Patents Examined by Timohty Thompson
  • Patent number: 8193453
    Abstract: According to an aspect of the present invention, there is provided a printed wiring board including: a substrate including a pair of edges and a fixing hole adjacent to the pair of edges and configured to receive a bolt; a land provided in a vicinity of the fixing hole and extending in a direction from the fixing hole toward a center of the substrate and along the pair of edges; and an insulating height adjuster provided between the fixing hole and the pair of edges and configured to have substantially the same height as the land.
    Type: Grant
    Filed: May 21, 2009
    Date of Patent: June 5, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kenji Hasegawa, Tsuyoshi Kozai