Patents Examined by Travis M Figg
  • Patent number: 11059742
    Abstract: A flexible substrate with a high optical transparency (>80% from 400 to 750 nm) that is retained after exposure to 300° C., near-zero birefringence (<±0.001), and a relatively low CTE (<60 ppm/° C.) is disclosed. The substrate may be manufactured as single layer, polyimide films and as a multi-layer laminate comprising a polyimide layer and a thin glass layer. The polyimides may include alicyclic dianhydrides and aromatic, cardo diamines. The films formed of the polyimides can serve as flexible substrates for optical displays and other applications that require their unique combination of properties.
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: July 13, 2021
    Assignee: Akron Polymer Systems, Inc.
    Inventors: Limin Sun, Dong Zhang, Jiaokai Jing, Frank W. Harris, Zhikuan Lu, Xiaoliang Zheng
  • Patent number: 11059954
    Abstract: A composition for preparing an article including a polyimide or poly(imide-amide) copolymer, the composition including (1) at least one of (i) a polyimide, a polyamic acid, or a poly(imide-amic acid) including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2; and (ii) a poly(imide-amide) copolymer, a poly(amic acid-amide) copolymer, or a poly(imide and amic acid-amide) copolymer including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, and a structural unit represented by Chemical Formula 3, and (2) a compound having a maximum absorption wavelength at about 570 nm or more in a visible radiation region: wherein in Chemical Formulae 1 to 3, A, B, D, and E are the same as defined in the detailed description.
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: July 13, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: A Ra Jo, Chanjae Ahn, Byunghee Sohn, Kyeong-sik Ju
  • Patent number: 11034904
    Abstract: Briquet designs that facilitate close packing and improve burn efficiency are provided herein. Such designs can include scaled down briquet size and close packing shapes, which can include pyramidal shaped portions, such as rectangular pyramids and tetrahedron shapes, as well as oblate spheroid and hexoid shapes, to facilitate closer random packing when the briquets are randomly arranged in a pile when poured from a bag. Some briquet shapes can further include special surface features, such as flattened or rounded portions or depressions, such as dimples, that reduce volume without increasing the bulk density in order to further improve burn performance and efficiency.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: June 15, 2021
    Assignee: The Clorox Company
    Inventors: Joshua Long, Stephen Fisher, Donald Swatling, Stefan Brown
  • Patent number: 11021606
    Abstract: In a first aspect, a multilayer film includes a first outer layer including a first thermoplastic polyimide, a core layer including a polyimide, and a second outer layer including a second thermoplastic polyimide. The polyimide of the core layer includes a first aromatic dianhydride including 3,3?,4,4?-biphenyl tetracarboxylic dianhydride and a first aromatic diamine including p-phenylenediamine. The multilayer film has a total thickness in a range of from 5 to 150 ?m. A thickness of the core layer is in a range of from 35 to 73% of the total thickness of the multilayer film. A minimum peel strength for at least one of the first and second outer layers, when adhered to copper foil and tested following ASTM method IPC-TM-650, method No. 2.4.9B, is greater than 0.9 kgf/cm (0.88 N/mm). In a second aspect, a metal-clad laminate includes the multilayer film of the first aspect and a first metal layer adhered to an outer surface of the first outer layer of the multilayer film.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: June 1, 2021
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Kostantinos Kourtakis, Rosa Irene Gonzalez, Herbert W Lim
  • Patent number: 11013133
    Abstract: This invention relates to elastomeric coatings for electronics. Disclosed is a electronic device comprising a substrate layer, a conductive layer and an encapsulant layer. The encapsulant layer comprises at least a butyl rubber material. The butyl rubber encapsulant prevents a change in resistivity of the conductive layer following exposure to nitric acid vapour for 12 hours or hydrochloric acid vapour for 10 hours.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: May 18, 2021
    Assignees: ARLANXEO SINGAPORE PTE. LTD, The University of Windsor
    Inventors: Lorenzo Ferrari, Gregory J. E. Davidson, Tricia Breen Carmichael
  • Patent number: 11001672
    Abstract: Embodiments of the present disclosure include, a dianhydride monomer, a polyimide, a method of making a dianhydride, a method of making a polyimide, and the like. Embodiments of the present disclosure can be used in membrane-based gas separation applications.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: May 11, 2021
    Assignee: KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Ingo Pinnau, Bader Saleh Ghanem, Mahmoud Atef Abdulhamid
  • Patent number: 11001685
    Abstract: Protein-protein imprinting of silk fibroin is introduced as a rapid, high-fidelity, and/or high-throughput method for the fabrication of nanoscale structures in silk films, through controlled manipulation of heat and/or pressure. High resolution imprinting on conformal surfaces is also demonstrated.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: May 11, 2021
    Assignee: Tufts University
    Inventors: Fiorenzo G. Omenetto, David L. Kaplan, Mark A. Brenckle
  • Patent number: 10995237
    Abstract: A polyimide precursor solution is provided. The polyimide precursor solution includes 100 parts by weight of a fully aromatic polyamic acid, from 5 to 20 parts by weight of silica particles, from 5 to 80 parts by weight of an alkoxysilane, and from 40 to 80 parts by weight of a solvent.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: May 4, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Dong-Sen Chen, Yu-Ju Kuo, Chyi-Ming Leu
  • Patent number: 10974478
    Abstract: An interleaved layer construction of a composite panel and a composite plank constructed of three sub-planks that are adhered together and secured to the panel stiffen and strengthen the panel.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: April 13, 2021
    Assignee: The Boeing Company
    Inventor: Forouzan Behzadpour
  • Patent number: 10968325
    Abstract: A method of making large ultrathin free-standing polymer films without use of a sacrificial layer includes the steps of providing a substrate, applying a polyelectrolyte material to said substrate, applying a polymer material onto said substrate and onto said polyelectrolyte material, and directly delaminating said polymer material from said substrate and said polyelectrolyte to produce the ultrathin free-standing polymer film.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: April 6, 2021
    Assignees: Lawrence Livermore National Security, LLC, General Atomics
    Inventors: Michael Stadermann, Salmaan H. Baxamusa, William C. Floyd, III, Philip E. Miller, Tayyab I. Suratwala, Anatolios A. Tambazidis, Kelly Patricia Youngblood, Chantel Aracne-Ruddle, Art J. Nelson, Maverick Chea, Shuali Li
  • Patent number: 10934406
    Abstract: A prepreg tape in which reinforcing fiber bundles are impregnated with a thermosetting resin composition, wherein the prepreg tape has a tack value measured at 23° C. at a plunger push pressure of 90 kPa of 5-40 kPa, a tack value measured at 45° C. and a plunger push pressure of 150 kPa of 35-100 kPa, and a drape value at 23° C. of 10-40°, and includes unidirectional fibers arranged along the direction of length of the prepreg tape.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: March 2, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Satoshi Okamoto, Yukihiro Harada, Atsushi Nohara
  • Patent number: 10932560
    Abstract: A hollow table top comprises a top plate and a bottom plate stacked together. The edge of the bottom surface of the table top is disposed with a metal frame. The edge of the top plate is disposed with a downwardly extending top plate side. The metal frame is disposed with a protruding portion in the horizontal direction extending out of the top plate side. The protruding portion protects the joint of the top plate and the bottom plate. The external edge of the table top has double-layer appearance.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: March 2, 2021
    Assignee: NEW-TEC INTEGRATION (XIAMEN) CO., LTD.
    Inventor: Luhao Leng
  • Patent number: 10933568
    Abstract: To provide a resin molding and a method for producing the same. A resin molding in which two types of substrates differing in thermal shrinkage are connected together, wherein the thermal shrinkage of a connection part of the two types of substrates is a value between the respective thermal shrinkages of the two types of substrates. It is preferred that the connection part be constituted of an end part of any one substrate of the two substrates. More specifically, there can be adopted an embodiment in which one substrate is a plate-like substrate including reinforcing fibers and a first thermoplastic resin binding the reinforcing fibers to each other and the other substrate is an injection-molded member connected in the plate face direction of the one substrate, wherein the thermal shrinkage of the other substrate is large as compared to the thermal shrinkage of the one substrate.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: March 2, 2021
    Assignee: TOYOTA BOSHOKU KABUSHIKI KAISHA
    Inventor: Hideo Kamiya
  • Patent number: 10913183
    Abstract: To provide a process for producing a package for mounting a semiconductor element by using a mold, said a package for mounting a semiconductor element comprising a substrate having a mounting surface for mounting a semiconductor element and a packaging body formed from a cured product of a curable resin and having a frame-shaped portion surrounding the mounting surface, and the package has a concave portion formed by the mounting surface and the packaging body, which allows it to prevent resin burrs without occurrence of dents or damage of a substrate and failure in releasing from a mold, and to provide a mold release film to be suitably used for the production process.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: February 9, 2021
    Assignee: AGC Inc.
    Inventor: Wataru Kasai
  • Patent number: 10907019
    Abstract: A synthetic polymer film (34A), (34B) having a surface which has a plurality of raised portions (34Ap), (34Bp), wherein a two-dimensional size of the plurality of raised portions (34Ap), (34Bp) is in a range of more than 20 nm and less than 500 nm when viewed in a normal direction of the synthetic polymer film (34A), (34B), the surface having a microbicidal effect, and a concentration of a total of a nitrogen element which is a constituent of a primary amine and a nitrogen element which is a constituent of a secondary amine is not less than 0.29 at %, and a number of moles of an ethylene oxide unit included in one gram is more than 0.0020 and not more than 0.0080.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: February 2, 2021
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Takahiro Nakahara, Miho Yamada, Ken Atsumo, Kiyoshi Minoura
  • Patent number: 10876201
    Abstract: A method for manufacturing a broadband fluorescence amplification assembly comprising the steps of providing a vertically aligned carbon nanotube (“VACNT”) substrate that has been treated with a plasma and at least partially coated with a metal coating and a support structure, and supporting the VACNT substrate by the support structure. The support structure can include one of quartz or glass. The method can also include the steps of cleaning the support structure with an alcohol solution and/or exposing the support structure to one of a surface cleaning plasma or ozone. The method can further comprise the step of adhering the VACNT substrate to the support structure, wherein the step of adhering can include applying an adhesive material to at least a portion of the support structure. Additionally, the method can include the step of treating the VACNT substrate and the support structure with the plasma.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: December 29, 2020
    Assignee: IRONWOOD 12 LLC
    Inventor: Christopher J. Fleming
  • Patent number: 10877607
    Abstract: The present invention is aimed at providing a laminated base material capable of conveniently attaining the enhancement in lightness of a decorating layer without requiring a thickened film thickness and an increased number of complicated steps. The present invention provides a laminated base material including a substrate (A), and a layer (B) and a layer (C) sequentially laminated on a surface of the substrate (A), wherein a refractive index nA of the substrate (A) and a refractive index nB of the layer (B) satisfy the relationship of 0.6?nA?nB?0.1, and the layer (C) contains a pigment.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: December 29, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Akihiro Ishikawa, Mitsuhito Suwa, Chika Hibino
  • Patent number: 10843437
    Abstract: The invention is intended to obtain a composite material suitable for mass production or the like by shortening the molding time while obtaining the advantages of the composite materials described above, and intended to provide a composite material which has a short molding time by the use of a thermoplastic resin as a matrix and is excellent in balance among stiffness, strength, and thermal conductivity. A carbon-fiber-reinforced thermoplastic-resin composite material comprising: a layer (I) containing a carbon fiber (A) aligned in one direction and a thermoplastic resin (C-1); and a layer (II) containing a carbon fiber (B) aligned in one direction and a thermoplastic resin (C-2), wherein the carbon fiber (A) has a higher elastic modulus than the carbon fiber (B).
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: November 24, 2020
    Assignee: Mitsubishi Chemical Corporation
    Inventor: Osamu Okunaka
  • Patent number: 10842690
    Abstract: An absorbent core for absorbent articles such as diapers comprising a core wrap comprising a top side and a bottom side, an absorbent material between the top side and the bottom side of the core wrap, a first and second longitudinally-extending channel-forming areas disposed on opposite sides of the longitudinal axis and substantially free of absorbent material preferably through which the top side of the core wrap is preferably attached to the bottom side of the core wrap. The core has a central absorbent zone between the first and the second channel-forming areas and a first and second lateral absorbent zones disposed laterally outwardly. The basis weight of the absorbent material in the central absorbent zone is higher than the basis weight of the absorbent material in each of the lateral absorbent zones for at least a first transversal section (S1). This relation is inverted along a second transversal section (S2) of the core.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: November 24, 2020
    Assignee: The Procter & Gamble Company
    Inventors: Ernesto Gabriel Bianchi, Bruno Johannes Ehrnsperger, Joerg Endres, Julien René Garcia
  • Patent number: 10821712
    Abstract: Disclosed are methods for making a multilayer blown film comprising a propylene-based elastomer in the skin and/or subskin layers.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: November 3, 2020
    Assignee: ExxonMobil Chemical Patents Inc.
    Inventors: Haiyin Hua, Bin Zhao, Achiel J. M. Van Loon