Patents Examined by Thu-Juong Dinh
  • Method for contacting parts of a component integrated into a semiconductor substrate
    Patent number: 7396749
    Abstract: The invention relates to a method for contacting parts of a component integrated into a semiconductor substrate (1). According to the inventive method, a first contact hole is produced in an insulating layer (2), said contact hole being then filled with contact material (16) and connected to a line. The aim of the invention is to minimise the processes required for contacting parts of a component integrated into a semiconductor substrate. To this end, the hard mask (3) used to produce the contact hole is also used to structure the line.
    Type: Grant
    Filed: June 24, 2003
    Date of Patent: July 8, 2008
    Assignee: Infineon Technologies AG
    Inventors: Ludwig Dittmar, Wolfgang Gustin, Maik Stegemann