Patents Examined by Timothy J Thompson
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Patent number: 12295100Abstract: A printed circuit board includes a first core portion in which a first passive component is embedded, a second core portion in which a second passive component is embedded, and a first bonding layer disposed between the first and second core portions and including first conductive particles connected to the first and second passive components.Type: GrantFiled: March 7, 2023Date of Patent: May 6, 2025Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Yoon Lee, Seung Eun Lee
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Patent number: 12295108Abstract: A component carrier includes a stack with at least one electrically conductive layer structure, at least one electrically insulating layer structure, and a hole in the stack having a first hole portion covered with metal and having a second hole portion not covered with metal, wherein the second hole portion is defined by an anti-plating dielectric structure and an electroless plateable separation barrier.Type: GrantFiled: October 14, 2022Date of Patent: May 6, 2025Assignee: AT&SAustria Technologie & Systemtechnik AktiengesellschaftInventor: Jiangfeng Zhou
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Patent number: 12294261Abstract: A strip conductor device includes first and second elongated strip conductor elements, each configured to be coupled at a coupling-in end to a contact device for coupling-in electric current and at a coupling-out end to a contact device for coupling-out electric current. The first elongated strip conductor element is a first strip conductor that has a substrate layer that carries a conductor layer that has barrier elements along a length of the conductor layer. The second elongated strip conductor element is a second strip conductor that has a substrate layer that carries a conductor layer that has barrier elements along a length of the conductor layer. The first strip conductor element forms a layer arrangement with the second strip conductor element and the coupling-in ends and the coupling-out ends of the first and second strip conductor elements lie one above the other.Type: GrantFiled: October 19, 2021Date of Patent: May 6, 2025Assignee: KARLSRUHER INSTITUT FUER TECHNOLOGIEInventor: Tabea Arndt
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Patent number: 12289849Abstract: A method for making a composite piece comprised of a metal part and a glass-fiber-reinforced plastic part, comprising: providing a metal part with a receiving cavity and a flow guiding channel, the flow guiding channel having an inlet communicating with the receiving cavity and an outlet; introducing molten plastic reinforced with glass fibers into the receiving cavity to fill the receiving cavity and the flow guiding channel and overflows from the outlet to form a flash section; curing the molten plastic to obtain a plastic part; removing unwanted portion of the metal part together with a portion of the plastic part to obtain the composite piece, wherein the glass-fiber-reinforced plastic part includes an exposed surface and glass fibers exposed at the exposed surface are substantially parallel to each other. A metal-plastic composite part prepared by the method and an electronic device housing are also disclosed.Type: GrantFiled: September 9, 2022Date of Patent: April 29, 2025Assignee: Fulian Yuzhan Precision Technology Co., Ltd.Inventors: Ke-Na Chen, Pei-Bang Yang
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Patent number: 12289827Abstract: A printed board includes a first and second insulator extending in a first direction; a third insulator extending in a second direction and including a first and second portion located above and below the first insulator respectively in a third direction; a fourth insulator extending in the second direction, and including a third and fourth portion located below and above the first insulator respectively in the third direction; and a first and second conductor extending in the first direction, and arranged along the second direction with a first pitch therebetween. The first pitch is an n multiple of a first distance that is based on an interval between the first and second portion or the third and fourth portion. The n is an integer equal to or greater than 1.Type: GrantFiled: March 15, 2022Date of Patent: April 29, 2025Assignee: Kioxia CorporationInventor: Yuta Tsubouchi
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Patent number: 12288972Abstract: A protector includes: a protector body having a routing part in which a wire harness is routed, and a clamp attachment part in which a locking hole is formed; and a clamp which is locked in the locking hole to hold the wire harness. The clamp includes a pair of clamp-side flat parts which are formed to face in directions opposite to each other. The clamp attachment part has a pair of rotation prevention portions which are provided with the locking hole therebetween and which include body-side flat parts facing the clamp-side flat parts.Type: GrantFiled: May 11, 2023Date of Patent: April 29, 2025Assignee: YAZAKI CORPORATIONInventors: Youngho Jang, Jin Watanabe
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Patent number: 12289830Abstract: A wiring circuit board includes a metal supporting layer, an insulating base layer, and a wiring layer. The wiring circuit board further includes a plurality of streak groove portions disposed on one surface of the metal supporting layer in the thickness direction and a plurality of concave portions depressed in the metal supporting layer in the thickness direction. The plurality of concave portions forms a dot pattern. Each of the dots in the dot pattern has one concave surface. The concave surface has an approximately spherical cap shape or an approximately cone shape.Type: GrantFiled: February 1, 2023Date of Patent: April 29, 2025Assignee: NITTO DENKO CORPORATIONInventors: Hayato Takakura, Naoki Shibata, Kenya Takimoto, Chihiro Watanabe
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Patent number: 12288653Abstract: A cable enclosure includes a housing defining an opening through which an interior of the housing is accessible. An end plate is releasably secured to the housing to cover the opening such that the interior of the housing is not accessible. The end plate includes a first conductive leg in electrical communication with a first cable within the housing. The end plate also includes a second conductive leg in electrical communication with a second cable within the housing. The end plate further includes a conductive member movable between a first position and a second position. When in the first position, the conductive member is in contact with the first conductive leg and the second conductive leg. When in the second position, the conductive member is not in contact with at least one of the first conductive leg or the second conductive leg.Type: GrantFiled: March 15, 2019Date of Patent: April 29, 2025Assignee: PREFORMED LINE PRODUCTS CO.Inventors: Jacob Palmer, Benjamin Franklin Ciesielczyk, Cameron Clines, Adam Michael Deel, Dan Levac
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Patent number: 12283391Abstract: Ground conductors are disclosed. The ground conductors can include a core made primarily of a first material, such as steel. The ground conductor can include a surrounding sheath, which includes at least one layer made primarily of a second material, such as copper. The ground conductor has a ratio between its width and its thickness of no less than 11.1:1.Type: GrantFiled: October 25, 2024Date of Patent: April 22, 2025Assignee: Exeter Chancery LLCInventor: Jeffrey T. Jordan
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Patent number: 12280724Abstract: To provide an inexpensive routing structure, which is improved in sealing performance with no harm in noise insulation performance, of a wire harness of a sensor for a door of an automobile. The routing structure includes a wire harness of a sensor. The sensor couples to a flange of a rear door of the automobile with a bracket, and detects an electric signal which provides an indication that an object is between the rear door and a front door. The wire harness passes through a through hole, provided on an inner panel of the rear door, and is routed into a space between the inner panel and an outer panel. The through hole is a service hole, provided on a door side surface of the inner panel.Type: GrantFiled: April 28, 2023Date of Patent: April 22, 2025Assignees: NISHIKAWA RUBBER CO., LTD., HONDA MOTOR CO., LTD.Inventors: Hiroshi Shimada, Toshifumi Matsuura, Makoto Seki, Takashi Fukahori, Hiroshi Shingu
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Patent number: 12284751Abstract: An inhomogeneous dielectric medium high-speed signal trace system includes a first and second ground layer. A first dielectric layer is located adjacent the first ground layer. A second dielectric layer has a different dielectric constant and a greater thickness than the first dielectric layer, and is located between the first dielectric layer and the second ground layer. A first differential trace pair is located between the first dielectric layer and the second dielectric layer, and includes a trace spacing that is less than or equal to a thickness of the first dielectric layer. The first different trace pair transmit signals and, in response, produces a magnetic field, and the trace spacing prevents a magnetic field strength of the magnetic field from exceeding a magnetic field strength threshold at a second differential trace pair that is located adjacent the first differential trace pair.Type: GrantFiled: August 11, 2023Date of Patent: April 22, 2025Assignee: Dell Products L.P.Inventors: Arun Reddy Chada, Bhyrav Mutnury
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Patent number: 12283400Abstract: An article of manufacture comprising a first section having a first dielectric material and a second section having a second dielectric material and provided on an outer surface of the first section. The second dielectric material of the second section is more flexible than the first dielectric material of the first section, and the second section comprises elements of an organic material located partially on an outer surface of the second section. A coaxial cable using the article of manufacture and a method of manufacturing of the article are also disclosed.Type: GrantFiled: July 18, 2019Date of Patent: April 22, 2025Assignee: RFS Technologies, Inc.Inventors: Asaad Elsaadani, Drausio Castro, Joel Cacopardo, Thomas Kuklo, Mihirraj Joshi
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Patent number: 12283405Abstract: Disclosed is a luminescent wire. The luminescent wire includes a silicone sleeve, a luminescent light bar and a flat cable, the silicone sleeve is internally provided with wire holes, the wire holes penetrate through the silicone sleeve along a longitudinal direction, each of the wire holes is used for one group of the flat cables to pass through, an end portion of the flat cable is connected to a plug or a socket, the flat cables inside each of the silicone sleeves may be used alone, or the plurality of the silicone sleeves may be selected to be used side by side, as to form different specifications of the luminescent wires. An accommodating hole is arranged above the wire holes, used to accommodate the luminescent light bar, the silicone sleeve is provided with a light transmitting area. The luminescent wire may also be conveniently viewed and used in darker environments.Type: GrantFiled: May 19, 2023Date of Patent: April 22, 2025Inventor: Pan Zhang
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Patent number: 12278470Abstract: A line feedthrough for guiding at least one line through a component, contains a cladding tube, a fastening element, and at least one sealing element which is in the form of a flexible hose body and arranged within the cladding tube. The hose body is connected, in a first axial end region, to the fastening element. It is possible to displace said hose body between a closed position, in which the hose body at least partially closes a passage through the hose body, and an open position, in which a passage through the hose body is at least partially unblocked. A spring device is provided that acts on the fastening element, which can be displaced in the longitudinal direction (L) relative to the cladding tube, with a force that presses the hose body toward a closed position.Type: GrantFiled: September 30, 2020Date of Patent: April 15, 2025Assignee: Hilti AktiengesellschaftInventors: Huu Toan Nguyen, Christoph Hakenholt
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Patent number: 12278027Abstract: A wiring member includes: a base member having a holding surface; and at least one wire-like transmission member held on the holding surface, wherein at least one missing wire-like transmission member identification mark indicating at least one missing wire-like transmission member position is provided on the holding surface.Type: GrantFiled: March 2, 2021Date of Patent: April 15, 2025Assignee: SUMITOMO WIRING SYSTEMS, LTD.Inventors: Yoshiaki Tanaka, Masaki Mizushita, Tetsuya Nishimura
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Patent number: 12278023Abstract: The present disclosure provides an insulated wire and a preparation method therefor, a winding wire and an electrical device, relating to the technical field of electrochemical elements. The insulated wire includes a conductive wire and an insulating layer coated on the conductive wire, where the insulating layer includes polyetheretherketone and thermoplastic polyimide, and a mass percentage of the polyetheretherketone in the insulating layer is not more than 20%; and the conductive wire is in direct contact with the insulating layer; and after extrusion and cooling for 24 h, under a condition that the insulated wire is ring cut and stretched by 15%, a length of the insulating layer losing adhesion is not greater than 1.9 mm.Type: GrantFiled: January 6, 2025Date of Patent: April 15, 2025Assignee: WELL ASCENT ELECTRONIC (GANZHOU) CO., LTD.Inventors: Huimin Ye, Yuejia Zhu, Zuomao Zhu, Longping Chen
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Patent number: 12272937Abstract: The present disclosure relates to a cable module with a detachable fracture feature, a gas-insulated device including the cable module, and a method for manufacturing the cable module. The cable module for a high voltage gas-insulated device with a detachable electric connection includes: an enclosure provided with a first opening and a second opening; an insulator provided with a conductive insert and fixed to a first flange of the enclosure around the first opening; a cable terminal connector passing through a wall of the enclosure and including a first end positioned inside the enclosure and a second end positioned outside the enclosure and configured to be connected to an external cable; a plurality of conductors connecting the conductive insert and the first end of the of the cable terminal connector.Type: GrantFiled: November 30, 2022Date of Patent: April 8, 2025Assignee: HITACHI ENERGY LTDInventors: GuoZhu Meng, Gang Bai, ZhiGuo Zhang
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Patent number: 12272483Abstract: An electronic module comprising electrical components on a circuit board and a molding body disposed on the circuit board to encapsulate the electrical components, wherein a recess is formed in the molding body for exposing an electrode of the electronic module for connecting with an external component.Type: GrantFiled: April 28, 2022Date of Patent: April 8, 2025Assignee: CYNTEC CO., LTD.Inventor: Yi-Cheng Lin
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Patent number: 12263796Abstract: A door wiring module includes: a service hole cover including a cover body part and a route indication part provided to the cover body part; and a wiring member whose route is regulated so that the wiring member passes through a first position and a second position on the cover body part. The route indication part indicates a plurality of routes each having a route length different from each other as routes of the wiring member between the first position and the second position, and a route of the wiring member is regulated so that the wiring member passes through any route selected from the plurality of routes.Type: GrantFiled: October 6, 2021Date of Patent: April 1, 2025Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Housei Mizuno, Hiroki Hirai, Takuji Otsuka, Makoto Higashikozono, Koji Yamaguchi
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Patent number: 12266665Abstract: The present technology relates to a circuit board, a semiconductor apparatus, and electronic equipment that are configured to make it possible to more effectively suppress the occurrence of noise in signals. A circuit board includes first conductors arranged regularly in a first direction, second conductors arranged regularly in the first direction, and third conductors arranged regularly in the first direction. A first power supply connected to the first conductors, a second power supply connected to the second conductors, and a third power supply connected to the third conductors are different power supplies. The present technology can be applied to a circuit board of a semiconductor apparatus and the like, for example.Type: GrantFiled: October 11, 2019Date of Patent: April 1, 2025Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Takashi Miyamoto, Masahiro Takahashi, Yoshiyuki Akiyama