Abstract: An electronic device includes an insulating base having elasticity, a plurality of lines provided on the insulating base, and a plurality of electric elements connected to the lines. The insulating base includes island-shaped portions in which the electric elements are located, and band-like portions in which the lines are provided and which connect the adjacent island-shaped portions. The band-like portions include a curved portion which meanders, and a straight line portion which connects the curved portion and the island-shaped portion. The curved portion includes a first curved portion, a second curved portion and a third curved portion. A width of the second curved portion is less than a width of the third curved portion.

Abstract: The description relates to electronic prototyping platforms. One example can include an electrically insulative substrate having generally opposing first and second major surfaces and that includes an orientation feature that is visible on both of the first and second major surfaces. The example can include a first mounting hole through the substrate that is bordered by a first electrical conductor associated with data transmission. The example can also include a second mounting hole through the substrate that is bordered by a second electrical conductor associated with electrical ground, and a third mounting hole through the substrate that is bordered by a third electrical conductor associated with electrical power. The example can also include an edge connector tab defined by the substrate and having three exposed electrically conductive contacts that are coupled to the data electrical conductor, the ground electrical conductor, and the power electrical conductor and insulated from one another.

Abstract: A support insulator includes a conductive member, an insulating member, and an attachment portion. Busbars included in a main circuit are attachable to the conductive member. The conductive member electrically connects the busbars to each other. The insulating member is attachable to a fixed frame, and is disposed over an outer surface of the conductive member to insulate the conductive member and the busbars from the fixed frame. An electronic component included in the main circuit is attachable to the attachment portion.

Abstract: An interconnect substrate includes an insulating resin layer having a first surface and a second surface opposite the first surface, a redistribution layer provided on the first surface of the insulating resin layer, a first connection terminal exposed at the second surface of the insulating resin layer, and a conductive via provided in the insulating resin layer to electrically connect the redistribution layer and the first connection terminal, wherein the insulating resin layer includes a first resin layer constituting the second surface and containing a first filler, a second resin layer provided on the first resin layer, and a third resin layer provided on the second resin layer, the third resin layer containing a second filler and constituting the first surface, and wherein an average particle diameter of the first filler is greater than an average particle diameter of the second filler.

Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.

Abstract: A conduit outlet assembly for a rigid metal conduit raceway of an electrical system is provided. A conduit outlet assembly includes a gasket, a gripping ring, and a condulet assembly. The gasket is sized to circumscribe an outer surface of a rigid metal conduit of the rigid metal conduit raceway. The gripping ring is sized to circumscribe the outer surface of the rigid metal conduit. The condulet assembly is sized to receive the rigid metal conduit, and includes an adapter and a condulet. The adapter includes a compression section and a coupling section, wherein the compression section is sized to receive the rigid metal conduit with the gasket and the gripping ring disposed thereon. The condulet is sized to receive the coupling section of the adapter.

Abstract: The invention relates to a device for the feed-through and strain relief of strands through a wall opening having a frame arranged around and/or at least partially in the wall opening, having at least one strain relief grommet which encloses the strand and is accommodated at least positively in the frame, wherein the frame comprises at least two detachably connected frame parts, between which the strain relief grommet is directly or indirectly pressed in the connected state of the frame parts. The invention is characterized in that the strain relief grommet has at least two sections which, in the compressed state with the strand inserted, are spaced apart from one another or, at most, are connected via at least one elastic region, so that the force flow between the at least one first section and the at least one other section extends via the strand.

Abstract: A circuit board structure includes a carrier, a thin film redistribution layer disposed on the carrier, solder balls electrically connected to the thin film redistribution layer and the carrier, and a surface treatment layer. The thin film redistribution layer includes a first dielectric layer, pads, a first metal layer, a second dielectric layer, a second metal layer, and a third dielectric layer. A top surface of the first dielectric layer is higher than an upper surface of each pad. The first metal layer is disposed on a first surface of the first dielectric layer. The second dielectric layer has second openings exposing part of the first metal layer. The second metal layer extends into the second openings and is electrically connected to the first metal layer. The third dielectric layer has third openings exposing part of the second metal layer. The surface treatment layer is disposed on the upper surfaces.

Abstract: A wiring board includes a wiring layer, an insulating layer, a plurality of opening portions, and a connection terminal. The insulating layer is laminated on the wiring layer and covers a wiring pattern. Each of the plurality of opening portions penetrates through the insulating layer to the wiring pattern. The connection terminal is formed on the respective opening portions and comes into contact with the upper surface of the wiring pattern. The wiring layer includes a first wiring pattern, and a second wiring pattern that is formed of a plurality of laminated metal layers and that is thicker than the first wiring pattern. An upper surface of a metal layer serving as an uppermost layer of the second wiring pattern is a contact surface with the connection terminal and has a same width as an upper surface of a metal layer serving as a layer other than the uppermost layer.

Abstract: According to certain embodiments of the disclosure, an electronic device may include a first housing; a second housing slidably combined with the first housing; a display fixed at least in part to the second housing and having an visible display area increasing or decreasing in response to a sliding of the second housing, wherein the visible display area is a portion viewed from an outside of the electronic device; and a support structure having a bendable structure, supporting at least a portion of the display, and moving in response to the sliding of the second housing, the support structure comprising one or more support members, and guide rail, wherein each one of the one or more the support members include: a base member extending in a first direction perpendicular to a sliding direction of the second housing and arranged along the sliding direction, and connected to the guide rail, wherein the guide rail guides the movement of the base member; a moving member formed in a shape corresponding at least in

Abstract: A wiring member including: three or more electrical wire portions extending in different directions from a branching position; and a retaining member that is an elastic member and covers base end portions of the three or more electrical wire portions. The retaining member includes three or more cylindrical portions that are joined to each other at respective base end portions thereof, one or two adjacent cylindrical portions of the three or more cylindrical portions being a base cylindrical portion provided with a slit extending over the entire length thereof on one side, and the remaining cylindrical portion being a divided cylindrical portion provided with slits extending over the entire length thereof on two sides, and the retaining member is closed via a fixing member.

Abstract: A mud ring assembly includes a base member, a raised member, a telescoping member and a plurality of drive members. The base member has a flange and an opening through the flange. The raised member extends from the base member and follows the opening in the flange to form a raised wall. The raised member has a plurality of mounting tabs extending from the raised wall toward the opening in the raised member. The telescoping member is positioned within the raised member opening and is movable relative to the raised member between a retracted position and an extended position. The telescoping member has a wall, an opening and a plurality of mounting tabs extending from the wall toward the opening in the telescoping member. The wall of the telescoping member includes a plurality of protective members. Each protective member is positioned in proximity to one of a plurality of mounting tab pairs.

Abstract: An insulated conductor including: at least one electrical conductor; and, an insulating coating covering said electrical conductor, having n layer(s), “n” being an integer greater than or equal to 1, the nth layer being the outermost layer having a pseudo-amorphous composition Cn including at least 50% by weight of a polyaryletherketone. A process for manufacturing the insulated conductor, a heat-welding process using two sections of insulated conductor, and a coil capable of being obtained by heat-welding a winding of the insulated conductor.

Abstract: A wiring substrate includes an insulating layer, a conductor layer formed on a surface of the insulating layer and including a conductor pad, a covering layer formed on the insulating layer and covering a portion of the insulating layer, an optical waveguide positioned on the surface of the insulating layer and including a core part, and a conductor post including plating metal and formed on the conductor pad such that the conductor post is penetrating through the covering layer and connected to a component. The insulating layer has a component region covered by the component when the component is connected to the conductor post, the core part has an end surface facing the opposite direction with respect to the insulating layer and exposed in the component region and a distance between the end surface and the surface of the insulating layer is greater than a thickness of the covering layer.

Abstract: An HV busbar configured to connect a plurality of battery modules to each other, has a conductor including a first metal plate and a second metal plate and an insulative resin coating layer on the outer circumferential surface of the conductor, wherein a first metal constituting the first metal plate and second metals having a lower melting temperature than the first metal are mixed in the second metal plate in the state in which the second metals are dispersed.

Abstract: An LED circuit board structure includes first color LEDs, second color LEDs, third color LEDs, a carrier board, first testing wires, first connecting wires, second testing wires and second connecting wires. Each of the first testing wire is located at the carrier board and electrically connects two first color LEDs in a pixel-front-side-pattern region in parallel. The first connecting wire electrically connects two first testing wires in adjacent two pixel-front-side-pattern regions. Each of the second testing wire is located at the carrier board and electrically connects two second color LEDs in a pixel-front-side-pattern region in parallel. The second connecting wire electrically connects two second testing wires in adjacent two pixel-front-side-pattern regions.

Abstract: One object is to be able to easily attach an elastic waterproofing member to a wiring member. A wiring module (10) includes a wiring member (20), and an elastic waterproofing member (30, 130, 230, 330) in which a penetration accommodating portion (32) is formed that is capable of accommodating a portion in a longitudinal direction of the wiring member. The elastic waterproofing member includes a first split waterproofing member (36, 136) and a second split waterproofing member (38, 138), the first split waterproofing member and the second split waterproofing member are obtained by splitting the elastic waterproofing member so as to longitudinally split the penetration accommodating portion, and the first split waterproofing member and the second split waterproofing member are kept in a joined state, with a portion in a longitudinal direction of the wiring member accommodated in the penetration accommodating portion.

Abstract: An apparatus is described. The apparatus includes a printed circuit board (PCB) dual in-line memory module (DIMM) connector having ejectors. The ejectors have a small enough vertical profile to permit unbent liquid cooling conduits to run across the DIMM's semiconductor chips.

Abstract: A multilayer ceramic capacitor includes a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode.

Abstract: Enclosure assemblies employed in electrical installations, including those employed in solar power installations, which conform to NEMA 3R type rating defined by National Electrical Manufacturers Association (“NEMA”) are disclosed. In some embodiments, a base of a housing of an enclosure assembly having a seal-receiving groove, fastener retainers, fastener walls, a moisture diverter, attachment points; and conductor pass-through apertures is disclosed. In some embodiments, a base of a housing of an enclosure assembly having a forward portion with a forward fastener retainer and forward attachment points; an aft portion of the base having an aft fastener retainer and aft and attachment points, the groove located between the forward and aft portions, a moisture diverter located between the forward and aft portions; and drainage channels encompassing the forward and aft portions is disclosed. In some embodiments, a method for pre-positioning a fastener in a housing of an enclosure assembly is disclosed.