Abstract: An in-vehicle wiring module is configured to be attached to a plurality of electricity storage elements having electrode terminals. The in-vehicle wiring module includes busbars to be connected to the electrode terminals, flexible substrates having a first conductive path that is electrically connected to the busbars, and a rigid substrate having a second conductive path that is electrically connected to the first conductive paths. The flexible substrates overlap the rigid substrate. The flexible substrates each have a first opposing surface that is opposed to the rigid substrate. The first conductive paths each have first lands that are arranged on the first opposing surface. First slits that are open at edges of the flexible substrates are formed between the first lands of the flexible substrates. The rigid substrate has a second opposing surface that is opposed to the flexible substrates.

Abstract: The present disclosure provides a printed circuit board and a method thereof. The printed circuit board has a first substrate, at least one first trace layer and at least one second trace layer. The first substrate has a first surface and a second surface. The first surface and the second surface are corresponding to each other along an axis. The first trace layer is formed on the first surface and/or the second surface of the first substrate. The first trace layer has at least one first trace and at least one first gap beside the first trace by etching. The second trace layer is formed on the first trace layer. The second trace layer has at least one second trace and at least one second gap beside the second trace by etching.

Abstract: An electronic device includes: a multilayered base substrate including a plurality of substrate bases stacked on each other; a first conductive via and a second conductive via penetrating the substrate bases and spaced from each other; a conductive line electrically connecting the first conductive via and the second conductive via to each other and disposed on at least one of the substrate bases of the plurality of substrate bases; and an open stub including a first end and a second end, wherein the first end is connected to a connector of the conductive line, and the second end is opened.

Abstract: A printed wiring board includes: a board having a through-hole; a land portion that is disposed on an inner circumferential surface of the through-hole and on a surface of the board at a circumferential edge of the through-hole, and that has a through-hole conductor portion; and a wire that is disposed on the surface of the board and that has one longitudinal end portion electrically connected to the land portion, a maximum length of a connection portion between the wire and the land portion being greater than or equal to a sum of a maximum diameter of the through-hole and a minimum line width of the wire.

Abstract: A microspring includes a film stack having a base disposed on a build plane and a spring member extending from the base. The film stack includes a compressive layer, a substantially stress-free layer, and a tensile layer. The film stack is formed of one or more materials that become superconducting below 140 K. A stress gradient in the film stack causes the spring member to curl away from the build plane of the base.

Abstract: Provided is an in-vehicle wiring module that is attached to a plurality of power storage elements that include electrode terminals, and includes a busbar that is connected to the electrode terminals, and a flexible substrate that is electrically connected to the busbar, the flexible substrate has a folded-over structures where the flexible substrate is folded along folding portions, the folded-over structure includes protrusions that protrude from outer edges of the flexible substrate in an expanded state before the flexible substrate is folded along the folding portions, and slits into which the protrusions are to be inserted, the folding portions are disposed between the protrusions and the slits of the flexible substrate in the expanded state, and, as a result of the protrusions being inserted into the slits, the flexible substrate is kept from deforming so as to return to the expanded state from a state of being folded along the folding portions.

Abstract: The present disclosure describes a grommet. The grommet includes a slot extending the length of a main body which provides an entry point for a cable to be inserted into an interior cavity, a plurality of flex retention members extending into the interior cavity configured to grip and secure the cable, and one or more grip enhancement features residing between an inner surface of the main body and the flex retention members. The grip enhancement features are configured to provide additional support to the flex retention members when a cable is inserted into the interior cavity. The grip enhancement features are coupled to or integral with a respective flex retention member and extend radially outwardly therefrom, and each grip enhancement feature is configured to engage or contact the inner surface of the main body when a larger diameter cable is received within the interior cavity of the grommet.

Abstract: An electronic device may include: a first housing; a second housing disposed movably with respect to the first housing; a display disposed on the second housing and expanded or contracted as the second housing moves; a motor; a pinion gear disposed in the first housing and rotatable by receiving driving force from the motor; a rack gear disposed in the second housing, engaged with the at least one pinion gear and movable by the rotation of the at least one pinion gear; a switching structure disposed between the motor and the pinion gear, and changeable to a gear-connected state, or a gear-released state, an actuator disposed in the first housing, configured to change a state of the switching structure; and at least one processor operably coupled to the motor and the actuator, and the processor may be configured to change the switching structure to the gear-connected state or the gear-released state through the actuator based on identifying the designated event.

Abstract: A component carrier includes (a) a base structure having a surface with a surface profile; (b) a first dielectric layer formed on the surface of the base structure and (c) a second dielectric layer formed on the first dielectric layer. The first dielectric layer has a first main surface with a first surface profile. The first main surface faces away from the surface of the base structure. The first surface profile corresponds to the surface profile of the base structure. The second dielectric layer includes a second main surface with a second surface profile. The second main surface faces away from the surface of the base structure. The second surface profile differs from the surface profile of the base structure. A manufacturing method uses an auxiliary sheet for pressing the first dielectric layer on the main surface. The auxiliary sheet is removed before pressing the second dielectric layer.

Abstract: A data transmission cable (100) includes: a signal bundle (110), where the signal bundle (110) includes at least three signal cables, the at least three signal cables are disposed at intervals, pairwise signal cables form a differential pair signal cable, and the differential pair signal cable is used to transmit a differential data signal; a ground cable (120), where the ground cable (120) encircles and covers the signal bundle (110), and the ground cable (120) is used to transmit a ground signal and isolate the signal bundle (110) from a signal bundle (110) of another data transmission cable (100); and a filling medium (130), where the filling medium (130) is disposed in space on an inner side of the ground cable (120) except the signal cable, so that a problem that a MIPI bus has poor transmission quality and a short transmission distance can be resolved.

Abstract: A support for electrical boxes can include a body plate, first and second mounting arms, and first and second side flanges. The body plate can include mounting features configured to secure an electrical box to the body plate. The first and second mounting arms can extend from the body plate and receive a threaded rod to support the body plate in a horizontal orientation. The first and second side flange extend from opposing sides of the body and include an aperture to receive a threaded rod that can support the body plate in a vertical orientation.

Abstract: A contact system includes a support body, a heat sink configured to contact the support body in an electrically insulated and/or heat-conducting manner, and an electrically insulating layer arranged between the heat sink and the support body. The heat sink has a first surface which is embodied substantially as a flat area and formed with a recess in a region intended for contacting a periphery of a contact area of the support body. The recess forms an unbroken track on the first surface of the heat sink. The contact area of the support body is located on the heat sink in such a way that the recess extends completely along the periphery of the contact area. The insulating layer between the heat sink and the support body is configured to cover the recess in such a way that a closed channel is formed by the recess and the insulating layer.

Abstract: Provided are stretchable electronics and a method for manufacturing the same. The stretchable electronics may include a substrate, a plurality of electronic elements disposed to be spaced apart from each other on the substrate, and a wire structure disposed on the substrate to connect the plurality of electronic elements to each other. The wire structure may include an insulator extending from one of the electronic elements to the other of the adjacent electronic elements and a metal wire configured to cover a top surface and side surfaces of the insulator. The insulator may include at least one bent part in a plan view.

Abstract: A wiring member includes a base member, a wire-like transmission member fixed to the base member, and a plurality of attaching members provided to the base member to be attached to an attaching target member. One attaching member is provided to only one lateral side of the wire-like transmission member in a first position along an extension direction of the wire-like transmission member in the base member. Another attaching member is provided to only another lateral side of the wire-like transmission member in a second position along the extension direction of the wire-like transmission member.

Abstract: A converter includes a diode module including a diode bridge disposed inside a module case; and a body case including an opening in a placement face. The module case includes a counter face facing the placement face and a noncounter face, with a breakage prevention structure being disposed on at least one of the counter face or the noncounter face. When the counter face is where the breakage prevention structure is disposed, the breakage prevention structure entirely covers the counter face. When the noncounter face is where the breakage prevention structure is disposed, the noncounter face where the breakage prevention structure is disposed is a noncounter placement face with a largest area among exterior wall faces of the module case, and the noncounter placement face including an area farther from the placement face than a middle of the noncounter placement face is as a nonplacement area.

Abstract: A power conversion device having a temperature determination function is provided. The power conversion device is disposed on a light fixture and includes a housing, a power converter, and at least one temperature determination component. The power converter and the temperature determination component are disposed within the housing, and the temperature determination component is a temperature fuse. When an ambient temperature of the power converter reaches a preset temperature, the temperature determination component melts to indicate that the power converter is used under the abnormal ambient temperature. Accordingly, the ambient temperature of the power converter can be determined to be abnormal.

Abstract: A columnar metal component includes a first main surface, and a second main surface on an opposite side to the first main surface. The first main surface includes a first groove. The metal component includes a through-hole penetrating the metal component from the first main surface to the second main surface.

Abstract: A sample holder includes a base comprising a support structure and a printed circuit board (PCB) in contact with the base. The PCB includes: a dielectric; a front-surface ground (GND) formed on a front surface of the dielectric; a back-surface GND formed on a back surface of the dielectric; a through hole penetrating from the front-surface GND to the back-surface GND, the through hole in which a chip is disposed, and a conductor that electrically connects the front-surface GND and the back-surface GND on an end face of the through hole. At least a part of the base below the through hole has a cavity. The support structure that supports a surface of the chip and is electrically connected to the base. The support structure is disposed in the cavity.

Abstract: A method of forming a flexible circuit, including providing a flexible flat cable with a first surface and a second surface. The first surface of the flexible flat cable is diametrically opposed to the second surface. A dispensing apparatus including a nozzle is further provided, and an extruded material is dispensed through the nozzle onto the first surface of the flexible flat cable. The extruded material is shaped into a pattern and cured onto the first surface of the flexible flat cable.

Abstract: A circuit board having excellent reliability of connection between layers while being capable of achieving a compact and low-profile electronic device. In the circuit board has an LC circuit built therein with the use of a glass core having a through hole, a conductor layer formed in the through hole is connected to a wiring pattern formed on one surface of the glass core, and connected to a wiring pattern formed on the other surface of the glass core, with the conduction layer projected from the surface of the glass core. Thus, the area of contact between the conduction layer and the through hole is increased, thus making it possible to prevent the reliability of connection between layers in the through hole from being decreased, even when the glass core is reduced in thickness for achieving a low-profile device.