Patents Examined by Timothy J Thompson
  • Patent number: 10980123
    Abstract: An electric element includes a conducting path connecting electrodes and an insulating layer covering the conducting path. The electric element includes bonding portions in which the electrodes are disposed and a line portion connecting between the bonding portions. The line portion has a curved region sandwiched by portions having an outer shape curved on both sides of the insulating layer disposed to sandwich the conducting path. The line portion includes bonding patterns including metal surfaces exposed from the insulating layer. Each of contours of the bonding patterns includes at least two linear sides. At least two sides of the contour of a first bonding pattern disposed in the curved region are parallel or substantially parallel to at least two sides of a contour of at least one of the bonding patterns adjacent in an extending direction of the line portion.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: April 13, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Lijun Zhao
  • Patent number: 10978222
    Abstract: An insulated electric wire having a water-stopped portion that is simple in configuration and can be formed by simple processes, including a conductor containing a plurality of twisted elemental wires made of conductive material, and an insulation covering covering an outer surface of the conductor. The wire contains an exposed portion wherein the covering is removed from the outer surface of the conductor, and a covered portion wherein the covering covers the outer surface of the conductor, with the exposed and covered portions arranged adjacently along a longitudinal axis of the insulated electric wire, where a density of the conductive material per unit length is higher in the exposed portion than in a remote area of the covered portion that is an area excluding an area adjacent to the exposed portion, and a sealant made of an insulated material fills gaps between the elemental wires of the exposed portion.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: April 13, 2021
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Toyoki Furukawa
  • Patent number: 10978224
    Abstract: Provided is a twisted wire including a plurality of covered wires twisted together, each covered wire including a conductor and an insulator covering the periphery of the conductor, wherein the twisted wire satisfies Inequality (1): y<A×x/(z/500)+B (wherein x: a pitch length (mm) of the twisted wire, y: a collapsing rate (%) of the insulator, z: an elastic modulus (MPa) of the insulator, A: Constant A=?1, and B: Constant B=11.5).
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: April 13, 2021
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Keiko Yamazaki, Tadaharu Isaka, Masahiro Kondo
  • Patent number: 10974668
    Abstract: A wire harness includes a first circuit group and a second circuit group. The first circuit group has one end connected to a first connector and another end connected to a second connector. The second circuit group has one end connected to the first connector and another end connected to a third connector. The second circuit group branches from the first circuit group at a position of the second connector or at a position of a connection target connected by the second connector.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: April 13, 2021
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takahiro Murata, Hirokazu Komori, Taiko Sato, Hiroyuki Ishikawa
  • Patent number: 10978219
    Abstract: Provided is an assembled wire 10 having a substantially rectangular cross section, and is formed by assembling a plurality of strands 7. Each strand 7 has a conductor portion 11 and a strand insulating layer 13 covering the conductor portion 11. The strand insulating layer 13 preferably contains at least one kind of resin in which 50% weight loss in Tg-DTA occurs at from 300° C. to 500° C. The strand insulating layer 13 contains particles. The particles are particles having volume resistivity of 1×106 ?·cm or more, and, for example, inorganic substances such as silica, titania, alumina, aluminum nitride, magnesium oxide, silicon nitride, and silicon carbide; and resins such as silicone are applicable.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: April 13, 2021
    Assignee: ESSEX FURUKAWA MAGNET WIRE JAPAN CO., LTD.
    Inventors: Keiichi Tomizawa, Akira Tachibana, Keisuke Ikeda, Daisuke Muto, Hideo Fukuda
  • Patent number: 10971286
    Abstract: Provided is a thermal-insulated multi-walled pipe for superconducting power transmission that highly prevents intrusion of external heat due to radiation and has excellent thermal insulation property without using a superinsulation and can be produced easily. A thermal-insulated multi-walled pipe for superconducting power transmission comprises: a superconducting cable; and a multi-walled pipe that houses the superconducting cable, wherein the multi-walled pipe is composed of a plurality of straight pipes, and at least one of the plurality of straight pipes has, at a surface thereof, a coating layer containing a metal powder.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: April 6, 2021
    Assignee: JFE STEEL CORPORATION
    Inventors: Yasuhide Ishiguro, Akio Sato, Shigeto Sakashita
  • Patent number: 10971912
    Abstract: A high voltage distribution system is provided with multiple fuses. The high voltage distribution system includes multiple laminated busbars that are electrically coupled to a battery and to the multiple fuses. Busbars are electrically coupled to the one or more fuses via electrical connections between the busbars and the fuses. The electrical connections can pass through other busbars without having an electrical coupling to the other busbars. An insulating layer may be used between the busbars to prevent overcurrent events. The configuration, size, and position of each busbar is selected based on the electrical requirements of components that are electrically coupled to the busbar and based on the prevention of overcurrent events.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: April 6, 2021
    Assignee: Rivian IP Holdings, LLC
    Inventors: Ehsan Baseri, Kyle Butterfield, Kyle O'Neil, Tyler Collins, Nathaniel C. Wynn
  • Patent number: 10965113
    Abstract: A wire harness, in which a connection portion between a shape retaining conductor and a flexible conductor can be protected, includes a flexible conductor that is flexibly bendable, a shape retaining conductor that retains its shape, and a protective member that surrounds a connection portion between the flexible conductor and the shape retaining conductor and linearly holds the connection portion, and one end portion of the protective member is fixed to an end portion of the shape retaining conductor.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: March 30, 2021
    Assignee: Sumitomo Wiring Systems, LTD.
    Inventor: Hirokazu Nakai
  • Patent number: 10960831
    Abstract: A wire harness fixing structure includes; a silencer disposed between a floor mat and a body in a vehicle; a wire harness disposed along a main surface of the silencer; and fixing member fixing the wire harness to the silencer while being passed through a through hole formed to pass through the silencer in a thickness direction. An inner peripheral surface of the through hole in the silencer is closely attached to the fixing member.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: March 30, 2021
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tetsuya Nishimura, Housei Mizuno, Satoshi Ujita, Motohiro Yokoi, Shigeki Ikeda, Daisuke Ebata, Haruka Nakano
  • Patent number: 10964478
    Abstract: A multilayer ceramic capacitor satisfies a relationship A>B, where B represents a coverage rate of a first organic layer disposed on a first base electrode layer located on a first end surface, A represents a coverage rate of the first organic layer disposed on the first base electrode layer located on a first main surface or a second main surface, and A represents a coverage rate of the first organic layer located on the first main surface or the second main surface. A second end surface also has a similar configuration.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: March 30, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiroshi Asano, Nobuyasu Hamamori, Masaru Takahashi
  • Patent number: 10964447
    Abstract: A differential transmission line cable includes a notch filter to manage common-mode energy. The cable includes a narrow portion with two adjacent electrical conductors each having a narrow cross-sectional area and spaced at a narrow spacing. The cable also includes a wide portion longitudinally adjacent to the narrow portion. The wide portion includes the two adjacent electrical conductors each having a wide cross-sectional area greater than the narrow cross-sectional area and spaced at a wide spacing greater than the narrow spacing. The wide and narrow cross-sectional areas and spacings are specified so that the differential-mode impedance of the differential transmission line cable is uniform throughout both the narrow and wide portions and so that differences in the common-mode impedances of the narrow and wide portions create a notch filter to manage common-mode energy in the differential transmission line cable.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: March 30, 2021
    Assignee: International Business Machines Corporation
    Inventors: Matthew Doyle, Samuel R. Connor, Stuart Brett Benefield
  • Patent number: 10964450
    Abstract: A power cable includes an electric conductor; an electrical insulation layer surrounding the electrical conductor; a cooling system including a cooling duct substantially parallel to the electrical conductor along a power cable longitudinal axis and configured to flow a cooling fluid; a carbon allotrope layer in direct contact with the electrical conductor, where the carbon allotrope layer is provided between the electric conductor and the cooling duct; and a cable jacket enclosing the electric conductor, the electrical insulation layer, and the cooling system.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: March 30, 2021
    Assignee: PRYSMIAN S.P.A.
    Inventors: Luca Giorgio Maria De Rai, Michelangelo Graziano
  • Patent number: 10964448
    Abstract: A ribbon cable with desirable properties including mechanical integrity, resistance to propagation of a flame, and a compact structure is provided. The ribbon cable may be formed by wrapping a flexible layer around a plurality of parallel cable cores. The flexible layer may be adhered to itself and may conform to the outer surfaces of the cores. The flexible layer may, at its edges, overlap such that the edges may be readily adhered to each other. Some or all of the cable cores may be individually shielded. The cable may also include metal foil adjacent one or two sides of the cable cores or, in some instances, encircling the cable cores.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: March 30, 2021
    Assignee: Amphenol Corporation
    Inventors: Matthew S. Wright, Carl S. Booth, Russell Isch
  • Patent number: 10965109
    Abstract: A watertight electrical compartment for use in an irrigation device can include a compartment body having a chamber and a sealing section configured to mate with one or more sealing rings. A sealing cap can mate with the sealing section and/or the sealing rings to seal the chamber. A cap retainer can be advanced over at least a portion of the sealing cap. One of the compartment body and cap retainer can have internal threads to be screwed onto external threads of the other one of the compartment body and cap retainer. The cap retainer can also have a stopping feature to keep the sealing cap in its sealed position. The watertight electrical compartment can be used in a wireless flow sensor assembly, a battery operated irrigation controller, and/or a battery-operated central controller device, to provide irrigation control, and/or sensor information, without the need for AC power.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: March 30, 2021
    Assignee: Hunter Industries, Inc.
    Inventor: Michael F. Paul
  • Patent number: 10957469
    Abstract: High voltage three-phase cable comprising three cores positioned so as to assume the configuration with minimum radial dimension and a sheath surrounding the three cores, wherein each core comprises an electric conductor having a substantially triangular shaped cross section with vertex portions and edges; an insulating system surrounding the electric conductor, the insulating system comprising an inner semiconducting layer surrounding the electric conductor, an insulating layer surrounding and in contact with the inner semiconducting layer and an outer semiconducting layer surrounding and in contact with the insulating layer, the layers of the insulating system being made of an extruded polymeric material having a dielectric constant ? comprised from 2 to 2.5; and a metallic screen surrounding the insulating system.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: March 23, 2021
    Assignee: PRYSMIAN S.p.A.
    Inventors: Bartolomeo D'Agostino, Massimo Bechis
  • Patent number: 10957658
    Abstract: A package structure includes a redistribution structure, a chip, one or more structural reinforcing elements, and a protective layer. The redistribution structure includes a first circuit layer and a second circuit layer disposed over the first circuit layer. The first circuit layer is electrically connected to the second circuit layer. The chip is disposed over the redistribution structure and electrically connected to the second circuit layer. The one or more structural reinforcing elements are disposed over the redistribution structure. The structural reinforcing element has a Young's modulus in a range of 30 to 200 GPa. The protective layer overlays the chip and a sidewall of the structural reinforcing element.
    Type: Grant
    Filed: May 4, 2020
    Date of Patent: March 23, 2021
    Assignee: UNIMICRON TECHNOLOGY CORP.
    Inventors: Pu-Ju Lin, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng, Ra-Min Tain
  • Patent number: 10957466
    Abstract: A shielded flat cable includes one or more ground wires arranged, the ground wires being parallel to each other, one or more signal wires arranged parallel to the one or more ground wires, an insulating layer covering the one or more ground wires and the one or more signal wires, and a shield layer provided on an outer surface of the insulating layer, wherein a thickness of the insulating layer at a central position of each ground wire in an arrangement direction is smaller than a thickness of the insulating layer at a central position of each signal wire in the arrangement direction, in a cross-section orthogonal to a longitudinal direction of the one or more ground wires, the arrangement direction being a direction in which the one or more ground wires and the one or more signal wires are arranged parallel to each other.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: March 23, 2021
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD
    Inventor: Chiaki Kojima
  • Patent number: 10958051
    Abstract: A connector for coupling a conduit to an electrical enclosure includes a body and a lock nut. The body extends longitudinally between a proximal enclosure end and a distal conduit end. The body has an enclosure port at the enclosure end, a conduit port at the conduit end, and an internal passage extending between the enclosure port and the conduit port. The enclosure end has radially opposed first and second retention tabs. The body has external body threads located distally of the retention tabs. Each of the retention tabs extend radially outward of a longitudinal projection of the external threads. The lock nut is mated with the external body threads. The lock nut has an enclosure engagement end opposed to distal facing enclosure engagement sides of the retention tabs. The lock nut is rotatable on the external body threads to advance the enclosure engagement end toward the retention tabs.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: March 23, 2021
    Inventor: Anthony James Howard
  • Patent number: 10958055
    Abstract: A circuit assembly includes a busbar substrate with busbars and a resin part that is in intimate contact with the busbars, a press-fit member that is made of metal with a thickness greater than the thickness of the busbars, and is press-fitted in the busbar substrate, an electronic component connected to the press-fit member, solder that connects the busbars and the press-fit member, and a solder accumulating portion that is formed with the resin part, and in which the solder is accumulated.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: March 23, 2021
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Koki Uchida, Yukinori Kita
  • Patent number: 10950535
    Abstract: A package structure includes a redistribution structure, a chip, an inner conductive reinforcing element, and a protective layer. The redistribution structure includes a first circuit layer and a second circuit layer disposed over the first circuit layer. The first circuit layer is electrically connected to the second circuit layer. The chip is disposed over the redistribution structure and electrically connected to the second circuit layer. The inner conductive reinforcing element is disposed over the redistribution structure. The inner conductive reinforcing element has a Young's modulus in a range of from 30 to 200 GPa. The protective layer covers the chip and a sidewall of an opening of the inner conductive reinforcing element.
    Type: Grant
    Filed: February 9, 2020
    Date of Patent: March 16, 2021
    Assignee: Unimicron Technology Corp.
    Inventors: Chun-Min Wang, Pu-Ju Lin, Cheng-Ta Ko