Patents Examined by Thuy-Ai N Nguyen
  • Patent number: 10081718
    Abstract: A resin particle composition includes resin particles, polishing agent particles having an average circle-equivalent diameter of 0.1 ?m to 3.0 ?m, and silica particles having a compression aggregation degree of 60% to 95% and a particle compression ratio of 0.20 to 0.40.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: September 25, 2018
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Sakae Takeuchi, Hiroyoshi Okuno, Satoshi Inoue, Yoshifumi Iida, Tomohito Nakajima, Yuka Zenitani, Yoshifumi Eri, Yasuo Kadokura, Takeshi Iwanaga, Shunsuke Nozaki, Yasuhisa Morooka
  • Patent number: 10072110
    Abstract: Provided is a propylene-based elastomer having a narrow molecular weight distribution, a high density in the same comonomer content, and excellent mechanical properties. The propylene-based elastomer includes 50% by weight or more of a propylene-based repeating unit, and satisfies a particular relationship between an ethylene content and a molar ratio of a specific monomer sequence.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: September 11, 2018
    Assignee: LG Chem, Ltd.
    Inventors: Seul Ki Kim, Eun Jung Lee, In Sung Park, Choong Hoon Lee, Byoung Soo Kim
  • Patent number: 10072137
    Abstract: The present invention provides a polyamide resin composition having high melt point which can produce a molded product having high anti-vibration property or, in other words, having very high resonance frequency and, in particular, being capable of retaining high resonance frequency even upon water absorption. A polyamide resin composition, comprising a polyamide resin (A) having melt point (Tm) of 290° C. to 350° C. and having crystallization temperature upon temperature rise (Tc1) of 80 to 150° C., and glass fibers (B) having cross-sectional area of 1.5 to 5.0×10?6 cm2, characterized in that, ratio by weight of the polyamide resin (A) to the glass fibers (B) [(A):(B)] is from 20:80 to 35:65, and that the polyamide resin (A) is a copolymerized polyamide consisting of 55 to 75 molar % of a constituent unit (a) obtained from an equimolar salt of hexamethylenediamine and terephthalic acid, and 45 to 25 molar % of a constituent unit (b) obtained from 11-aminoundecanoic acid or undecane lactam.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: September 11, 2018
    Assignee: TOYOBO CO., LTD.
    Inventors: Tomohide Nakagawa, Tatsuya Oi
  • Patent number: 10072130
    Abstract: A fiber-reinforced composite material which comprises carbon fibers and a resin, wherein the carbon fibers have crimps and have been entangled and the fiber volume content is 30 to 80%. The fiber-reinforced composite material combines quasi-isotropy with a high fiber volume content and has little unevenness in mechanical property.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: September 11, 2018
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Kentaro Kajiwara, Satoru Shimoyama, Tomoyuki Horiguchi
  • Patent number: 10047195
    Abstract: The present invention relates to the use of monomers bearing associative groups in order to manufacture a supramolecular polycondensate, to certain of these monomers, to a process for manufacturing a supramolecular polycondensate, to the polycondensate obtained, and also to an article or a composition incorporating same. The associative groups may be, for example, imidazolidone, urea or triazole groups.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: August 14, 2018
    Assignee: Arkema France
    Inventors: Jean-Philippe Gillet, Jean-Pierre Disson, Bruno Van Hemelryck
  • Patent number: 10040722
    Abstract: A comb polymer and use thereof for improving the processing of hydraulically setting compositions. The comb polymer has ester, amide and/or ether groups on side chains bound to a main chain and the main chain has at least one acrylic acid unit A or a salt thereof and at least one methacrylic acid unit M or a salt thereof. Processes for producing a hydraulically setting composition with longer processing time.
    Type: Grant
    Filed: September 21, 2012
    Date of Patent: August 7, 2018
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Ueli Sulser, Christina Hampel, Jörg Zimmermann
  • Patent number: 10030140
    Abstract: Disclosed herein are methods and fiber reinforced thermoplastic composition comprising: a polyaryletherketone (PAEK) component; a polyimide component, wherein the polyimide component comprises a blend of at least a first polyimide (PI) having glass transition temperature of at least 300° C. and a second polyimide (PI) having glass transition temperature less than the glass transition temperature of the first polyimide; and a reinforcement fiber component. The resulting fiber reinforced thermoplastic compositions exhibit improved mechanical performance.
    Type: Grant
    Filed: September 23, 2013
    Date of Patent: July 24, 2018
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Mohammad Moniruzzaman, Kapil Sheth
  • Patent number: 10030085
    Abstract: A resin composition for a solar cell encapsulant containing an ethylene.?-olefin copolymer and an organic peroxide or a silane coupling agent or the like, and having superior heat resistance, transparency, flexibility and adhesion property to a glass substrate, as well as good balance between rigidity and cross-linking efficiency, the solar cell encapsulant and a solar cell module using the same. It is provided by a resin composition for the solar cell encapsulant characterized by containing the ethylene.?-olefin copolymer (A) having the characteristics of the following (a1) to (a5), and the organic peroxide (B) and/or the silane coupling agent (C). (a1) a density of 0.860 to 0.920 g/cm3 (a2) a ratio, (Mz/Mn), of Z average molecular weight (Mz) and number average molecular weight (Mn) determined by a gel permeation chromatography (GPC), of 8.0 or less (a3) a melt viscosity (?*1) measured at 100° C. under a shear rate of 2.43×10 s?1 of 1.2×105 poise or more (a4) a melt viscosity (?*2) measured at 100° C.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: July 24, 2018
    Assignee: Japan Polyethylene Corporation
    Inventors: Takahiro Amamiya, Tamami Onaka
  • Patent number: 10030217
    Abstract: Solid textile- and/or skin-care compositions encompassing a water-soluble particle and a water-insoluble particle that contains a water-insoluble carrier and a textile- and/or skin-care compound. Also, textile-softening washing detergents or cleaning agents encompassing the textile- and/or skin-care composition.
    Type: Grant
    Filed: May 14, 2009
    Date of Patent: July 24, 2018
    Assignee: Henkel AG & Co. KGaA
    Inventors: Konstanze Mayer, Karl-Heinz Scheffler, Rene-Andres Artiga Gonzalez, Mario Sturm
  • Patent number: 10031394
    Abstract: There is provided an electrophoretic particle which contains a core material particle formed of a composition containing a resin, a nitrogen-containing heterocyclic compound having any one of an imino group, a methylol group and an alkoxymethyl group in the molecule and a heterocyclic ring having a nitrogen atom, and a coloring agent.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: July 24, 2018
    Assignee: E Ink Corporation
    Inventors: Daisuke Nakayama, Yasuo Yamamoto, Naoki Hiji, Mieko Seki, Ryota Mizutani, Chikara Manabe, Cao Jun, Toshihide Aoshima
  • Patent number: 10023691
    Abstract: Polymers comprising polyetheretheretherketone and polyetherdiphenyletherketone and polymers comprising polyetheretheretherketone and polyetheretherethersulphone are described which have advantageous Tn and/or Tg properties.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: July 17, 2018
    Assignee: Victrex Manufacturing Limited
    Inventors: Carlo Capra, Christoper Peter Tyler, Brian Wilson
  • Patent number: 10023737
    Abstract: Provided is a molding material comprising a composite of 1 to 50 wt % of a continuous reinforcing fiber bundle (A) and 0.1 to 20 wt % of a poly (phenylene ether ether ketone) oligomer (B); and 30 to 98.9 wt % of a thermoplastic resin (C) adhering to the composite, wherein the component (B) has a melting point of not higher than 270° C. Also provided are a method for molding the molding material, a method for producing the molding material, and a method for producing a fiber-reinforced composite material. A molded article having high heat resistance and dynamic properties can be easily produced without impairing the economic efficiency and productivity during the process for producing a molding material. In addition, a fiber-reinforced composite material can be produced with more ease and high productivity.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: July 17, 2018
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Naokichi Imai, Atsuki Tsuchiya, Masato Honma, Kohei Yamashita, Shunsuke Horiuchi, Koji Yamauchi
  • Patent number: 10017655
    Abstract: Provided are a silver element containing silver acetonedicarboxylate with high silver content, and capable of providing a silver element with excellent electrical conductivity, flatness, and adhesivity through heating even for a short time at a low temperature of below the decomposition temperature of the silver salt, and having excellent storage stability, as well as a substrate having a silver element formed thereon with the composition. The composition is characterized by a particular ratio of silver compound (A) represented by formula (1) and amine compound (B) represented by formula (2): (R1: H, —(CY2)a-CH3, —((CH2)b-O—CHZ)c-CH3; R2: —(CY2)d-CH3, —((CH2)e-O—CHZ)f-CH3, Y: H, —(CH2)g-CH3; Z: H, —(CH2)h-CH3; a: 0-8; b: 1-4; c: 1-3; d: 1-8; e: 1-4; f: 1-3; g: 1-3; h: 1-2).
    Type: Grant
    Filed: July 17, 2012
    Date of Patent: July 10, 2018
    Assignee: NOF CORPORATION
    Inventors: Koichi Aoki, Eui-Chul Kang, Tatsuya Kozu, Toshinobu Fujimura
  • Patent number: 10017665
    Abstract: The invention concerns a process for preparing an aqueous polyamide-imide dispersion, characterized in that it comprises at least one step of selecting a polyamide-imide powder and a step of producing a dispersion comprising the polyamide-imide powder, a polar aprotic solvent with a boiling point of more than 180° C. at 760 mm Hg, and water. The invention also concerns a process for producing a dry polyamide-imide film on a substrate.
    Type: Grant
    Filed: September 11, 2013
    Date of Patent: July 10, 2018
    Assignees: VALLOUREC OIL AND GAS FRANCE, NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Mohamed Gouider, Eric Gard, Eliette Pinel, Mikael Petit
  • Patent number: 10001690
    Abstract: The invention relates to a colloidal electrolyte composition comprising a polyelectrolyte selected from one or more cationic polymers, a particulate phase forming a colloidal dispersion, and a binder system able to form a cross-linked network upon curing the electrolyte composition. Also, the invention relates to a method of preparation the colloidal electrolyte composition, to an electrochemical cell and to a method of preparation the electrochemical cell.
    Type: Grant
    Filed: April 5, 2012
    Date of Patent: June 19, 2018
    Assignee: ACREO SWEDISH ICT AB
    Inventors: Mats Sandberg, Anurak Sawatdee, Jessica Ahlin
  • Patent number: 9994796
    Abstract: The present invention provides the use of a composition comprising a polyalkyleneimine and/or salts or derivative thereof for the prevention of corrosion of non-metallic in organic items during a washing or rinsing process, in particular during an automatic dishwashing process.
    Type: Grant
    Filed: August 14, 2009
    Date of Patent: June 12, 2018
    Assignee: RECKITT BENCKISER FINISH B.V.
    Inventors: Karlheinz Ulrich Hahn, Karin Werner
  • Patent number: 9985296
    Abstract: Electrocatalytic polyaniline-derived mesoporous carbon nanoparticles and methods of synthesizing and using the same are provided.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: May 29, 2018
    Assignee: Rutgers, The State University of New Jersey
    Inventors: Tewodros Asefa, Rafael Silva
  • Patent number: 9982103
    Abstract: This invention relates to polyimide, which includes amorphous silica particles having OH groups thereon and is thus highly heat-resistant, colorless and transparent, and to a polyimide film manufactured using the polyimide.
    Type: Grant
    Filed: June 27, 2013
    Date of Patent: May 29, 2018
    Assignee: KOLON INDUSTRIES, INC.
    Inventors: Chul Ha Ju, Hyo Jun Park, Hak Gee Jung
  • Patent number: 9976079
    Abstract: Provided is an organic-inorganic composite having two or more kinds of light emission sites. When the organic-inorganic composite is caused to emit light, each of emission colors in each of light emission sites is independently maintained as a emission color that is shown when each of the light emission sites is independently caused to emit light.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: May 22, 2018
    Assignees: SUMITOMO OSAKA CEMENT CO., LTD., KYOTO UNIVERSITY
    Inventors: Takeshi Otsuka, Yoshiki Chujo
  • Patent number: 9963591
    Abstract: The present invention relates to heat-aging resistant polyamide molding materials based on partially crystalline, partially aromatic polyamides as well as to moldings manufactured therefrom.
    Type: Grant
    Filed: August 20, 2013
    Date of Patent: May 8, 2018
    Assignee: EMS-PATENT AG
    Inventors: Andreas Bayer, Nikolai Lamberts, Botho Hoffmann, Manfred Hewel, Oliver Thomas