Patents Examined by Timothy J Thompson
  • Patent number: 12040106
    Abstract: A wiring member includes: a plurality of wire-like transmission members; a sheet to which the plurality of wire-like transmission members are fixed to be arranged side by side; and a level difference absorption member provided on an outer side of the sheet, wherein the sheet includes a first sheet covering the plurality of wire-like transmission members from one side and a second sheet covering the plurality of wire-like transmission members from another side, the level difference absorption member is provided on an outer side of the second sheet, and the level difference absorption member is provided to be able to absorb a level difference caused by a level difference formed on an outer surface of the second sheet when an outer surface side of the level difference absorption member is vacuum-sucked.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: July 16, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Shintaro Sumida, Motohiro Yokoi, Kenta Ito, Suguru Yasuda, Tetsuya Nishimura, Hitomi Harada, Haruka Nakano, Ryusuke Kudo, Hiroki Hirai, Housei Mizuno, Hidetoshi Ishida
  • Patent number: 12039403
    Abstract: A computer-implemented method of reducing an impact of stray magnetic fields on components of a quantum computing chip is disclosed. The computer implemented method includes applying a first current signal to a first component of a quantum computing chip, whereby the first component generates a stray magnetic field impacting an operation of a second component of the quantum computing chip. The computer implemented method further includes applying a compensation current signal to a shielding circuit of the quantum computing chip, the compensation current signal generated according to a predetermined function of the first signal, to magnetically shield the second component from the stray magnetic field generated by the first component.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: July 16, 2024
    Assignee: International Business Machines Corporation
    Inventors: Peter Mueller, Thomas Morf
  • Patent number: 12034237
    Abstract: A fixing device is used to fix a cable to a substrate. The cable has a first conductor and a second conductor. The substrate has a first substrate fixing portion and a second substrate fixing portion which corresponding to the first conductor and the second conductor, respectively. The fixing device has a first electrode portion, a second electrode portion and a coupling portion which connects the first electrode portion and the second electrode portion to each other. The first electrode portion has a first connection portion to be connected to the first conductor and a first fixing portion to be connected to the first substrate fixing portion. The second electrode portion has a second connection portion to be connected to the second conductor and a second fixing portion to be connected to the second substrate fixing portion.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: July 9, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Osamu Hashiguchi
  • Patent number: 12035465
    Abstract: A three-dimensional (3D) printed circuit board (PCB) composite structure includes a PCB and a 3D printed composite structure. The printed circuit board includes a plurality of grooves milled in a surface of the PCB, and retaining walls of the 3D printed composite structure are deposited within the plurality of grooves in the surface of the PCB, to improve adhesion of the 3D printed composite structure to the PCB.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: July 9, 2024
    Assignee: Continental Automotive Systems, Inc.
    Inventors: Stanton F Rak, David Tseung
  • Patent number: 12034287
    Abstract: The present disclosure is generally directed to visually aesthetic rotational components for electrical systems, such as lighting systems that facilitate the assembly and operation of luminaires with rotating components.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: July 9, 2024
    Assignee: Guangzhou Panyu Target Casting and Lighting Corporation
    Inventors: Zhiping Huang, Robert Lee
  • Patent number: 12033804
    Abstract: A multilayer electronic component includes a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer interposed therebetween, and external electrodes disposed on the body, wherein the external electrode include a first electrode layer disposed on two end surfaces and a second electrode layer including a center portion disposed on the first electrode layer and a band portion extending from the center portion onto a portion of a first surface and a portion of a second surface, the first electrode layer includes a conductive metal, the second electrode layer includes silver (Ag) and glass and further includes one or more of palladium (Pd), platinum (Pt), and gold (Au), and ta<tb in which ta is a maximum thickness of the center portion and tb is a maximum thickness of the band portion.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: July 9, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seo Won Jung, Won Kuen Oh, Gyu Ho Yeon, Seo Ho Lee
  • Patent number: 12030396
    Abstract: A system for providing analytics and operations on data collected from a plurality of smart poles, including a database, a smart pole agent residing on a smart pole, a REST API server, and a web portal. The database is configured to store vast amounts of data from environmental sensors installed on a plurality of smart poles. A REST API server fetches the data from the database. A web portal is provided to allow for viewing of the collected data and perform administrative operations, such as adding a smart pole, maintenance procedures, or other management functions.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: July 9, 2024
    Assignee: PROJECT MANAGEMENT RESOURCE GROUP (PMRG) CORPORATION
    Inventor: James Troy Lapham
  • Patent number: 12029001
    Abstract: An explosion-proof apparatus with an explosion-proof housing and a cooling device. The explosion-proof housing has a plurality of outer walls enclosing a housing interior. A pressure-relief arrangement of the cooling device has at least one pressure relief opening with at least one gas-permeable, flameproof pressure-relief body. The pressure-relief opening passes through at least one of the outer walls. The cooling device also has at least one heat sink which forms at least one heat sink wall part of one the outer walls and which, as a heat sink wall part of this outer wall, directly borders, on its outer face, the surrounding area and directly borders, on its inner face, the housing interior.
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: July 2, 2024
    Assignee: R. Stahl Schaltgeräte GmbH
    Inventors: Elena Kondrus, Jürgen Schmitt, Bernd Limbacher
  • Patent number: 12027836
    Abstract: The present disclosure provides a routing member and a wire harness that are capable of absorbing tolerances. A wire harness 10 has a routing member 40. The routing member 40 has a body portion 41 having a columnar shape, and a groove portion 42 in which a wire 20 is to be accommodated, the groove portion 42 being formed on an outer circumferential side of the body portion 41. The groove portion 42 has a meandering portion 45 extending in an axial direction of the body portion 41 while meandering. The wire harness 10 has the wire 20 accommodated in the groove portion 42 of the routing member 40 and routed along the groove portion 42.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: July 2, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Takamune Kikuta
  • Patent number: 12024771
    Abstract: The present disclosure relates to a method for manufacturing a de-powder device for piping and a method for installing the same, and more particularly, to a method for manufacturing a de-powder device for piping, which is for suppressing attachment and deposition of exhaust matters to an inner circumferential surface of a pipe exposed to the flow of exhaust matters such as unreacted raw material gas, reaction products, and the like exhausted from substrate processing devices for semiconductors and displays, and a method for installing the same.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: July 2, 2024
    Inventor: Gi Nam Kim
  • Patent number: 12028965
    Abstract: A circuit board, including: a substrate; a first line layer, a first protective layer, a first conductive ink layer and a first conductive layer successively formed on the substrate; and a second line layer, a second protective layer, a second conductive ink layer and a second conductive layer successively formed on a second face opposite a first face. The first protective layer includes at least one first opening for exposing a first grounding line of the first line layer; and the orthographic projection of the first conductive ink layer on the substrate covers the orthographic projection of the first opening on the substrate. The second protective layer includes at least one second opening for exposing a second grounding line of the second line layer; and the orthographic projection of the second conductive ink layer on the substrate covers the orthographic projection of the second opening on the substrate.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: July 2, 2024
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventor: Qing Gong
  • Patent number: 12028990
    Abstract: Provided are a multilayer board and a method for manufacturing same, in which a different kind of metal layer is formed between an upper metal layer and an interlayer insulating layer, the different kind of metal layer being formed only in a wiring area without being formed in a via area. The multilayer board comprises: a substrate layer; a plurality of first metal layers sequentially stacked on the substrate layer; an interlayer insulating layer formed between two different first metal layers, having a first via hole, and electrically connecting the two different first metal layers through a third metal layer formed in the first via hole; and a second metal layer formed between the upper layer of the two different first metal layers and the interlayer insulating layer.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: July 2, 2024
    Assignee: STEMCO CO., LTD.
    Inventors: Sung Jin Lee, Young Jun Kim, Su Jeong Shin
  • Patent number: 12028964
    Abstract: A shielded printed wiring board includes a substrate film including a base film and printed circuits including a ground circuit formed on the base film; an electromagnetic wave shielding film including a shielding layer and an insulating layer; and a reinforcing member including a conductive adhesive layer and a metal reinforcing plate, wherein the ground circuit of the substrate film is sufficiently electrically connected to the metal reinforcing plate of the reinforcing member.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: July 2, 2024
    Assignee: Tatsuta Electric Wire & Cable Co., Lid.
    Inventor: Yuusuke Haruna
  • Patent number: 12021018
    Abstract: This disclosure provides a conductive circuit carrier module including a carrier and a conductive circuit film layer. The conductive circuit film layer is disposed on the carrier. The conductive circuit film layer has at least one conductive circuit structure including a vertical wire part and at least four horizontal wire parts. The vertical wire part extends along a thickness direction of the conductive circuit film layer. The at least four horizontal wire parts are connected to one another via the vertical wire part and extend along a direction substantially perpendicular to the vertical wire part. The at least four horizontal wire parts are symmetrically arranged or asymmetrically arranged with respect to the vertical wire part.
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: June 25, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Wei Huang, Shau-Fei Cheng
  • Patent number: 12022623
    Abstract: A display device and a terminal apparatus are provided. The display device includes a display screen and a first drive assembly. The display screen includes a main screen and a secondary screen. The first drive assembly is connected to at least one of the main screen and the secondary screen, and is configured to drive the main screen and/or the secondary screen to move, for changing a size and/or a shape of a display area of the display screen.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: June 25, 2024
    Assignees: Wuhan Tianma Micro-Electronics Co., Ltd., Wuhan Tianma MicroElectronics Co., Ltd. Shanghai Branch
    Inventor: Liu Yang
  • Patent number: 12021360
    Abstract: A junction box includes a housing with a top portion and a bottom portion. The top portion includes an attachment portion and the bottom portion includes a first portion on an exterior side of the housing and a second portion opposite the first portion. The first portion of the bottom portion is configured to be mounted to a roof of a structure. The junction box includes a lid configured to be mounted on the attachment portion of the housing and a retention system configured to retain the lid in proximity to the to the housing.
    Type: Grant
    Filed: November 30, 2023
    Date of Patent: June 25, 2024
    Assignee: Easy Solar Products, Inc.
    Inventors: Benjamin Wade, Lee Hatley
  • Patent number: 12021358
    Abstract: An object is to further improve the reliability of a bent section of a linear transmission member. Provided is a wiring member including: a linear transmission member that includes a bent section; and a resin molded portion molded with a path holding portion of the linear transmission member being inserted thereinto, the path holding portion including the bent section, wherein recesses are formed so as to expose portions of the path holding portion other than a portion where tensile stress is concentrated due to bending, to the outside.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: June 25, 2024
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Hironobu Yamamoto, Kyungwoo Kim, Toshinari Kobayashi, Moriyuki Shimizu, Yukitoshi Terasaka
  • Patent number: 12020830
    Abstract: An insulation-coated compound superconducting wire includes a compound superconducting wire having a compound superconducting part which includes a first matrix and a plurality of compound superconducting filaments containing compound superconducting phases, a reinforcing part disposed on the outer circumferential side of the compound superconducting part and includes a plurality of reinforced filaments, a second matrix and a second stabilizing material. A stabilizing part is disposed on at least one side among the inner circumferential side and the outer circumferential side of the reinforcing part. An electrical insulation part covers the outer circumferential surface of the compound superconducting wire, in which the insulation-coated compound superconducting wire has a critical current value (Ic) larger than that of the compound superconducting wire before being covered with the electrical insulation part.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: June 25, 2024
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masahiro Sugimoto, Hirokazu Tsubouchi, Kota Katayama, Hideki Ii
  • Patent number: 12014845
    Abstract: A composite cable is composed of plural electric power wires, a first twisted wire made by laying plural signal wires together, a second twisted wire disposed opposite the first twisted wire with the electric power wires between the first twisted wire and the second twisted wire, and a sheath formed over plural electric power wires, the first twisted wire, and the second twisted wire. The second twisted wire is made by laying plural electric wires including a grounding wire together. Each of the plural electric wires of the second twisted wire is composed of a conductor and an insulator formed over the conductor.
    Type: Grant
    Filed: September 23, 2022
    Date of Patent: June 18, 2024
    Assignee: PROTERIAL, LTD.
    Inventors: Tomoyuki Murayama, Yoshikazu Hayakawa, Hirotaka Eshima, Takahiro Futatsumori
  • Patent number: 12015225
    Abstract: A connector has a first end provided with a first interface and a second end provided with a second interface. The second interface includes a first switch unit and a second switch unit, where the second switch unit is connected to a control terminal of the first switch unit and a ground pin of the second interface, and a preset reference voltage is input into the ground pin of the second interface. In a case that the second interface is disconnected from a to-be-charged device, the first switch unit is in an off state. In a case that the second interface is connected to the to-be-charged device, the ground pin of the second interface is connected to a ground pin of the to-be-charged device, the ground pin of the second interface is grounded, and the first switch unit is in an on state.
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: June 18, 2024
    Assignee: VIVO MOBILE COMMUNICATION CO., LTD.
    Inventor: Chao Guo