Patents Examined by Tim Arroyo
  • Low-profile removable ball-grid-array integrated circuit package
    Patent number: 5714803
    Abstract: An integrated circuit package has leadless solderballs attached to the substrate with a conductive thermoplastic adhesive. The leadless solderballs are preferably made with a copper-nickel-gold alloy. The conductive thermoplastic is preferably of the silver fill type. The integrated circuit package is placed in a frame and held to the printed circuit board with a clamp or with a screw.
    Type: Grant
    Filed: July 28, 1995
    Date of Patent: February 3, 1998
    Assignee: SGS-Thomson Microelectronics, Inc.
    Inventor: Daniel G. Queyssac
  • TiSi.sub.2 /TiN clad interconnect technology
    Patent number: 5654575
    Abstract: A TiSi.sub.2 /TiN clad LI strap process and structure are disclosed which combine the advantages of both TiSi.sub.2 and TiN LI processes. According to the invention, the retention of a thin TiN layer between the local interconnect and contacts provides a diffusion barrier against counterdoping and relaxes the thermal budget for subsequent processing.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: August 5, 1997
    Assignee: Texas Instruments Incorporated
    Inventor: Shin-Puu Jeng