Abstract: An insulated conductor including: at least one electrical conductor; and, an insulating coating covering said electrical conductor, having n layer(s), “n” being an integer greater than or equal to 1, the nth layer being the outermost layer having a pseudo-amorphous composition Cn including at least 50% by weight of a polyaryletherketone. A process for manufacturing the insulated conductor, a heat-welding process using two sections of insulated conductor, and a coil capable of being obtained by heat-welding a winding of the insulated conductor.

Abstract: An HV busbar configured to connect a plurality of battery modules to each other, has a conductor including a first metal plate and a second metal plate and an insulative resin coating layer on the outer circumferential surface of the conductor, wherein a first metal constituting the first metal plate and second metals having a lower melting temperature than the first metal are mixed in the second metal plate in the state in which the second metals are dispersed.

Abstract: A wiring substrate includes an insulating layer, a conductor layer formed on a surface of the insulating layer and including a conductor pad, a covering layer formed on the insulating layer and covering a portion of the insulating layer, an optical waveguide positioned on the surface of the insulating layer and including a core part, and a conductor post including plating metal and formed on the conductor pad such that the conductor post is penetrating through the covering layer and connected to a component. The insulating layer has a component region covered by the component when the component is connected to the conductor post, the core part has an end surface facing the opposite direction with respect to the insulating layer and exposed in the component region and a distance between the end surface and the surface of the insulating layer is greater than a thickness of the covering layer.

Abstract: An LED circuit board structure includes first color LEDs, second color LEDs, third color LEDs, a carrier board, first testing wires, first connecting wires, second testing wires and second connecting wires. Each of the first testing wire is located at the carrier board and electrically connects two first color LEDs in a pixel-front-side-pattern region in parallel. The first connecting wire electrically connects two first testing wires in adjacent two pixel-front-side-pattern regions. Each of the second testing wire is located at the carrier board and electrically connects two second color LEDs in a pixel-front-side-pattern region in parallel. The second connecting wire electrically connects two second testing wires in adjacent two pixel-front-side-pattern regions.

Abstract: An apparatus is described. The apparatus includes a printed circuit board (PCB) dual in-line memory module (DIMM) connector having ejectors. The ejectors have a small enough vertical profile to permit unbent liquid cooling conduits to run across the DIMM's semiconductor chips.

Abstract: Enclosure assemblies employed in electrical installations, including those employed in solar power installations, which conform to NEMA 3R type rating defined by National Electrical Manufacturers Association (“NEMA”) are disclosed. In some embodiments, a base of a housing of an enclosure assembly having a seal-receiving groove, fastener retainers, fastener walls, a moisture diverter, attachment points; and conductor pass-through apertures is disclosed. In some embodiments, a base of a housing of an enclosure assembly having a forward portion with a forward fastener retainer and forward attachment points; an aft portion of the base having an aft fastener retainer and aft and attachment points, the groove located between the forward and aft portions, a moisture diverter located between the forward and aft portions; and drainage channels encompassing the forward and aft portions is disclosed. In some embodiments, a method for pre-positioning a fastener in a housing of an enclosure assembly is disclosed.

Abstract: One object is to be able to easily attach an elastic waterproofing member to a wiring member. A wiring module (10) includes a wiring member (20), and an elastic waterproofing member (30, 130, 230, 330) in which a penetration accommodating portion (32) is formed that is capable of accommodating a portion in a longitudinal direction of the wiring member. The elastic waterproofing member includes a first split waterproofing member (36, 136) and a second split waterproofing member (38, 138), the first split waterproofing member and the second split waterproofing member are obtained by splitting the elastic waterproofing member so as to longitudinally split the penetration accommodating portion, and the first split waterproofing member and the second split waterproofing member are kept in a joined state, with a portion in a longitudinal direction of the wiring member accommodated in the penetration accommodating portion.

Abstract: A multilayer ceramic capacitor includes a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode.

Abstract: An electrical wire arrangement structure includes: a base member; and an electrical wire group including four or more electrical wires, wherein the electrical wire group includes a parallel arrangement part fixed in a parallel state by the base member, and in the parallel arrangement part, an average value of sizes between the electrical wires in a central part region in a width direction is larger than an average value of sizes between the electrical wires in both side part regions in a width direction.

Abstract: A patterned article includes a unitary polymeric layer and a plurality of electrically conductive elements embedded at least partially in the unitary polymeric layer. Each electrically conductive element includes a conductive seed layer having a top major surface and an opposite bottom major surface in direct contact with the unitary polymeric layer, and includes a metallic body disposed on the top major surface of the conductive seed layer. The metallic body has a bottom major surface and at least one sidewall. The bottom major surface contacts the conductive seed layer. Each sidewall is in direct contact with the unitary polymeric layer and extends from the bottom major surface of the metallic body toward or to, but not past, a top major surface of the unitary polymeric layer. The conductive elements may be electrically isolated from one another. Processes for making the patterned article are described.

Abstract: A wire harness for connecting a vehicle body-side device and a wheel-side device includes: a first wiring member; and a second wiring member that has higher flex resistance than the first wiring member. A first outer path length of the first wiring member is defined by a length of a first outer path portion of the first wiring member. A second outer path length of the second wiring member is defined by a length of a second outer path portion of the second wiring member. The first outer path length of the first wiring member is greater than the second outer path length of the second wiring member.

Abstract: This electrical equipment device includes a housing storing an electronic component in an internal space thereof, and includes a vent hole through which an outside and an inside of the housing communicate with each other. The vent hole is formed inside a wall of the housing. One end side of the vent hole has a first opening communicating with the outside of the housing on a gravity-direction lower side. Another end side of the vent hole has a second opening communicating with the inside of the housing on a gravity-direction upper side. At the second opening, a waterproof vent film is provided to close the second opening.

Abstract: A shielded communication cable. The shielded communication cable includes a pair of insulated wires twisted with each other containing a conductor and an insulation covering which covers the conductor and has the relative dielectric constant of 2.5 or lower, a braided shield which covers the pair of insulated wires, a film-shaped shield which contains a metal film and longitudinally laps the pair of the insulated wires over the braided shield and a jacket having an inner diameter of 3.5 mm or smaller which covers the film-shaped shield. The pair of insulated wires are twisted with each other with a twist pitch of 30 times of an outer diameter of each of the insulated wires or smaller, and the shielded communication cable has a characteristic impedance in range of 100±5?.

Abstract: The invention relates to a method of connecting electrical wires, conductors, or connections together by rotating the connector ends in an enclosure to tightly twist the wire ends together and also includes a clamping mechanism to prevent the wires from untwisting, becoming loose, or falling out of the enclosure. The present invention increases the holding ability of current rotating tools for electrical wires and connections.

Abstract: A circuit board includes a dielectric substrate, a signal line and a pair of ground wires. The dielectric substrate includes a base and an elevated platform protruding from an upper surface of the base. The signal line is conformally disposed on the dielectric substrate and includes a first segment disposed on an upper surface of the elevated platform, a second segment extending on the upper surface of the base, and a third segment disposed on a sidewall of the elevated platform and connecting the first segment and the second segment. The pair of ground wires are disposed on the dielectric substrate and are spaced apart from the signal line. A projection of the second segment of the signal line on the upper surface of the base partly overlaps projections of the pair of ground wires on the upper surface of the base.

Abstract: A junction box and an electronic device assembly system relate to the field of infrastructure technologies. The junction box includes an accommodation chamber configured to accommodate a wire and a sealing cap configured to seal the wire. An upper cover of the accommodation chamber is provided with a first through-hole for wiring, a base of the accommodation chamber is provided with a second through-hole for wiring, and a side wall of the accommodation chamber is provided with one or more operation windows. The upper cover of the accommodation chamber is provided with a first installation position for installing to a pole, and the base of the accommodation chamber is provided with a second installation position for installing to an electronic device. The sealing cap includes a third through-hole for wiring and a fourth through-hole for wiring.

Abstract: A resin multilayer substrate that includes a substrate having a plurality of laminated resin layers containing a norbornene-based polymer. A resin layer has an altered portion altered by a surface treatment and formed at an interface with a resin layer adjacent thereto in a lamination direction. An adhesion at an interface having the altered portion is greater than an adhesion at an interface with a non-altered portion.

Abstract: A circuit board and a manufacturing method therefor. The circuit board includes a substrate and a plurality of traces arranged at intervals on the substrate. Each trace includes a seed layer located on one surface of the substrate, a first copper layer located on the surface of the seed layer away from the substrate, and a second copper layer plated on one surface of the substrate. The second copper layer covers the seed layer and the first copper layer. The ratio of the thickness of each trace to the space between any two adjacent traces is greater than 1. The thickness of the second copper layer in the thickness direction of the substrate is greater than the thickness of the second copper layer in a direction perpendicular to the thickness direction of the substrate.

Abstract: A fitting assembly may seal a wire within a tube to inhibit ingress of fluid outside the tube into the tube and into contact with the wire. The fitting assembly may optionally include a body and a nut, with a part of the nut received within the body. The nut may be threadedly connected to the body, such that threading and/or unthreading the nut translates the part of the nut within the body. Optionally, the nut may include a ring extension that is received within a ring cavity of the body, and an interfacing between the ring extension and the ring cavity may create a seal to inhibit leaking of the fluid past the seal. A method of sealing a wire within a tube may comprise positioning a tube with a wire therein within such a fitting assembly.

Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers alternately stacked, and an outer electrode electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite to each other in a stacking direction, first and second side surfaces opposite to each other in a width direction, and first and second end surfaces opposite to each other in a length direction. The outer electrode includes first outer electrodes disposed on the first and second end surfaces, and at least one second outer electrode disposed on at least one of the first and second side surfaces. The at least one second outer electrode is directly connected to the inner electrodes at positions spaced away from the at least one of the first or second side surface toward the inside of the multilayer body.