Patents Examined by Timothy J Thompson
  • Patent number: 12387873
    Abstract: An electronic component includes an insulating layer, a low voltage conductor pattern formed inside the insulating layer, a high voltage conductor pattern formed inside the insulating layer such as to face the low voltage conductor pattern in an up/down direction, and a withstand voltage enhancement structure of conductive property formed inside the insulating layer and along the high voltage conductor pattern such as to protrude further outside than the low voltage conductor pattern in plan view.
    Type: Grant
    Filed: January 23, 2024
    Date of Patent: August 12, 2025
    Assignee: ROHM CO., LTD.
    Inventors: Taketoshi Tanaka, Kosei Osada, Masahiko Arimura
  • Patent number: 12381376
    Abstract: The present disclosure has been conceived to solve the above-mentioned problem, and the objective of the present disclosure is to provide a switchboard capable of easily correcting a difference between a phase-to-phase distance of a breaker terminal and a phase-to-phase distance of a bus bar. A switchboard according to one embodiment of the present disclosure comprises: a first compartment into which a circuit breaker is introduced; a second compartment adjacent to the first compartment and provided with a bus bar; and an insulating bushing installed on a barrier contacting the first compartment and the second compartment, wherein the insulating bushing is provided with a connecting conductor, wherein the connecting conductor has one side connected to a breaker terminal of the circuit breaker, and the other side connected to the bus bar.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: August 5, 2025
    Assignee: LS ELECTRIC CO., LTD.
    Inventor: Byoungchul Kim
  • Patent number: 12381378
    Abstract: An example overhead rack support is provided. The overhead rack support includes a first support assembly and a second support assembly, each of which includes a base component, first and second vertical components coupled to the base component, and at least one horizontal component extending through an opening in the first and second vertical components and coupled to the first and second vertical components. The overhead rack support includes a first brace member coupled to the first vertical components, and a second brace member coupled to the second vertical components.
    Type: Grant
    Filed: March 7, 2023
    Date of Patent: August 5, 2025
    Assignee: Legrand DPC, LLC
    Inventors: Michael D. Quaglia, Michael O'Sullivan, Paul Mallia
  • Patent number: 12381383
    Abstract: The present disclosure relates to a different type power cable core connection device for minimizing the volume of a connection device for connection of different type power cables and minimizing cracking of an insulation molding part having a connection conductor embedded therein when current is conducted to conductors of cores of the different type power cables, and a different type power cable connection system including the same.
    Type: Grant
    Filed: December 31, 2021
    Date of Patent: August 5, 2025
    Assignee: LS CABLE & SYSTEM LTD.
    Inventors: Tae Ho Lee, Jin Wook Choe, Woong Yup Lee
  • Patent number: 12382587
    Abstract: Methods for improving joinder between a surface-mount package and a printed circuit board are disclosed. The warpage at a corner of the surface-mount package and at a corresponding corner of a joint area on the printed circuit board are measured to determine the degree of mismatch. A mini-pad is applied to the corner between the surface-mount package and the joint area on the printed circuit board. The thickness of the mini-pad pushes against the surface-mount package and the printed circuit board, reducing the degree of mismatch below a critical dimension of a ball grid array of the surface-mount package. The surface-mount package can then be soldered to the joint area, reducing or preventing the formation of solder bridges and short circuits.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: August 5, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsien-Wen Liu, Shih-Ting Hung, Jyun-Lin Wu, Yao-Chun Chuang, Yinlung Lu
  • Patent number: 12382591
    Abstract: Disclosed is a display device. The display device of the present disclosure may include: a display panel; a plate disposed at a rear of the display panel, and coupled to the display panel; a frame disposed at a rear of the plate; and a mount plate disposed at a rear of the frame, wherein the plate may include a fixing part protruding rearward from a rear surface of the plate, passing through the frame, and coupled to the mount plate.
    Type: Grant
    Filed: January 5, 2023
    Date of Patent: August 5, 2025
    Assignee: LG ELECTRONICS INC.
    Inventors: Junghun Lee, Kwangho Ko, Taegon Kim, Taewook Kim, Yoonsu Kim, Hyeonwoo Lee
  • Patent number: 12379429
    Abstract: A vehicle, comprising: a frame; a passenger compartment including a selected region suitable for presence of people; an electric motor that, when in operation is associated with an undesired magnetic field emitted into the selected region; a magnetic field generator positioned in at least one of a passenger seat, a vehicle door, or the frame, wherein the magnetic field generator is configured to at least reduce the undesired magnetic field in the selected region; a magnetic field sensor configured for sensing the undesired magnetic field emitted into the selected region; and a circuit configured to: receive from the magnetic field sensor sensing data indicative of the undesired magnetic field; determine a cancelation magnetic field for at least reducing the undesired magnetic field; and direct electrical signals to the magnetic field generator for generating the cancelation magnetic field for at least reducing the undesired magnetic field.
    Type: Grant
    Filed: May 2, 2024
    Date of Patent: August 5, 2025
    Assignee: SAFEFIELDS TECHNOLOGIES LTD
    Inventors: Shaul Shulman, Bernard Arambepola, Oded Ei-Nat
  • Patent number: 12381381
    Abstract: A sensor device contains a busbar, a dielectric shell arranged over the busbar, a dielectric layer arranged over the busbar, and a sensor chip arranged within the dielectric shell, wherein the sensor chip is configured to detect a magnetic field induced by an electric current flowing through the busbar.
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: August 5, 2025
    Assignee: Infineon Technologies AG
    Inventors: Rainer Markus Schaller, Volker Strutz, Ronak Kalhor-Witzel, Hansjoerg Walter Kuemmel
  • Patent number: 12382582
    Abstract: A printed circuit board according to an embodiment includes: a first insulating portion having a cavity; a second insulating portion disposed on the first insulating portion; a third insulating portion disposed under the first insulating portion; and an electronic device disposed in the cavity, wherein a number of layers of the second insulating portion is different from a number of layers of the third insulating portion, and has an asymmetric structure with respect to the first insulating portion in which the electronic device is disposed.
    Type: Grant
    Filed: April 8, 2024
    Date of Patent: August 5, 2025
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Won Suk Jung
  • Patent number: 12381018
    Abstract: A wire protector of the present disclosure partially covers a plurality of wires including a cut target wire to be cut in order to interrupt a power source in an emergency and includes a notch that allows the cut target wire to be cut by a tool. The wire protector enables the power source to be quickly interrupted in the emergency while suppressing a cost increase.
    Type: Grant
    Filed: July 18, 2023
    Date of Patent: August 5, 2025
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Riyoji Hironaka
  • Patent number: 12374523
    Abstract: The present disclosure provides an integrated feedthrough for high voltage cables, which belongs to the field of compact neutron generators and comprises a glue filling device composed of an upper clamping cover plate, a lower clamping cover plate, a high voltage joint, a compression collar and a compression nut, and a feedthrough composed of a feeder pillar, a high voltage joint, a high pressure sealing plug, an insulating glue, a high voltage cable, a compression collar, a compression nut, a flange, a seal ring, threaded rods, a pressing plate and nuts. According to the present disclosure, the high voltage joint and the high voltage cable are sealed with an insulating glue through a glue filling device, so as to realize insulation treatment of the high voltage cable fed into vacuum.
    Type: Grant
    Filed: January 14, 2025
    Date of Patent: July 29, 2025
    Assignee: Hefei Comprehensive National Science Center Energy Research Institute(Anhui Energy Laboratory)
    Inventors: Yuzhong Qian, Zhenqing Zhu, Mengmeng Li, Lizhen Liang, Liangliang Wu, Xin Tao, Chundong Hu
  • Patent number: 12371575
    Abstract: Aspects of the present disclosure include compositions and methods of making and use thereof. In at least one aspect, a composition, includes a polyaniline and a polysiloxane having a density of about 1.05 g/cm3 or greater. The composition optionally includes a solvent. In at least one aspect, a method includes introducing a polyaniline with a polysiloxane having a density of about 1.05 g/cm3 or greater to form a composition. In at least one aspect, a method includes disposing a composition onto a substrate. The composition includes a polyaniline and a polysiloxane having a density of about 1.05 g/cm3 or greater.
    Type: Grant
    Filed: June 7, 2024
    Date of Patent: July 29, 2025
    Assignee: The Boeing Company
    Inventor: Patrick J. Kinlen
  • Patent number: 12376224
    Abstract: A package device is provided and includes a first circuit layer, a first isolation layer, and a first de-warpage layer. The first circuit layer and the first isolation layer are stacked on each other. At least a portion of the first de-warpage layer is disposed between the first circuit layer and the first isolation layer.
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: July 29, 2025
    Assignee: InnoLux Corporation
    Inventors: Yi-Hung Lin, Chun-Hung Lai, Yeong-E Chen, Chuan-Ming Yeh, Ching-Wei Chen
  • Patent number: 12369248
    Abstract: A circuit board according to an embodiment includes an insulating layer; and a via portion disposed in a via hole formed in the insulating layer; wherein the via portion includes: a first pad disposed on a lower surface of the insulating layer; a second pad disposed on an upper surface of the insulating layer; a third pad disposed in the via hole and disposed on the first pad; and a connection portion disposed in the via hole and disposed between the second pad and the third pad.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: July 22, 2025
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Min Young Hwang, Hyun Gu Im, Byeong Kyun Choi
  • Patent number: 12368287
    Abstract: The disclosure relates to an adaptation module configured for connecting three conductors of two modules and/or bays of a three-phase encapsulated gas-insulated switchgear, including two opposite arranged insulators each including three radially spaced conductor connection inlets and configured for electrically connecting the conductor connection inlets to one of the two modules and/or bays, and three concentrically arranged axially extending conductors each connected to two opposite conductor connection inlets, spaced from each other and rotatable in respect to the axis.
    Type: Grant
    Filed: January 31, 2023
    Date of Patent: July 22, 2025
    Assignee: HITACHI ENERGY LTD
    Inventor: Hauke Peters
  • Patent number: 12369250
    Abstract: A circuit board structure includes a carrier, a thin film redistribution layer disposed on the carrier, solder balls electrically connected to the thin film redistribution layer and the carrier, and a surface treatment layer. The thin film redistribution layer includes a plurality of pads, a first dielectric layer, a first metal layer, a second dielectric layer, a second metal layer, and a third dielectric layer. A plurality of first openings of the first dielectric layer expose part of the pads, and a first surface of the first dielectric layer is higher upper surfaces of the pads. The solder balls are disposed in a plurality of third openings of the third dielectric layer and are electrically connected to the second metal layer and the carrier. The surface treatment layer is disposed on the upper surfaces, and a top surface of the surface treatment layer is higher than the first surface.
    Type: Grant
    Filed: November 15, 2022
    Date of Patent: July 22, 2025
    Assignee: Unimicron Technology Corp.
    Inventors: Ping-Tsung Lin, Kai-Ming Yang, Chia-Yu Peng, Pu-Ju Lin, Cheng-Ta Ko
  • Patent number: 12368987
    Abstract: A resin housing having an electronic component and a method for manufacturing the same are disclosed. The resin housing includes an electronic component mounting film that includes a housing made of resin, a base film disposed along an inner surface of the housing, a circuit pattern layer formed on at least a surface opposite to a side of the housing of the base film, and an electronic component connected to the circuit pattern layer and mounted on a surface opposite to the side of the housing of the base film. The electronic component mounting film is integrated with the housing. An impact absorbing layer covers the electronic component of the electronic component mounting film and a periphery of the electronic component. The circuit pattern layer of the electronic component mounting film is not bent around a portion on which the electronic component is mounted.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: July 22, 2025
    Assignee: Nissha Co., Ltd.
    Inventors: Chuzo Taniguchi, Jun Sasaki, Eiji Kawashima, Yasuisa Takinishi
  • Patent number: 12368340
    Abstract: The invention relates to an electrical conductor for conducting electric current through a housing part, wherein the electrical conductor is enclosed on a first sealing section by a sealing body made of an elastic material, wherein the electrical conductor and the sealing body have an integrally-bonded connection. The electrical conductor has, at least in the first sealing section, an outer contour which is rounded in cross-section. The invention further relates to a method for producing an electrical conductor with a sealing body, which is connected by integral bonding and is made of an elastic material.
    Type: Grant
    Filed: July 19, 2022
    Date of Patent: July 22, 2025
    Assignee: BRUSS SEALING SYSTEMS GMBH
    Inventors: Manfred Brand, Jürgen Grundt, Ralf Pielke, Timo Besoke, Samuel Neumann, Thomas Schrader, Patrick Danberg
  • Patent number: 12362437
    Abstract: Provided are multilayered flexible interconnect circuits comprising multiple conductive layers. Also provided are methods of fabricating such circuits and also methods of fabricating battery assemblies with such circuits. A multilayered flexible interconnect circuit comprises at least two conductive layers and at least one inner insulator, which extends between these conductive layers in some circuit portions and allows for conductive layers to directly interface in other circuit portions (e.g., busbar portions). Outer insulators can be provided to insulate these conductive layers from the environment while allowing some access to these layers as needed. Each conductive layer and insulator can be individually patterned to achieve these functions. One or more insulators support conductive layers relative to each other as well as different portions (e.g., disjoined portions) of the same conductive layer.
    Type: Grant
    Filed: October 23, 2024
    Date of Patent: July 15, 2025
    Assignee: CelLink Corporation
    Inventors: Gabrielle Tate, Jean-Paul Ortiz, Will Findlay
  • Patent number: 12355109
    Abstract: A battery system for an electric vehicle includes a fixed cover, and a removable cover arranged over battery modules and a high voltage distribution system. The battery system includes a busbar arranged at least partially over a region of the battery modules and under the removable cover. The busbar includes a fixed section and a movable section, or a hinge, such that the busbar can be repositioned out of the way. The support tray includes a link between the fixed and movable sections. Floating fasteners, allowing at least one of radial float and axial float are used to secure the link to the support tray, thereby avoiding safety hazards and reducing the potential for short circuits in high voltage distribution systems or conductors thereof. The floating fasteners include a head, a neck, an engagement section, and a washer, which prevent removal from a component once installed.
    Type: Grant
    Filed: February 23, 2024
    Date of Patent: July 8, 2025
    Assignee: Rivian IP Holdings, LLC
    Inventors: Ehsan Baseri, Kyle Butterfield, Luke Rayment Morrow, Akshay Kishor Murkute, Jonathan Verghese