Abstract: A door wiring module includes: a service hole cover including a cover body part and a route indication part provided to the cover body part; and a wiring member whose route is regulated so that the wiring member passes through a first position and a second position on the cover body part. The route indication part indicates a plurality of routes each having a route length different from each other as routes of the wiring member between the first position and the second position, and a route of the wiring member is regulated so that the wiring member passes through any route selected from the plurality of routes.

Abstract: An electronic device includes a housing, a first substrate disposed in an internal space of the housing, a conductive structure disposed at a location isolated from the first substrate, a second substrate electrically connected to the conductive structure and the first substrate, and an electrical connection member electrically connecting the second substrate to the conductive structure. The electrical connection member may include a first fixing portion fixed to the conductive structure, a second fixing portion fixed to the second substrate, and a connection portion connecting the first fixing portion and the second fixing portion. The first fixing portion includes a first bent portion bent along a first bent line from a neck portion, that is, a boundary area with the connection portion, and a second bent portion bent along a second bent line from the first bent portion.

Abstract: The present technology relates to a circuit board, a semiconductor apparatus, and electronic equipment that are configured to make it possible to more effectively suppress the occurrence of noise in signals. A circuit board includes first conductors arranged regularly in a first direction, second conductors arranged regularly in the first direction, and third conductors arranged regularly in the first direction. A first power supply connected to the first conductors, a second power supply connected to the second conductors, and a third power supply connected to the third conductors are different power supplies. The present technology can be applied to a circuit board of a semiconductor apparatus and the like, for example.

Abstract: The present disclosure relates to an electrical wire having a leakage current limiting function, in which, since a neutral line is provided to have a greater cross-sectional area than that of a phase voltage line, a leakage current leaking from the phase voltage line may be limited, and thus the risk of electric shock to the human body due to the leakage current may be minimized.

Abstract: The invention relates to a power supply (110, 110? . . . ) for transporting electrical energy from an energy source (144) to a device (148) or from the device (148) to the energy source (144), the energy source (144) being arranged in a warm region (142) and the device (148) being arranged in a cold region (146). The power supply (110, 110?) has a stack (118) comprising at least two films (120, 120? . . . ), each film (120, 120? . . . ) comprising an electrically conductive material which is designed to transport the electrical energy, ach film (120, 120? . . . ) having an electrical connection which is designed to receive the electrical energy or to deliver the electrical energy, and each film (120, 120? . . . ) comprising a plurality of flow channels (128) for conveying a fluid stream, and the fluid stream comprising a refrigerant mixture or a gas stream to be cooled or a gas stream to be liquefied. The films (120, 120?, . . .

Abstract: Disclosed is a display apparatus including a display panel and a cushion plate disposed under the display panel. The cushion plate may include a porous member and a reinforcing plate. A step in a side area of the display apparatus may be removed, thereby improving impact absorption ability and rigidity.

Abstract: According to an embodiment of the present disclosure, there are provided a clamp and a wire harness which are capable of enhancing versatility. This clamp (30) is applied to two electric wires (20), which respectively have core wires (21) all having flat cross-sectional shapes and are parallel to each other, is configured to be fixable to a panel P, and holds the two electric wires (20). The clamp (30) comprises: a fixed member (40) fixed to the panel P; and two holding members (50) which are detachably attached to the fixed member (40) and respectively hold the two electric wires (20).

Abstract: A stretchable display panel and an electronic device are provided. The electronic device has a stretchable display panel. The stretchable display panel has a flexible display panel main body, a linkage holding mechanism, and a frame. The frame has a main frame and a sub frame. The linkage holding mechanism is used to limit a sliding distance and sliding speed of the sub frame to avoid separation of the sub frame and the main frame when an applied external force is too large or sudden change, thereby reducing a risk of damage to the frame and the flexible display panel main body.

Abstract: The disclosure provides a compressing structure for compressing a component, a power module and a method for compressing a component inside a chamber, the compressing structure is provided for compressing a component onto a fixed plate and comprises a plate-shaped structure, the component is secured to a first side of the plate-shaped structure, the outside of the plate-shaped structure is provided with a base; at least a steering compressing member is provided between a second side of the plate-shaped structure and the base, and mounted on the second side of the plate-shaped structure or the base, the steering compressing member is provided for transforming an rotational motion into a translational motion; and at least a positioning device mounted on the side of the plate-shaped structure and the base. The compressing structure provided by the disclosure compresses the component onto the fixed plate.

Abstract: A printed circuit board includes a first insulating layer, a first pattern buried in a surface of the first insulating layer, the first pattern having a surface exposed from the surface of the first insulating layer, and a metal post disposed on the exposed surface of the first pattern. The metal post includes a first metal layer and a second metal layer. The first metal layer and the second metal layer include different metals.

Abstract: A circuit structure includes a first busbar, a second busbar, an insulating member including an insulating portion located between the first busbar and the second busbar, a first wiring board provided on one main surface of the first busbar, one main surface of the second busbar and the insulating portion, and a first electronic component provided on the first wiring board. The first electronic component has a first connection terminal electrically connected to the first busbar and bonded to the first wiring board, and a second connection terminal electrically connected to the second busbar and bonded to the first wiring board.

Abstract: A radiator module includes a heat pipe and a terminal. The heat pipe includes a first plate and a second plate between which a refrigerant channel is defined, and a support member extending from the first plate to the second plate. The terminal is joined to a connection body of the first plate and the support member from outside of the heat pipe. The support member is located within a range that overlaps a joint portion of the terminal and the connection body when viewed in a thickness direction of the first plate.

Abstract: The present disclosure is directed to a hybrid dielectric interconnect stack for a printed circuit board having a first dielectric layer with a first dielectric constant and a first dielectric loss tangent positioned over an intermediate layer, which includes a first dielectric sublayer with a first sublayer dielectric constant and a first sublayer dielectric loss tangent, an embedded conductive layer, and a second dielectric sublayer with a second sublayer dielectric constant and a second sublayer dielectric loss tangent, in which the embedded conductive layer is positioned between the first and second dielectric sublayers, and a second dielectric layer with a second dielectric constant and a second dielectric loss tangent, in which the intermediate layer is positioned between the first and second dielectric layers.

Abstract: A circuit board according to an embodiment comprises: an insulation layer; a circuit pattern disposed on the upper surface or under the lower surface of the insulation layer; and a buffer layer disposed on at least one surface of the upper surface and the lower surface of the insulation layer, wherein the buffer layer includes carbon, nitrogen, and oxygen, the ratio of the nitrogen to the carbon ((carbon/nitrogen)*100) is 5 to 15, and the ratio of the oxygen to the carbon ((carbon/oxygen)*100) is 15 to 30.

Abstract: Provided is a circuit board structure including a substrate, a loop-wrapping ground layer, an insulating structure, a first build-up layer, a top wiring layer, a bottom wiring layer, a first conductive via, and a plurality of second conductive vias. The aforementioned structure defines a signal transmitting structure. An equivalent circuit of the signal transmitting structure at least includes a first equivalent circuit, a second equivalent circuit, a third equivalent circuit and a fourth equivalent circuit, which correspond to different uniform transmitting sections respectively. The first equivalent circuit, the second equivalent circuit, the third equivalent circuit and the fourth equivalent circuit are connected in series with each other according to an ABCD transmission matrix series connection principle.

Abstract: A printed circuit board includes a first insulating layer, a metal pad including a first metal portion disposed on the first insulating layer, and a second metal portion disposed on the first metal portion and integrated with the first metal portion without a boundary therebetween, the second metal portion having a width narrower than a width of the first metal portion on a cross section, a second insulating layer disposed on the first insulating layer and covering at least a portion of a side surface of the first metal portion, and a surface metal layer disposed on the metal pad and covering at least a portion of each of an upper surface and a side surface of the second metal portion.

Abstract: Provided is a method for manufacturing a printed circuit board with electronic component, including: mounting an electronic component on an insulating substrate; applying an insulating first coating resin to at least a part of the electronic component; curing the first coating resin; applying an insulating second coating resin to the cured first coating resin; and curing the second coating resin.

Abstract: An elastic wiring includes: an elastic tube; a conductor wire arranged within the tube; and fixing portions that fix the conductor wire and the tube at both ends of the tube in the lengthwise direction, wherein the length of the conductor wire between the fixing portions when the tube is in an unextended state is longer than the length of the tube between the fixing portions.

Abstract: An electronic device includes a housing, a first substrate, a second substrate, and an interposer disposed between the first substrate and the second substrate and configured to electrically connect the first substrate and the second substrate. The interposer includes a substrate, a first surface, a second surface, and a side surface. The interposer further includes a plurality of first conductive pads, a plurality of second conductive pads, a plurality of conductive posts, a plurality of third conductive terminals at least partially exposed on the first surface and electrically connected to the plurality of first conductive pads via a first conductive via (CV), and a plurality of fourth conductive terminals at least partially exposed on the second surface and electrically connected to the plurality of second conductive pads via a second CV.

Abstract: An interconnect structure includes a dielectric block, a first conductive plug, a second conductive plug, a substrate, a first conductive line, and a second conductive line. The first conductive plug and the second conductive plug are surrounded by the dielectric block. The substrate surrounds the dielectric block. The first conductive line is connected to the first conductive plug and is in contact with a top surface of the dielectric block. The second conductive line is connected to the second conductive plug.