terminal and at least a part of the negative electrode-side terminal, and a case in which the power semiconductor elements sealed with the first sealing member are housed.Type: GrantFiled: June 20, 2011Date of Patent: November 3, 2015Assignee: Hitachi Automotive Systems, Ltd.Inventors: Tokihito Suwa, Yujiro Kaneko, Yusuke Takagi, Shinichi Fujino, Takahiro Shimura
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Patent number: 9148973Abstract: An electronic device includes a bottom plate, an installation board, a circuit board, a battery, and a power supply control module. The power supply control module includes a control member and an activating member, and the activating member is pressed against the control member when the electronic device is assembled. So long as the control member remains pressed by the activating member, a flow of electrical power from the battery to the circuit board is permitted. When the electronic device is disassembled, the disassembly moves the activating member away from the activating member and cuts off the power from the battery to the circuit board, to avoid electrical short circuits or other damage that might otherwise occur if the flow of electrical power was maintained during disassembly.Type: GrantFiled: June 28, 2013Date of Patent: September 29, 2015Assignee: ShenZhen Goldsun Network Intelligence Technology Co., Ltd.Inventors: Wei-Kuang Liang, Hsien-Pin Tsou, Chuan-Xiang Wang
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Patent number: 9101044Abstract: A circuit module includes a substrate, a mount component, a sealing body, a trench and a shield. The substrate has a mount surface. The mount component is mounted on the mount surface. The sealing body has a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface. The trench has a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench being formed to leave a space between the trench and the outer peripheral surface. The shield covers the main surface and the outer peripheral surface of the sealing body, the shield being filled in the trench.Type: GrantFiled: November 21, 2013Date of Patent: August 4, 2015Assignee: Taiyo Yuden Co., LtdInventors: Masaya Shimamura, Kenzo Kitazaki, Yutaka Nagai, Hiroshi Nakamura, Tetsuo Saji, Eiji Mugiya
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Patent number: 9064200Abstract: An apparatus for ejecting a flat object from a casing of a mobile device is disclosed. The apparatus is arranged to receive an ejection tool along a first axis and to eject the flat object along a second axis, wherein the first and second axes are not parallel. In one embodiment, the first axis is parallel to a top surface of the mobile device and the second axis is perpendicular to a curved edge surface of the mobile device.Type: GrantFiled: June 22, 2011Date of Patent: June 23, 2015Assignee: APPLE INC.Inventors: Piotr S. Trzaskos, Justin Richard Wodrich, Carl Peterson
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Patent number: 9050892Abstract: A dial operation device for a vehicle including a plurality of dial devices each having a dial knob and a dial element outputting a signal corresponding to a turned position of the dial knob, a plurality of circuit boards on which the dial devices are mounted, wiring members electrically interconnecting the circuit boards, and a board supporting body having a panel with a plurality of through-holes for inserting the dial devices therethrough and individually supporting the circuit boards such that the dial knobs protrude toward a front of the panel through the through-holes, wherein the circuit boards are supported in the body such that at least one of the circuit boards is positioned out of a plane of another one of the circuit boards.Type: GrantFiled: January 28, 2010Date of Patent: June 9, 2015Assignee: SUMITOMO WIRING SYSTEMS, LTD.Inventor: Yuuichirou Morishita
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Patent number: 9007783Abstract: A random access memory (RAM) memory module has a compact form factor and is removable from a corresponding socket assembly to allow easy replacement of the memory module or reconfiguration of the memory module during development of an electronic device that includes the memory module.Type: GrantFiled: July 6, 2011Date of Patent: April 14, 2015Assignees: Sony Corporation, Sony Mobile Communications ABInventors: Wladyslaw Bolanowski, Peter Aberg
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Patent number: 8953338Abstract: The invention discloses a curved display module and a display device. The curved display module includes an enclosure, at least one opening, a flexible display panel and an Optical Clear Adhesive (OCA) layer. There is a first curved surface inside the enclosure. A cavity is formed within the enclosure. The at least one opening are disposed on at least one edge of the enclosure and connected to the cavity. The flexible display panel is disposed on the first curved surface in the cavity. The OCA layer is disposed within the cavity. The OCA layer directly covers the flexible display panel.Type: GrantFiled: March 16, 2011Date of Patent: February 10, 2015Assignee: E Ink Holdings Inc.Inventors: Chi-Ming Wu, Wan-Tien Chen, Jen-Shiun Huang, Shin-Yi Hsieh, Chih-Hua Cheng