Patents Examined by Tiberiu D Onuta
  • Patent number: 12727076
    Abstract: The present disclosure provides a circuit board, an electronic apparatus and a manufacturing method for a circuit board. The circuit board includes: a substrate; a plurality of pad zones on the substrate; and a first reflective layer, where the first reflective layer is located at the same side of the substrate as the plurality of pad zones, the first reflective layer includes a plurality of mutually spaced reflective patterns, a gap is provided between the adjacent reflective patterns, and the first reflective layer has a first hollow in a zone where each pad zone of the plurality of pad zones is located.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: September 1, 2026
    Assignees: Hefei BOE Ruisheng Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Xiao Wang, Bing Zhang, Liang Gao, Jianwei Qin