Abstract: A testing design for flip chip connection process. In one embodiment the testing design has a substrate, a plurality of connections formed on said substrate, at least one integrated device and a plurality of bumps formed on said integrated device, wherein at least one of said bumps is electrically connected to said plurality of connectors to form an electrical channel.

Abstract: A method of global simplification of a netlist for an integrated circuit includes steps for generating a variable set representative of the inputs and outputs of logic elements in the netlist, re-ordering the inputs and corresponding outputs of the logic elements in the variable set, generating a key set representative of the inputs of the logic elements that are connected to the outputs, assigning names in the variable set that are representative of equivalent outputs having two or fewer essential variables to the same variable name, inserting names in the variable set representative of outputs having more than two essential variables, and assigning a value to each of the outputs having two or fewer essential variables.